Silicon N Channel Power MOSFET ANHI ASW65R110E Suitable for Boost PFC and Telecom Power Applications

Key Attributes
Model Number: ASW65R110E
Product Custom Attributes
Drain To Source Voltage:
655V
Current - Continuous Drain(Id):
30A
Operating Temperature -:
-55℃~+100℃
RDS(on):
110mΩ
Gate Threshold Voltage (Vgs(th)):
4.2V
Reverse Transfer Capacitance (Crss@Vds):
6.75pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
2.497nF@50V
Pd - Power Dissipation:
277.8W
Gate Charge(Qg):
52nC
Mfr. Part #:
ASW65R110E
Package:
TO-247
Product Description

Product Overview

The ASW65R110E is a Silicon N-Channel Power MOSFET designed for high-efficiency power conversion applications. It features low drain-source on-resistance (RDS(on)) of 0.095 (typ.) and easy gate control. This enhancement mode MOSFET is suitable for use in Boost PFC switches, half-bridge or resonance half-bridge topologies, server power supplies, telecom power, EV charging, solar inverters, and UPS applications.

Product Attributes

  • Brand: Not explicitly stated, but implied by part number prefix 'ASW'
  • Package: TO247
  • Internal Circuit: Symmetric half bridge or Series e topologies

Technical Specifications

Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 655 V VGS=0V, ID=10mA
Gate threshold voltage V(GS)th 2.8 - 4.2 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 1 uA VDS=650V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) 0.095 - 0.110 VGS=10V, ID=14A, Tj=25C
Gate resistance (Intrinsic) RG 13.4 f=1MHz, open drain
Input capacitance Ciss 2497 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss 239 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss 6.75 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) 23 ns VDD=400V,VGS=10V,ID=25A, RG=2
Rise time tr 28 ns VDD=400V,VGS=10V,ID=25A, RG=2
Turn-off delay time td(off) 108.4 ns VDD=400V,VGS=10V,ID=25A, RG=2
Fall time tf 24 ns VDD=400V,VGS=10V,ID=25A, RG=2
Gate to source charge Qgs 7.1 nC VDD=400V, ID=25A, VGS=0 to 10V
Gate to drain charge Qgd 20 nC VDD=400V, ID=25A, VGS=0 to 10V
Gate charge total Qg 52 nC VDD=400V, ID=25A, VGS=0 to 10V
Gate plateau voltage Vplateau 9 V VDD=400V, ID=25A, VGS=0 to 10V
Diode forward voltage VSD 0.69 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr 380.8 ns VR=400V, IF=25A,diF/dt=100A/s
Reverse recovery charge Qrr 8.8 uC VR=400V, IF=25A,diF/dt=100A/s
Peak reverse recovery current Irrm 45.2 A VR=400V, IF=25A,diF/dt=100A/s
Continuous drain current ID 30 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse 90 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS 2528 mJ
MOSFET dv/dt ruggedness dv/dt 36 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation Ptot 277.8 W TC=25C
Storage temperature Tstg -55 - 100 C
Operating junction temperature Tj -55 - 100 C
Reverse diode dv/dt dv/dt 15 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Thermal resistance, junction - case RthJC 0.45 C/W
Thermal resistance, junction - ambient RthJA 62 C/W device on PCB, minimal footprint

2410121550_ANHI-ASW65R110E_C5440019.pdf

Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.