Power Switching Silicon MOSFET AUB045N12 with Enhanced Avalanche Ruggedness and Low RDS on Resistance

Key Attributes
Model Number: AUB045N12
Product Custom Attributes
Drain To Source Voltage:
120V
Current - Continuous Drain(Id):
169A
Operating Temperature -:
-55℃~+175℃
RDS(on):
4.5mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
4.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
47pF
Number:
1 N-channel
Output Capacitance(Coss):
654pF
Pd - Power Dissipation:
310W
Input Capacitance(Ciss):
11.701nF
Gate Charge(Qg):
178.1nC@10V
Mfr. Part #:
AUB045N12
Package:
TO-263
Product Description

Product Overview

The AUP045N12 and AUB045N12 are N-Channel Silicon MOSFETs designed for high-speed power switching applications. They feature low drain-source on-resistance (RDS(on) = 4.1m typ.), enhanced body diode dv/dt capability, and improved avalanche ruggedness. These MOSFETs are ideal for synchronous rectification in Switch Mode Power Supplies (SMPS), and for hard switching and high-speed DC/DC converters in telecommunications and industrial sectors.

Product Attributes

  • Type: Silicon N-Channel MOS
  • Brand: Not specified
  • Origin: Not specified
  • Material: Not specified
  • Color: Not specified

Technical Specifications

Part Name Package Marking VDS @ Tj,max (V) RDS(on),max (m) Qg,typ (nC) ID,pulse (A)
AUP045N12 TO220 AUP045N12 120 4.5 178.1 490
AUB045N12 TO263 AUB045N12 120 4.5 178.1 490
Parameter Symbol Values Unit Note / Test Condition
Continuous drain current at silicon ID - A TC=25C, Limited by Tj,max
Continuous drain current at silicon ID 119 A TC=100C, Limited by Tj,max
Continuous drain current at package ID -152 A TC=25C, Limited by Tj,max
Pulsed drain current ID,pulse -490 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS -635 mJ Tc=25,VDD=50V,Vgs=10V, L=0.5mH, RG=25
Avalanche current, single pulse IAR -50.4 A Tc=25, VDD=50V, L=0.5mH, RG=25
Gate source voltage (static) VGS -20 to 20 V static
Power dissipation Ptot -310 W TC=25C
Storage temperature Tstg -55 to 175 C
Operating junction temperature Tj -55 to 175 C
Soldering Temperature TL 300 C Distance of 1.6mm from case for 10s
Thermal resistance, junction - case RthJC -0.48 C/W
Thermal resistance, junction - ambient RthJA -62 C/W device on PCB, minimal footprint
Drain-source breakdown voltage V(BR)DSS 120 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 2.5 to 4.5 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS -1 uA VDS=120V, VGS=0V, Tj=25C
Gate-source leakage current IGSS -100 nA VGS=20V, VDS=0V
Drain-source on-state resistance RDS(on) 4.1 to 4.5 m VGS=10V, ID=20A, Tj=25C
Gate resistance (Intrinsic) RG 2.0 f=1MHz, open drain
Transconductance Gfs 115.8 S VDS=5V, ID=50A
Input capacitance Ciss -11701 pF VGS=0V, VDS=60V, f=1MHz
Output capacitance Coss -654 pF VGS=0V, VDS=60V, f=1MHz
Reverse transfer capacitance Crss -47 pF VGS=0V, VDS=60V, f=1MHz
Turn-on delay time td(on) -22 ns VDD=60V,VGS=10V,ID=50A, RG=2.5
Rise time tr -101 ns VDD=60V,VGS=10V,ID=50A, RG=2.5
Turn-off delay time td(off) -96 ns VDD=60V,VGS=10V,ID=50A, RG=2.5
Fall time tf -67 ns VDD=60V,VGS=10V,ID=50A, RG=2.5
Gate to source charge Qgs -45.5 nC VDD=60V, ID=20A, VGS=10V
Gate to drain charge Qgd -50.0 nC VDD=60V, ID=20A, VGS=10V
Gate charge total Qg -178.1 nC VDD=60V, ID=20A, VGS=10V
Continuous Source Current at silicon ISD -169 A
Diode forward voltage VSD -1.2 V VGS=0V, Is=1A, Tj=25C
Reverse recovery time trr -117.7 ns Vgs=0V, IF=50A, diF/dt=100A/s
Reverse recovery charge Qrr -433.8 nC Vgs=0V, IF=50A, diF/dt=100A/s
Peak Reverse Recovery Current Irrm -5.48 A Vgs=0V, IF=50A, diF/dt=100A/s

2410121605_ANHI-AUB045N12_C18722990.pdf

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