load switch ANHI AUP065N10 N Channel Silicon MOSFET with fast recovery diode and low gate charge design

Key Attributes
Model Number: AUP065N10
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
76A
RDS(on):
11mΩ@4.5V,20A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
64pF
Number:
1 N-channel
Output Capacitance(Coss):
1.13nF
Pd - Power Dissipation:
160W
Input Capacitance(Ciss):
3.729nF
Gate Charge(Qg):
67nC@10V
Mfr. Part #:
AUP065N10
Package:
TO-220
Product Description

Product Overview

The AUN065N10 and AUP065N10 are N-Channel Silicon MOSFETs designed for applications requiring efficient power management. Leveraging proprietary new trench technology, these MOSFETs offer a fast recovery body diode and low gate charge, contributing to minimized switching losses. They are ideal for synchronous rectification, general power management, and load switch applications.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Silicon
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Model Package VDS @ Tj,max RDS(on),max Qg,typ ID,pulse
AUN065N10 DFN5X6 100 V 6.5 m 67 nC 304 A
AUP065N10 TO220 100 V 6.5 m 67 nC 304 A
Parameter Symbol Value Unit Note / Test Condition
Continuous drain current ID - A TC=25C, Limited by Tj,max, Maximum Duty Cycle D = 0.50
76 A TC=25C
Pulsed drain current ID,pulse 304 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS 84 mJ -
Gate source voltage (static) VGS -20 to 20 V static
Power dissipation (DFN5X6) Ptot 91 W TC=25C
Power dissipation (TO220) Ptot 160 W TC=25C
Storage temperature Tstg -55 to 150 C -
Operating junction temperature Tj -55 to 150 C -
Soldering Temperature TL 260 C Distance of 1.6mm from case for 10s
Thermal resistance, junction - case (TO220) RthJC 0.8 C/W -
Thermal resistance, junction - ambient (TO220) RthJA 62 C/W device on PCB, minimal footprint
Thermal resistance, junction - case (DFN5X6) RthJC 1.4 C/W -
Thermal resistance, junction - ambient (DFN5X6) RthJA 63 C/W device on PCB, minimal footprint
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 1 to 3 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS 1 uA VDS=100V, VGS=0V, Tj=25C
Gate-source leakage current IGSS 100 nA VGS=20V, VDS=0V
Drain-source on-state resistance RDS(on) 5.8 to 6.5 m VGS=10V, ID=20A, Tj=25C
7.9 to 11 m VGS=4.5V, ID=20A, Tj=25C
Input capacitance Ciss 3729 pF Vds=30V,Vgs=0V, f=1MHz
Output capacitance Coss 1130 pF Vds=30V,Vgs=0V, f=1MHz
Reverse transfer capacitance Crss 64 pF Vds=30V,Vgs=0V, f=1MHz
Turn-on delay time td(on) 25 ns VDD=50V,VGS=10V,RG=6, ID=20A
Rise time tr 47 ns VDD=50V,VGS=10V,RG=6, ID=20A
Turn-off delay time td(off) 64 ns VDD=50V,VGS=10V,RG=6, ID=20A
Fall time tf 23 ns VDD=50V,VGS=10V,RG=6, ID=20A
Gate to source charge Qgs 13 nC VDS=50V,VGS=0 to 10V, ID=20A
Gate to drain charge Qg d 14 nC VDS=50V,VGS=0 to 10V, ID=20A
Gate charge total Qg 67 nC VDS=50V,VGS=0 to 10V, ID=20A
Diode forward voltage VSD 1.0 V VGS=0V, IF=1A, Tj=25C

2410121452_ANHI-AUP065N10_C18722995.pdf

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