252 3L Package 650V MOSFET A Power microelectronics APJ14N65D designed for UPS and PFC circuit applications
Product Overview
The APJ14N65D is a 650V N-Channel Enhancement Mode MOSFET from the CoolFET II family, engineered with charge balance technology to deliver extremely low on-resistance and low gate charge performance. This MOSFET is ideal for applications demanding superior power density and outstanding efficiency, such as Uninterruptible Power Supplies (UPS) and Power Factor Correction (PFC) circuits.
Product Attributes
- Brand: APM Microelectronics ()
- Product Family: CoolFET II
- Technology: Charge Balance Technology
- Channel Type: N-Channel
- Mode: Enhancement Mode
- Package Type: TO-252-3L
Technical Specifications
| Model | VDS (V) | ID (A) | RDS(ON) (m) @ VGS=10V | Package | Description |
|---|---|---|---|---|---|
| APJ14N65D (AP65R650) | 650 (Type: 730) | 14 (IDM) | < 650 (Type: 560) | TO-252-3L | 650V N-Channel Enhancement Mode MOSFET |
| Symbol | Parameter | Test Conditions | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | (VGS = 0V) | 650 | V | ||
| ID | Continuous Drain Current | (TC=25 unless otherwise noted) | 8 | A | ||
| IDM | Pulsed Drain Current | (note1) | 14 | A | ||
| VGS | Gate-Source Voltage | 30 | V | |||
| EAS | Single Pulse Avalanche Energy | (note2) | 125 | mJ | ||
| PD | Power Dissipation | (TC = 25C) | 25.5 | W | ||
| TJ, Tstg | Operating Junction and Storage Temperature Range | -55 | +150 | C | ||
| RthJC | Thermal Resistance, Junction-to-Case | 4.9 | C/W | |||
| RthJA | Thermal Resistance, Junction-to-Ambient | 49 | C/W | |||
| Electrical Characteristics | ||||||
| BVDSS | Drain to source breakdown voltage | VGS=0V, ID=250uA | 650 | 700 | V | |
| BVDSS / TJ | Breakdown voltage temperature coefficient | ID=250uA, referenced to 25oC | 0.7 | V/oC | ||
| IDSS | Drain to source leakage current | VDS=650V, VGS=0V | 1 | uA | ||
| IDSS | Drain to source leakage current | VDS=520V, TC=125oC | 50 | uA | ||
| IGSS | Gate to source leakage current, forward | VGS=30V, VDS=0V | 100 | nA | ||
| IGSS | Gate to source leakage current, reverse | VGS=-30V, VDS=0V | -100 | nA | ||
| VGS(TH) | Gate threshold voltage | VDS=VGS, ID=250uA | 2.5 | 3.3 | 4.5 | V |
| RDS(ON) | Drain to source on state resistance | VGS=10V, ID =3.2A | 560 | 650 | m | |
| Ciss | Input capacitance | VGS=0V, VDS=100V, f=1MHz | 438 | pF | ||
| Coss | Output capacitance | VGS=0V, VDS=100V, f=1MHz | 19.5 | pF | ||
| Crss | Reverse transfer capacitance | VGS=0V, VDS=100V, f=1MHz | 1.32 | pF | ||
| td(on) | Turn on delay time | VDS=400V, ID=3.2A RG=4.7 , VGS=10V | 84.8 | ns | ||
| tr | Rising time | VDS=400V, ID=3.2A RG=4.7 , VGS=10V | 25.2 | ns | ||
| td(off) | Turn off delay time | VDS=400V, ID=3.2A RG=4.7 , VGS=10V | 227.6 | ns | ||
| tf | Fall time | VDS=400V, ID=3.2A RG=4.7 , VGS=10V | 26.8 | ns | ||
| Qg | Total gate charge | VDS=480V, VGS=10V, ID=3.2A | 11 | nC | ||
| Qgs | Gate-source charge | VDS=480V, VGS=10V, ID=3.2A | 2.1 | -- | ||
| Qgd | Gate-drain charge | VDS=480V, VGS=10V, ID=3.2A | 5.6 | -- | ||
| IS | Continuous source current | Integral reverse p-n Junction diode in the MOSFET | 11 | A | ||
| ISM | Pulsed source current | 44 | A | |||
| VSD | Diode forward voltage drop. | IS=3.2A, VGS=0V | 0.7 | 1.5 | V | |
| Trr | Reverse recovery time | IS=3.2A, VGS=0V, Vdd=400V, dIF/dt=100A/us | 313 | ns | ||
| Qrr | Reverse recovery Charge | IS=3.2A, VGS=0V, Vdd=400V, dIF/dt=100A/us | 0.877 | uC | ||
| Package Mechanical Data: TO-252-3L Dimensions | |||
|---|---|---|---|
| Ref | Min. | Typ. | Max. |
| A | 2.10 | ||
| A2 | 0 | 0.66 | |
| B | 0.40 | 2.50 | |
| C | 0.10 | 0.86 | |
| D | 0.60 | ||
| E | 0.083 | 0 | 0.026 |
| G | 0.016 | 0.098 | 0.004 |
| H | 0.034 | 0.024 | |
| L | 6.40 | 9.50 | 10.70 |
| V1 | 0.374 | 0.421 | 0.053 |
| V2 | 0.065 | 5.90 | 6.30 |
| L2 | 0 | 6 | 7 |
| B2 | 5.18 | 5.48 | 0.202 |
| C2 | 0.44 | 0.58 | 0.017 |
| D1 | 5.30REF | ||
| E1 | 4.63 | 0.182 | 0.209REF |
| Reel Spectification-TO-252 Dimensions | |||
|---|---|---|---|
| Ref | Min. | Typ. | Max. |
| W | 15.90 | 1.65 | 7.40 |
| E | 1.40 | 16.10 | 1.85 |
| F | 7.60 | 1.60 | 0.626 |
| D0 | 0.065 | 0.291 | 0.055 |
| D1 | 0.634 | 0.073 | 0.299 |
| P0 | 0.063 | 1.40 | 1.60 |
| P1 | 7.90 | 10.45 | 10.60 |
| P2 | 0.411 | 0.417 | 0.053 |
| A0 | 0.065 | 0.24 | 0.27 |
| B0 | 0.009 | 0.011 | 0.055 |
| K0 | 0.063 | 3.90 | 4.10 |
| T | 6.90 | 0.271 | 10P0 |
| t1 | 0.154 | 0.161 | 8.10 |
Note:
- 1. Data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
- 2. EAS data shows Max. rating. L=0.5mH, IAS =3.2A, VDD =50V, RG=25.
- 3. Test condition is Pulse Test: ISD ID, di/dt = 100A/us, VDD BVDSS, Starting at TJ =25.
- 4. Power dissipation is limited by 150 junction temperature.
- 5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.
Copyright: APM-Microelectronice
Edition Date: 2018/1/31
Version: Rve1.0
2410121457_A-Power-microelectronics-APJ14N65D_C3011409.pdf
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