ASW65R041EFDA Silicon N Channel MOSFET Suitable for Phase Shift Bridge LLC Half Bridge Applications

Key Attributes
Model Number: ASW65R041EFDA
Product Custom Attributes
Drain To Source Voltage:
700V
Current - Continuous Drain(Id):
80A
Operating Temperature -:
-55℃~+150℃
RDS(on):
41mΩ
Gate Threshold Voltage (Vgs(th)):
3V
Reverse Transfer Capacitance (Crss@Vds):
12.1pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
7.356nF@50V
Pd - Power Dissipation:
500W
Gate Charge(Qg):
290.6nC
Mfr. Part #:
ASW65R041EFDA
Package:
TO-247
Product Description

Product Overview

The ASW65R041EFDA is a Silicon N-Channel MOSFET designed for soft switching boost PFC and full bridge topologies. It is ideal for applications such as phase-shift-bridge (ZVS), LLC half bridge, AHB, and LLC half bridge, commonly found in Telecom Power, EV Charging, Solar applications, and Server Power. This MOSFET features low drain-source on-resistance (RDS(on) = 0.035 typ.), easy gate control, and operates in enhancement mode with a threshold voltage (Vth) of 3 to 5 V. Its robust design and high performance make it suitable for demanding power electronics applications.

Product Attributes

  • Brand: Not explicitly mentioned, but part number suggests a manufacturer.
  • Package: TO247
  • Marking: ASW65R041EFDA
  • Mode: Enhancement mode

Technical Specifications

Parameter Symbol Value Unit Note / Test Condition
Part Name - ASW65R041EFDA - -
Drain-source breakdown voltage V(BR)DSS 655 V VGS=0V, ID=10mA
Gate threshold voltage V(GS)th 3 - 5 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 5 uA VDS=650V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) 0.035 - 0.041 VGS=10V, ID=28A, Tj=25C
Gate resistance (Intrinsic) RG - 13 f=1MHz, open drain
Continuous drain current ID - 80 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 240 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 16000 mJ Tc=25,VDD=50V,L = 20mH, RG=25
Avalanche current, single pulse IAR - 10 A Tc=25,VDD=50V,L = 20mH, RG=25
MOSFET dv/dt ruggedness dv/dt - 26 V/ns VDS=0...150V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation Ptot - 500 W TC=25C
Storage temperature Tstg -55 - 150 C -
Operating junction temperature Tj -55 - 150 C -
Reverse diode dv/dt dv/dt - 50 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Thermal resistance, junction - case RthJC - 0.205 C/W -
Thermal resistance, junction - ambient RthJA - 62 C/W device on PCB, minimal footprint
Input capacitance Ciss - 7356 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss - 436 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss - 12.1 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) - 63.7 ns VDD=400V,VGS=13V,ID=49.6A RG=1.7
Rise time tr - 28.4 ns VDD=400V,VGS=13V,ID=49.6A RG=1.7
Turn-off delay time td(off) - 270 ns VDD=400V,VGS=13V,ID=49.6A RG=1.7
Fall time tf - 24.1 ns VDD=400V,VGS=13V,ID=49.6A RG=1.7
Gate to source charge Qgs - 46.1 nC VDD =480V, ID =49.6A, VGS =10V
Gate to drain charge Qgd - 151.3 nC VDD =480V, ID =49.6A, VGS =10V
Gate charge total Qg - 290.6 nC VDD =480V, ID =49.6A, VGS =10V
Gate plateau voltage Vplateau - 7.8 V VDD =480V, ID =49.6A, VGS =10V
Diode forward voltage VSD - 0.61 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 193.5 ns Vr=400v,IF=49.6A,di/dt=100A/us
Reverse recovery charge Qrr - 1.67 uC Vr=400v,IF=49.6A,di/dt=100A/us
Peak reverse recovery current Irrm - 14.5 A Vr=400v,IF=49.6A,di/dt=100A/us

2410121620_ANHI-ASW65R041EFDA_C5440017.pdf

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