P Channel MOSFET ALJ SI2301 designed for battery powered systems portable equipment and load switches
Product Overview
The SI2301 is a P-Channel logic enhancement mode power MOSFET manufactured using high cell density, DMOS trench technology. This advanced design is optimized to minimize on-state resistance, offering exceptional on-resistance and maximum DC current capability. It is ideal for power management applications in notebooks, portable equipment, battery-powered systems, load switches, and DSCs.
Product Attributes
- Brand: SHENZHEN LONG JING MICRO-ELECTRONICS CO., LTD.
- Product Line: SOT-23 Plastic-Encapsulate MOSFETS
- Model: SI2301
- Channel Type: P-Channel
- Technology: Logic Enhancement Mode, High Cell Density DMOS Trench Technology
- Marking: A1SHB
Technical Specifications
| Symbol | Parameter | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Features | ||||||
| VDS | Drain-source voltage | -20 | V | |||
| ID | Continuous drain current | -2.5 | A | |||
| RDS(ON) | Drain-Source on-state resistance | VGS = -2.5 V, ID = -2A | 110 | 150 | m | |
| RDS(ON) | Drain-Source on-state resistance | VGS = -4.5 V, ID = -2.5A | 90 | 110 | m | |
| Maximum Ratings (Ta=25 C unless otherwise noted) | ||||||
| VDS | Drain-source voltage | -20 | V | |||
| VGS | Gate-source voltage | 8 | V | |||
| ID | Continuous drain current | -2.5 | A | |||
| IDM | Pulsed Drain Current 1) | -13 | A | |||
| PD | Power dissipation | 0.4 | W | |||
| TJ | Operating Junction temperature | 150 | C | |||
| Tstg | Storage temperature | -55 | 150 | C | ||
| Thermal Characteristic | ||||||
| RJA | Thermal Resistance from Junction to Ambient 2) | (t 5s) | 312.5 | C /W | ||
| RJC | Thermal Resistance from Junction to Case | 30 | C /W | |||
| Electrical Characteristics (Ta=25 C unless otherwise noted) | ||||||
| Off Characteristics | ||||||
| V(BR)DSS | Drain- source breakdown voltage | VGS = 0 V, ID = -250uA | -20 | V | ||
| IDSS | Zero gate voltage drain current | VDS = -20 V, VGS = 0 V | -1 | A | ||
| IGSS | Gate-body leakage current | VGS = 8V, VDS = 0 V | 100 | nA | ||
| On Characteristics | ||||||
| VGS(th) | Gate threshold voltage | VGS=VDS, ID = -250uA | -0.4 | -1 | V | |
| RDS(on) | Drain-Source on-state resistance | VGS = -4.5 V, ID = -2.5A | 90 | 110 | m | |
| RDS(on) | Drain-Source on-state resistance | VGS = -2.5 V, ID = -2A | 110 | 150 | m | |
| Dynamic Characteristics | ||||||
| Ciss | Input capacitance | VGS = 0 V, VDS = -15V, f = 1 MHz | 381 | pF | ||
| Coss | Output capacitance | 49 | pF | |||
| Crss | Reverse transfer capacitance | 25 | pF | |||
| Switching Characteristics | ||||||
| td(on) | Turn-on delay time | VDS = -6V, RL = 6 RGEN = 6, VGS = -4.5V | 61.6 | ns | ||
| tr | Rise time | 23.1 | ns | |||
| td(off) | Turn-off delay time | 47.6 | ns | |||
| tf | Fall time | 7.9 | ns | |||
| Total Gate Charge | ||||||
| Qg | Total gate charge | VDS = -6V, VGS = -4.5V, ID = -2.5A | 5.6 | nC | ||
| Qgs | Gate-source charge | 2.4 | nC | |||
| Qgd | Gate-drain charge | 1.3 | nC | |||
| Drain-source body diode characteristics | ||||||
| VSD | Diode forward voltage 3) | VGS = 0 V, IS = -1A | -0.7 | -1.4 | V | |
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. The value of RJA is measured with the device mounted on 1 in FR-4 board in a still air environment with Ta=25.
3. Diode forward voltage.
2410121447_ALJ-SI2301_C22400356.pdf
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