40V N Channel Power MOSFET Siliup SP40N02AGNK with Split Gate Trench Technology and Low Gate Charge

Key Attributes
Model Number: SP40N02AGNK
Product Custom Attributes
Drain To Source Voltage:
40V
Configuration:
-
Current - Continuous Drain(Id):
200A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.2mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Reverse Transfer Capacitance (Crss@Vds):
1.208nF
Number:
1 N-channel
Pd - Power Dissipation:
120W
Input Capacitance(Ciss):
3.485nF@40V
Gate Charge(Qg):
57nC@10V
Mfr. Part #:
SP40N02AGNK
Package:
PDFN-8L(5x6)
Product Description

Product Overview

The SP40N02AGNK is a 40V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd., designed for power switching applications. It features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. This MOSFET is 100% tested for single pulse avalanche energy and is suitable for PWM applications and DC-DC converters. It is available in a PDFN5X6-8L package.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP40N02AGNK
  • Device Code: 40N02AG
  • Technology: Split Gate Trench Technology
  • Channel Type: N-Channel
  • Package: PDFN5X6-8L

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Units
Product Summary
V(BR)DSS V(BR)DSS 40 V
RDS(on)TYP RDS(on) @10V 1.5 1.9 m
RDS(on)TYP RDS(on) @4.5V 2.4 3.2 m
ID ID (Tc=25, Silicon Limit) 170 A
ID ID (Tc=25, Package Limit) 120 A
ID ID (Tc=100) 80 A
Absolute Maximum Ratings
Drain-Source Voltage VDS 40 V
Gate-Source Voltage VGS 20 V
Pulsed Drain Current IDM 480 A
Single Pulse Avalanche Energy EAS 600 mJ
Power Dissipation PD (Tc=25) 110 W
Thermal Resistance Junction-to-Case RJC 1.14 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=250uA 40 V
Drain Cut-Off Current IDSS VDS=32V, VGS=0V, TJ=25 1 uA
Gate Leakage Current IGSS VGS=20V, VDS=0V 100 nA
Gate Threshold Voltage VGS(th) VGS=VDS, ID =250uA 1.0 1.8 2.5 V
Drain-Source ON Resistance RDS(ON) VGS=10V, ID=20A 1.5 1.9 m
Drain-Source ON Resistance RDS(ON) VGS=4.5V, ID=10A 2.4 3.2 m
Dynamic Characteristics
Input Capacitance Ciss VDS=20V, VGS=0V, f=1MHz 3485 pF
Output Capacitance Coss 1208 pF
Reverse Transfer Capacitance Crss 59 pF
Total Gate Charge Qg VDS=20V, VGS=10V, ID=85A 57 nC
Gate-Source Charge Qgs 9.5
Gate-Drain Charge Qg d 11
Switching Characteristics
Turn-On Delay Time td(on) VDD=20V, VGS=10V, RG=1.6, ID=85A 10 nS
Rise Time tr 3
Turn-Off Delay Time td(off) 35
Fall Time tf 4
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V 1.2 V
Maximum Body-Diode Continuous Current IS 120 A
Reverse Recovery Time Trr IS=40A, di/dt=100A/us, TJ=25 42 nS
Reverse Recovery Charge Qrr 37 nC
PDFN5X6-8L Package Information
Symbol Dimensions In Millimeters Dimensions In Inches
Min. Max. Min. Max.
A 0.900 1.000 0.035 0.039
A3 0.254REF. 0.010REF.
D 4.944 5.096 0.195 0.201
E 5.974 6.126 0.235 0.241
D1 3.910 4.110 0.154 0.162
E1 3.375 3.575 0.133 0.141
D2 4.824 4.976 0.190 0.196
E2 5.674 5.826 0.223 0.229
k 1.190 1.390 0.047 0.055
b 0.350 0.450 0.014 0.018
e 1.270TYP. 0.050TYP.
L 0.559 0.711 0.022 0.028
L1 0.424 0.576 0.017 0.023
H 0.574 0.726 0.023 0.029
10 12 10 12

2504101957_Siliup-SP40N02AGNK_C42403235.pdf

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