Siliup SP40N03AGNK Power MOSFET 40V N Channel optimized for DC DC converters and PWM applications

Key Attributes
Model Number: SP40N03AGNK
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
110A
Operating Temperature -:
-55℃~+150℃
RDS(on):
2.7mΩ@10V;3.2mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
1.5V@250uA
Reverse Transfer Capacitance (Crss@Vds):
37pF
Number:
1 N-channel
Input Capacitance(Ciss):
1.965nF
Output Capacitance(Coss):
425pF
Pd - Power Dissipation:
75W
Gate Charge(Qg):
57nC@10V
Mfr. Part #:
SP40N03AGNK
Package:
PDFNWB-8L(5x6)
Product Description

Product Overview

The SP40N03AGNK is a 40V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. It features fast switching, low gate charge, and low RDS(on) due to its advanced split gate trench technology. This MOSFET is designed for power switching applications, PWM applications, and DC-DC converters. It has undergone 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP40N03AGNK
  • Device Code: 40N03AG
  • Channel Type: N-Channel
  • Technology: Advanced Split Gate Trench Technology

Technical Specifications

Parameter Symbol Rating Units Test Condition
Drain-Source Voltage V(BR)DSS 40 V
RDS(on) Typical RDS(on)TYP 2.7 m@10V
RDS(on) Typical RDS(on)TYP 3.2 m@4.5V
Continuous Drain Current ID 110 A
Drain-Source Voltage VDS 40 V (Ta=25unless otherwise noted)
Gate-Source Voltage VGS 20 V (Ta=25unless otherwise noted)
Continuous Drain Current (Tc=25 ID 110 A (Ta=25unless otherwise noted)
Continuous Drain Current (Tc=100) ID 75 A (Ta=25unless otherwise noted)
Pulsed Drain Current IDM 440 A (Ta=25unless otherwise noted)
Single Pulse Avalanche Energy EAS 196 mJ (Ta=25unless otherwise noted)
Power Dissipation (Tc=25 PD 70 W (Ta=25unless otherwise noted)
Thermal Resistance Junction-to-Case RJC 1.79 /W (Ta=25unless otherwise noted)
Storage Temperature Range TSTG -55 to 150 (Ta=25unless otherwise noted)
Operating Junction Temperature Range TJ -55 to 150 (Ta=25unless otherwise noted)
Drain-Source Breakdown Voltage BVDSS 40 V VGS=0V , ID=250uA
Drain Cut-Off Current IDSS 1 uA VDS=32V , VGS=0V , TJ=25
Gate Leakage Current IGSS 100 nA VGS=20V , VDS=0V
Gate Threshold Voltage VGS(th) 1.0 to 2.5 V VGS=VDS , ID =250uA
Drain-Source ON Resistance RDS(ON) 2.7 to 3.5 m VGS=10V , ID=20A
Drain-Source ON Resistance RDS(ON) 3.2 to 4.3 m VGS=4.5V , ID=10A
Input Capacitance Ciss 1965 pF VDS=20V , VGS=0V , f=1MHz
Output Capacitance Coss 425 pF VDS=20V , VGS=0V , f=1MHz
Reverse Transfer Capacitance Crss 37 pF VDS=20V , VGS=0V , f=1MHz
Total Gate Charge Qg 57 nC VDS=20V , VGS=10V , ID=85A
Gate-Source Charge Qgs 9.5 - VDS=20V , VGS=10V , ID=85A
Gate-Drain Charge Qg d 11 - VDS=20V , VGS=10V , ID=85A
Turn-On Delay Time td(on) 10 nS VDD=20V, VGS=10V, RG=1.6, ID=85A
Rise Time tr 3 nS VDD=20V, VGS=10V, RG=1.6, ID=85A
Turn-Off Delay Time td(off) 35 nS VDD=20V, VGS=10V, RG=1.6, ID=85A
Fall Time tf 4 nS VDD=20V, VGS=10V, RG=1.6, ID=85A
Source-Drain Diode Forward Voltage VSD 1.2 V IS = 1A, VGS = 0V
Maximum Body-Diode Continuous Current IS 110 A
Reverse Recovery Time Trr 37 nS IS=20A, di/dt=100A/us, TJ=25
Reverse Recovery Charge Qrr 12 nC IS=20A, di/dt=100A/us, TJ=25

Package Information (PDFN5X6-8L)

Symbol Dimensions In Millimeters Dimensions In Inches
Min. Max. Min. Max.
A 0.900 1.000 0.035 0.039
A3 0.254REF. 0.010REF.
D 4.944 5.096 0.195 0.201
E 5.974 6.126 0.235 0.241
D1 3.910 4.110 0.154 0.162
E1 3.375 3.575 0.133 0.141
D2 4.824 4.976 0.190 0.196
E2 5.674 5.826 0.223 0.229
k 1.190 1.390 0.047 0.055
b 0.350 0.450 0.014 0.018
e 1.270TYP. 0.050TYP.
L 0.559 0.711 0.022 0.028
L1 0.424 0.576 0.017 0.023
H 0.574 0.726 0.023 0.029
10 12 10 12

Order Information

Device Package Unit/Tape
SP40N03AGNK PDFN5X6-8L 5000

2504101957_Siliup-SP40N03AGNK_C22385419.pdf

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