Durable N channel MOSFET Slkor SL9N150T with Very Low Intrinsic Capacitances and High Speed Switching

Key Attributes
Model Number: SL9N150T
Product Custom Attributes
Drain To Source Voltage:
1.5kV
Current - Continuous Drain(Id):
9A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.5Ω@10V,4A
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
25pF@25V
Number:
1 N-channel
Pd - Power Dissipation:
350W
Input Capacitance(Ciss):
3.15nF@25V
Gate Charge(Qg):
85nC@10V
Mfr. Part #:
SL9N150T
Package:
TO-247
Product Description

Product Overview

The SL9N150T is a high-performance N-channel MOSFET designed for demanding switching applications. It features 100% avalanche tested, avalanche ruggedness, minimized gate charge, very low intrinsic capacitances, high speed switching, and very low on-resistance. Ideal for use in welders, UPS systems, PV inverters, and general switching applications.

Product Attributes

  • Brand: SLKormicro
  • Model: SL9N150T

Technical Specifications

Parameter Symbol Test Conditions Min Typ Max Unit
Electrical Ratings
Drain-source voltage (VGS = 0) VDS 1500 V
Gate- source voltage VGS 30
Drain current (continuous) at TC = 25 C ID 9 A
Drain current (continuous) at TC = 100 C ID 6 A
Drain current (pulsed) IDM 40
Total dissipation at TC = 25 C PTOT 350 W
Derating factor 2.56 W/
Operating junction temperature TJ -55 150
Storage temperature Tstg -55 150
Thermal Data
Thermal resistance junction-case max Rthj-case 0.39 W/
Thermal resistance junction-ambient max Rthj-amb 50
Maximum lead temperature for soldering purpose TJ 300
Avalanche Characteristics
Avalanche current, repetitive or not-repetitive (pulse width limited by TJ max) IAR 8 A
Single pulse avalanche energy (starting TJ = 25 C, ID = IAR, VDD = 50 V) EAS 800 mJ
Electrical Characteristics (Tvj = 25C unless otherwise specified)
On /off states
Drain-source breakdown voltage V(BR)DSS ID = 1 mA, VGS = 0 1500 V
Zero gate voltage drain current (VGS = 0) IDSS VDS = Max rating 10 A
Zero gate voltage drain current (VGS = 0) IDSS VDS=Max rating, TC=125 C 500 A
Gate-body leakage current (VDS = 0) IGSS VGS = 30 V 100 nA
Gate threshold voltage VGS(th) VDS = VGS, ID = 250 A 3 4 5 V
Static drain-source on resistance RDS(on) VGS = 10V, ID = 4A 2.9 3.5
Dynamic
Forward transconductance gfs VDS = 15 V, ID = 4 7 S
Input capacitance Ciss VDS=25V,f=1MHz,VGS=0 3150 pF
Output capacitance Coss VDS=25V,f=1MHz,VGS=0 300 pF
Reverse transfer capacitance Crss VDS=25V,f=1MHz,VGS=0 25 pF
Equivalent Output capacitance Coss eq. VGS=0,VDS=0 to 1200V 12
Gate input resistance Rg f=1MHz Gate DC Bias=0 Test signal level=20mV open drain 2.2
Total gate charge Qg VDD=1200V,ID=8A VGS=10V 85 nC
Gate-source charge Qgs VDD=1200V,ID=8A VGS=10V 14 nC
Gate-drain charge Qgd VDD=1200V,ID=8A VGS=10V 48 nC
Switching times
Turn-on delay time td(on) VDD = 750 V, ID = 4 A, RG = 4.7 , VGS = 10 V 50 ns
Rise time tr VDD = 750 V, ID = 4 A, RG = 4.7 , VGS = 10 V 16 ns
Turn-off-delay time td(off) VDD = 750 V, ID = 4 A, RG = 4.7 , VGS = 10 V 100 ns
Fall time tf VDD = 750 V, ID = 4 A, RG = 4.7 , VGS = 10 V 80 ns
Source drain diode
Source-drain current ISD 8 A
Source-drain current (pulsed) ISDM 40
Forward on voltage VSD ISD= 8 A, VGS= 0 1.5 V
Reverse recovery time trr ISD= 8A, di/dt=100A/s VDD= 60 V 950 ns
Reverse recovery charge Qrr ISD= 8A, di/dt=100A/s VDD= 60 V 9 C
Reverse recovery current IRRM ISD= 8A, di/dt=100A/s VDD= 60 V 20 A
Reverse recovery time trr SD=8A, di/dt=100A/s VDD= 60V TJ=150C 900 ns
Reverse recovery charge Qrr SD=8A, di/dt=100A/s VDD= 60V TJ=150C 8.5 C
Reverse recovery current IRRM SD=8A, di/dt=100A/s VDD= 60V TJ=150C 19 A

2409302200_Slkor-SL9N150T_C5375313.pdf

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