Sichainsemi S1M075120J2 Silicon Carbide Power MOSFET 1200V 39A Ideal for EV Battery Charging Systems

Key Attributes
Model Number: S1M075120J2
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
39A
RDS(on):
75mΩ@15V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
2.8V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
4.3pF
Pd - Power Dissipation:
169W
Input Capacitance(Ciss):
1.02nF
Gate Charge(Qg):
40nC
Mfr. Part #:
S1M075120J2
Package:
TO-263-7L
Product Description

Product Overview

The S1M075120J2 is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, IGBT-compatible driving voltage, and fully controllable dv/dt. Key benefits include reduced cooling requirements, improved efficiency, increased power density, and the ability to operate at higher system switching frequencies. This MOSFET is ideal for on-board chargers, EV battery chargers, booster/DC-DC converters, and switch mode power supplies.

Product Attributes

  • Brand: (Sichain Semiconductor)
  • Material: Silicon Carbide (SiC)
  • Certifications: Halogen free, RoHS compliant
  • Package Type: TO-263-7L

Technical Specifications

Type VDS (V) IDS (A) (TC = 25) RDS(ON), typ (m) (VGS = 15V, ID = 20A, TJ = 25) Tj,max () Marking Package
S1M075120J2 1200 39 75 175 S1M075120J2 TO263-7L
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+22 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+15 V Recommended operational values
ID Continuous drain current 39 A VGS = 15V, TC = 25C Fig.19
ID Continuous drain current 28 A VGS = 15V, TC = 100C
ID(pulse) Pulsed drain current 87 A Pulse width tP limited by Tj,max Fig.22
PD Power dissipation 169 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
Rth(j-c) Thermal resistance from junction to case 0.89 C/W Fig.21
Rth(j-a) Thermal resistance from junction to ambient 35 Not subject to production test. Parameter verified by design/characterization. 1
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 V VDS = VGS, ID = 5mA Fig.11
VGS(th) Gate threshold voltage 2.8 V VDS = VGS, ID = 5mA, TJ = 175C
VGS(th) Gate threshold voltage 3.6 V VDS = VGS, ID = 5mA
IDSS Zero gate voltage drain current 1 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 15V, VDS = 0V
RDS(on) Current drain-source on-state resistance 75 m VGS = 15V, ID = 20A Fig.4,5 ,6
RDS(on) Current drain-source on-state resistance 90 m VGS = 15V, ID = 20A, TJ = 175C
gfs Transconductance 9.7 S VDS = 20V, ID = 20A Fig.7
gfs Transconductance 9.9 S VDS = 20V, ID = 20A, TJ = 175C
Rg,int Internal gate resistance 1.5 VAC = 25mV, f = 1MHz
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 10A Fig.8,9, 10
VSD Diode forward voltage 3.5 V VGS = -4V, ISD = 10A TJ = 175C
Ciss Input capacitance 1020 pF VDS = 1000V, VGS = 0V TJ = 25C, VAC = 25mV f = 1MHz Fig.17,18
Coss Output capacitance 64
Crss Reverse capacitance 4.3
Eoss Coss stored energy 39 J Fig.16
Qgs Gate source charge 8.9 nC VDS = 800V, VGS = -4/+15V ID = 20A Fig.12
Qgd Gate drain charge 25
Qg Gate charge 40
Eon Turn on switching energy 110 J VDD = 800V, VGS = -4/+15V ID = 20A, Rg = 0 L = 120uH Fig.24
Eoff Turn off switching energy 23
tdon Turn on delay time 9.6 ns Fig.27
tr Rise time 7.8
tdoff Turn off delay time 14.8
tf Fall time 7.5
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 10A Fig.8,9, 10
VSD Diode forward voltage 3.5 V VGS = -4V, ISD = 10A TJ = 175C
IS Continuous diode forward current 36 A VGS = -4V, Tc = 25C Note1
trr Reverse recovery time 57 nS VR = 800V, VGS = -4V ID = 20A di/dt = 1100A/S TJ = 150C
Qrr Reverse recovery charge 162 nC
Irrm Peak reverse recovery current 5.9 A

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