Multi EPI Super Junction Power MOSFET XCH GSW77N65EF with robust avalanche and dv dt characteristics

Key Attributes
Model Number: GSW77N65EF
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
77A
Operating Temperature -:
-40℃~+125℃
RDS(on):
35mΩ@10V,35A
Gate Threshold Voltage (Vgs(th)):
4.5V
Reverse Transfer Capacitance (Crss@Vds):
12pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
6.2nF@25V
Pd - Power Dissipation:
400W
Gate Charge(Qg):
300nC@10V
Mfr. Part #:
GSW77N65EF
Package:
TO-247
Product Description

Product Overview

The GSW77N65EF is a low-voltage N-channel Multi-EPI Super-Junction Power MOSFET from XCH Semiconductor. It features revolutionary high-voltage technology, offering superior RDS(on) in a TO-247 package, ultra-low gate charge, and excellent avalanche and dv/dt characteristics. This advanced MOSFET is designed for high-performance applications requiring fast switching times, low on-resistance, and robust avalanche capabilities.

Product Attributes

  • Brand: XCH Semiconductor
  • Package: TO-247, Pb-Free
  • Industrial Range: -40C to +125C
  • Certifications: Pb-free lead planting

Technical Specifications

SymbolParameterConditionsMinTypMaxUnit
BVDSSDrain-Source Breakdown VoltageVGS = 0V, ID = 250A, TJ = 25650--V
VGS = 0V, ID = 250A, TJ = 150-700-V
BVDSS/TJBreakdown Voltage Temperature CoefficientID = 250A, Referenced to 25-0.6-V/
IDSSZero Gate Voltage Drain CurrentVDS = 650V, VGS = 0V, TJ = 25--10A
VDS = 650V, VGS = 0V, TJ = 150--1A
IGSSFGate-Body Leakage Current, ForwardVGS = 30V, VDS = 0V--100nA
IGSSRGate-Body Leakage Current, ReverseVGS = -30V, VDS = 0V---100nA
VGS(th)Gate Threshold VoltageVDS = VGS, ID = 250A2.5-4.5V
RDS(on)Static Drain-Source On-ResistanceVGS = 10V, ID = 35A-3541m
gFSForward TransconductanceVDS = 40V, ID = 35A-30-S
CissInput CapacitanceVDS = 25V, VGS = 0V, f = 1.0MHz-6200-pF
CossOutput Capacitance--300-pF
CrssReverse Transfer Capacitance--12-pF
td(on)Turn-On Delay TimeVDD = 520V, ID = 35A, RG = 20 (Note 4)-39-ns
trTurn-On Rise Time--20-ns
td(off)Turn-Off Delay Time--100-ns
tfTurn-Off Fall Time--5-ns
QgTotal Gate ChargeVDS = 520V, ID = 35A, VGS = 10V (Note 4)-300-nC
QgsGate-Source Charge--59-nC
QgdGate-Drain Charge--195-nC
ISMaximum Continuous Drain-Source Diode Forward Current---77A
ISMMaximum Pulsed Drain-Source Diode Forward Current---260A
VSDDrain-Source Diode Forward VoltageVGS = 0V, IS = 35A-0.91.5V
VGS = 0V, IS = 77A--1.5V
trrReverse Recovery TimeVGS = 0V, IS = 35A, dIF/dt =100A/s-290-ns
QrrReverse Recovery Charge--12-C
RJCThermal Resistance, Junction-to-CaseTj = 25, unless otherwise specified.-0.32-/W
RCSThermal Resistance, Case-to-SinkTyp.-0.5-/W
RJAThermal Resistance, Junction-to-Ambient--62-/W
PDPower DissipationTC = 25--400W
TJ, TSTGOperating and Storage Temperature Range--55-+150
TLMaximum Lead Temperature for Soldering Purpose, 1/8 from Case for 5 Seconds---300

Applications

  • Consumer
  • EV Charger
  • PFC stages for server & telecom
  • SMPS
  • UPS
  • Solar
  • Lighting

2304250924_XCH-GSW77N65EF_C5455785.pdf

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