252 3L Package 650V MOSFET A Power microelectronics APJ14N65D designed for UPS and PFC circuit applications

Key Attributes
Model Number: APJ14N65D
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
8A
Operating Temperature -:
-55℃~+150℃
RDS(on):
650mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
1.32pF@650V
Number:
1 N-channel
Pd - Power Dissipation:
25.5W
Input Capacitance(Ciss):
438pF@650V
Gate Charge(Qg):
11nC@10V
Mfr. Part #:
APJ14N65D
Package:
TO-252-3
Product Description

Product Overview

The APJ14N65D is a 650V N-Channel Enhancement Mode MOSFET from the CoolFET II family, engineered with charge balance technology to deliver extremely low on-resistance and low gate charge performance. This MOSFET is ideal for applications demanding superior power density and outstanding efficiency, such as Uninterruptible Power Supplies (UPS) and Power Factor Correction (PFC) circuits.

Product Attributes

  • Brand: APM Microelectronics ()
  • Product Family: CoolFET II
  • Technology: Charge Balance Technology
  • Channel Type: N-Channel
  • Mode: Enhancement Mode
  • Package Type: TO-252-3L

Technical Specifications

Model VDS (V) ID (A) RDS(ON) (m) @ VGS=10V Package Description
APJ14N65D (AP65R650) 650 (Type: 730) 14 (IDM) < 650 (Type: 560) TO-252-3L 650V N-Channel Enhancement Mode MOSFET
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage (VGS = 0V) 650 V
ID Continuous Drain Current (TC=25 unless otherwise noted) 8 A
IDM Pulsed Drain Current (note1) 14 A
VGS Gate-Source Voltage 30 V
EAS Single Pulse Avalanche Energy (note2) 125 mJ
PD Power Dissipation (TC = 25C) 25.5 W
TJ, Tstg Operating Junction and Storage Temperature Range -55 +150 C
RthJC Thermal Resistance, Junction-to-Case 4.9 C/W
RthJA Thermal Resistance, Junction-to-Ambient 49 C/W
Electrical Characteristics
BVDSS Drain to source breakdown voltage VGS=0V, ID=250uA 650 700 V
BVDSS / TJ Breakdown voltage temperature coefficient ID=250uA, referenced to 25oC 0.7 V/oC
IDSS Drain to source leakage current VDS=650V, VGS=0V 1 uA
IDSS Drain to source leakage current VDS=520V, TC=125oC 50 uA
IGSS Gate to source leakage current, forward VGS=30V, VDS=0V 100 nA
IGSS Gate to source leakage current, reverse VGS=-30V, VDS=0V -100 nA
VGS(TH) Gate threshold voltage VDS=VGS, ID=250uA 2.5 3.3 4.5 V
RDS(ON) Drain to source on state resistance VGS=10V, ID =3.2A 560 650 m
Ciss Input capacitance VGS=0V, VDS=100V, f=1MHz 438 pF
Coss Output capacitance VGS=0V, VDS=100V, f=1MHz 19.5 pF
Crss Reverse transfer capacitance VGS=0V, VDS=100V, f=1MHz 1.32 pF
td(on) Turn on delay time VDS=400V, ID=3.2A RG=4.7 , VGS=10V 84.8 ns
tr Rising time VDS=400V, ID=3.2A RG=4.7 , VGS=10V 25.2 ns
td(off) Turn off delay time VDS=400V, ID=3.2A RG=4.7 , VGS=10V 227.6 ns
tf Fall time VDS=400V, ID=3.2A RG=4.7 , VGS=10V 26.8 ns
Qg Total gate charge VDS=480V, VGS=10V, ID=3.2A 11 nC
Qgs Gate-source charge VDS=480V, VGS=10V, ID=3.2A 2.1 --
Qgd Gate-drain charge VDS=480V, VGS=10V, ID=3.2A 5.6 --
IS Continuous source current Integral reverse p-n Junction diode in the MOSFET 11 A
ISM Pulsed source current 44 A
VSD Diode forward voltage drop. IS=3.2A, VGS=0V 0.7 1.5 V
Trr Reverse recovery time IS=3.2A, VGS=0V, Vdd=400V, dIF/dt=100A/us 313 ns
Qrr Reverse recovery Charge IS=3.2A, VGS=0V, Vdd=400V, dIF/dt=100A/us 0.877 uC
Package Mechanical Data: TO-252-3L Dimensions
Ref Min. Typ. Max.
A 2.10
A2 0 0.66
B 0.40 2.50
C 0.10 0.86
D 0.60
E 0.083 0 0.026
G 0.016 0.098 0.004
H 0.034 0.024
L 6.40 9.50 10.70
V1 0.374 0.421 0.053
V2 0.065 5.90 6.30
L2 0 6 7
B2 5.18 5.48 0.202
C2 0.44 0.58 0.017
D1 5.30REF
E1 4.63 0.182 0.209REF
Reel Spectification-TO-252 Dimensions
Ref Min. Typ. Max.
W 15.90 1.65 7.40
E 1.40 16.10 1.85
F 7.60 1.60 0.626
D0 0.065 0.291 0.055
D1 0.634 0.073 0.299
P0 0.063 1.40 1.60
P1 7.90 10.45 10.60
P2 0.411 0.417 0.053
A0 0.065 0.24 0.27
B0 0.009 0.011 0.055
K0 0.063 3.90 4.10
T 6.90 0.271 10P0
t1 0.154 0.161 8.10

Note:

  • 1. Data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
  • 2. EAS data shows Max. rating. L=0.5mH, IAS =3.2A, VDD =50V, RG=25.
  • 3. Test condition is Pulse Test: ISD ID, di/dt = 100A/us, VDD BVDSS, Starting at TJ =25.
  • 4. Power dissipation is limited by 150 junction temperature.
  • 5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.

Copyright: APM-Microelectronice

Edition Date: 2018/1/31

Version: Rve1.0


2410121457_A-Power-microelectronics-APJ14N65D_C3011409.pdf

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