High Speed Switching Silicon Carbide MOSFET YANGJIE YJD212080NCTG1 N Channel with Fast Intrinsic Diode

Key Attributes
Model Number: YJD212080NCTG1
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
38A
Operating Temperature -:
-55℃~+175℃
RDS(on):
80mΩ
Gate Threshold Voltage (Vgs(th)):
3.6V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
4pF
Input Capacitance(Ciss):
890pF
Output Capacitance(Coss):
58pF
Pd - Power Dissipation:
220W
Gate Charge(Qg):
41nC
Mfr. Part #:
YJD212080NCTG1
Package:
TO-247
Product Description

Product Overview

The YJD212080NCTG1 is a Silicon Carbide Power MOSFET (N-Channel Enhancement) designed for high-speed switching applications. It offers essentially no switching losses, reduced heat sink requirements, and a high blocking voltage. Key features include a fast intrinsic diode with low recovery current and suitability for high-frequency operation. This product is halogen-free and RoHS compliant.

Product Attributes

  • Brand: Yangzhou Yangjie Electronic Technology Co., Ltd.
  • Origin: China
  • Material: Silicon Carbide
  • Certifications: RoHS COMPLIANT

Technical Specifications

ParameterSymbolUnitMin.Typ.Max.Test ConditionsNote
Device marking codeYJD212080NCTG1
Drain source voltageVDS,maxV1200VGS=0 V, ID=100uA @ Tj=25C
Gate source voltageVGS,maxV-8+22Absolute maximum valuesNote1
Gate source voltageVGS,opV-4+18Recommended operational valuesNote2
Continuous drain currentIDA38VGS=18V, Tc=25Fig.18
Continuous drain currentIDA28VGS=18V, Tc=100
Pulsed drain currentID(pulsed)A80Pulse width tp limited by Tj,maxFig.23
Power DissipationPTOTW220Tc=25C , Tj = 175Fig.17
Power DissipationW94Tc=110C, Tj = 175
Operating junction and Storage temperature rangeTj ,TstgC-55+175
Soldering temperatureTLC2601.6mm (0.063) from case for 10s
Mounting torqueTMNm0.6M3 screwMaximum of mounting process: 3
Gate threshold voltageVGS(th)V2.32.93.6VDS=VGS, ID= 5mAFig.4, 11
Gate threshold voltageV2.2VDS=VGS, ID= 5mA, Tj=175
Drain source breakdown voltageV(BR)DSSV1200VGS=0, ID=100uA
Zero gate voltage drain currentIDSSuA110VDS=1200V, VGS= 0VFig.16
Gate source leakage currentIGSSnA100VGS= 18V, VDS=0V
Current drain source on-state resistanceRDS ONm7785VGS=18V, ID=20AFig.5, 6, 7
Current drain source on-state resistancem122VGS=18V, ID=20A,Tj=175
Internal gate resistanceRg1.5f=1MHz
Diode forward voltageVSDV3.9VGS=-4V, ISD=10AFig.8
Diode forward voltageV3.2VGS=0V, ISD=10A Tj=175Fig.9
TransconductancegfS10VDS=16V,ID=20AFig.4
TransconductanceS9.2VDS=16V,ID=20A,Tj=175
Input capacitanceCisspF890VDS=1000V, VGS=0V, Tj=25, f=1MHz, VAC = 25mVFig.13, 14
Output capacitanceCosspF58
Reverse capacitanceCrsspF
Coss stored energyEossuJ34Fig.15
Gate source chargeQgsnC12VDS=800V, VGS=-4/18V, ID=20AFig.12
Gate drain chargeQg dnC11
Gate chargeQgnC41
Turn on switching energyEonuJ377VDD=800V, VGS=-4/+15V, ID=20A, Rg=0, L=16.7uHFig.21, 22
Turn off switching energyEoffuJ14
Turn on delay timetd(on)ns21Fig.21, 22
Rise timetrns17
Turn off delay timetd(off)ns14
Fall timetfns8
Diode forward voltageVSDV3.9VGS=-4V,ISD=10AFig.8
Diode forward voltageV3.2VGS=0V, ISD=10A, Tj=175Fig.9
Continuous diode forward currentISA38Tc=25Note1
Reverse recovery timetrrnS28.24VR=800V, VGS=-4V, ID=20A, di/dt=2095A/uS
Reverse recovery chargeQrrnC190
Peak reverse recovery currentIrrmA30.08
Thermal resistanceRJ-CC /W0.68

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