110V N Channel Power MOSFET Siliup SP011N02AGHTF Designed for Power Switching and DC DC Converter Applications

Key Attributes
Model Number: SP011N02AGHTF
Product Custom Attributes
Drain To Source Voltage:
110V
Current - Continuous Drain(Id):
300A
RDS(on):
1.9mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3V
Reverse Transfer Capacitance (Crss@Vds):
33pF
Number:
1 N-channel
Output Capacitance(Coss):
1.946nF
Input Capacitance(Ciss):
12.22nF
Pd - Power Dissipation:
310W
Gate Charge(Qg):
198nC@10V
Mfr. Part #:
SP011N02AGHTF
Package:
TO-247
Product Description

Product Overview

The SP011N02AGHTF is a 110V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. It features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. This MOSFET is 100% tested for single pulse avalanche energy and is suitable for power switching applications, DC-DC converters, and power management systems. It comes in a TO-247 package.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP011N02AGHTF
  • Technology: Advanced Split Gate Trench Technology
  • Channel Type: N-Channel
  • Package: TO-247 (Pinout: 1:G, 2:D, 3:S)
  • Material: Silicon (implied by "Siliup" and "Semiconductor")

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
Drain-Source Voltage V(BR)DSS 110 V
RDS(on) RDS(on)TYP @10V 1.9 m
Continuous Drain Current ID 300 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25, unless otherwise noted) 110 V
Gate-Source Voltage VGS (Ta=25, unless otherwise noted) 20 V
Continuous Drain Current ID (Tc=25) 300 A
Continuous Drain Current ID (Tc=100) 200 A
Pulsed Drain Current IDM 1200 A
Single Pulse Avalanche Energy EAS 1956 mJ
Power Dissipation PD (Tc=25) 310 W
Thermal Resistance Junction-to-Case RJC 0.4 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=250uA 110 - - V
Drain Cut-Off Current IDSS VDS=80V, VGS=0V, TJ=25 - - 1 A
Gate Leakage Current IGSS VGS=20V, VDS=0V - - 100 nA
Gate Threshold Voltage VGS(th) VGS=VDS, ID =250uA 2 3 4 V
Drain-Source ON Resistance RDS(ON) VGS=10V, ID=20A - 1.9 2.5 m
Dynamic Characteristics
Input Capacitance Ciss VDS=50V, VGS=0V, f=1MHz - 12220 - pF
Output Capacitance Coss VDS=50V, VGS=0V, f=1MHz - 1946 - pF
Reverse Transfer Capacitance Crss VDS=50V, VGS=0V, f=1MHz - 33 - pF
Total Gate Charge Qg VDS=50V, VGS=10V, ID=125A - 198 - nC
Gate-Source Charge Qgs VDS=50V, VGS=10V, ID=125A - 51 -
Gate-Drain Charge Qg d VDS=50V, VGS=10V, ID=125A - 37 -
Switching Characteristics
Turn-On Delay Time td(on) VDD=50V, VGS=10V, RG=1.6, ID=125A - 25 - nS
Rise Time tr VDD=50V, VGS=10V, RG=1.6, ID=125A - 75 -
Turn-Off Delay Time td(off) VDD=50V, VGS=10V, RG=1.6, ID=125A - 89 -
Fall Time tf VDD=50V, VGS=10V, RG=1.6, ID=125A - 29 -
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 300 A
Reverse Recovery Time Trr IS=50A, di/dt=100A/us, TJ=25 - 96 - nS
Reverse Recovery Charge Qrr IS=50A, di/dt=100A/us, TJ=25 - 228 - nC
Package Outline Dimensions (TO-247)
Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max.
A 4.850 - 5.150 0.191 - 0.200
A1 2.200 - 2.600 0.087 - 0.102
b 1.000 - 1.400 0.039 - 0.055
b1 2.800 - 3.200 0.110 - 0.126
b2 1.800 - 2.200 0.071 - 0.087
c 0.500 - 0.700 0.020 - 0.028
c1 1.900 - 2.100 0.075 - 0.083
D 15.450 - 15.750 0.608 - 0.620
E1 3.500 REF. 0.138 REF.
E2 3.600 REF. 0.142 REF.
L 40.900 - 41.300 1.610 - 1.626
L1 24.800 - 25.100 0.976 - 0.988
L2 20.300 - 20.600 0.799 - 0.811
7.100 - 7.300 0.280 - 0.287
e 5.450 TYP. 0.215 TYP.
H 5.980 REF. 0.235 REF.
h 0.000 - 0.300 0.000 - 0.012

2506271720_Siliup-SP011N02AGHTF_C49257251.pdf

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