Power MOSFET ANHI ADG120N080G2 1200V Silicon Carbide N Channel Device for Flyback Converter Circuits

Key Attributes
Model Number: ADG120N080G2
Product Custom Attributes
Mfr. Part #:
ADG120N080G2
Package:
TO-263-7L
Product Description

Product Overview

The ADQ120N080G2, ADW120N080G2, and ADG120N080G2 are 1200V N-Channel Silicon Carbide Power MOSFETs designed for applications such as asymmetrical bridge converters, inverters, and single-switch forward and flyback converters. These MOSFETs feature a low drain-source on-resistance of 80m (typ.) and are easy to control with a gate switching enhancement mode and a threshold voltage (Vth) ranging from 2 to 4 V.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Silicon Carbide
  • Color: Not specified
  • Certifications: Not specified

Technical Specifications

Part Name Package Marking VDS @ Tj,max (V) RDS(on),max (m) Qg,typ (nC) ID,pulse (A)
ADQ120N080G2 TO-247-4L ADQ120N080G2 1200 100 58 94
ADW120N080G2 TO-247-3L ADW120N080G2 1200 100 58 94
ADG120N080G2 TO-263-7L ADG120N080G2 1200 100 58 94
Parameter Symbol Min. Typ. Max. Unit Note / Test Condition
Continuous drain current ID - - 35 A TC=25C
Continuous drain current ID - - 26 A TC=100C
Avalanche energy, single pulse EAS - - 200 mJ Tc=25,VDD=50V,L=1mH, RG=25
Gate source voltage (static) VGS -5 - 20 V static
Power dissipation Ptot - - 188 W TC=25C
Derating factor above 25C - - - 1.9 W/C -
Storage temperature Tstg -55 - 175 C -
Operating junction temperature Tj -55 - 175 C -
Soldering Temperature TL - - 300 C Distance of 1.6mm from case for 10s
Transconductance GFS - 8.33 - S VDS=20V IDS=20A
Transconductance GFS - 7.14 - S VDS=20V IDS=20A, Tj=150C
Maximum Duty Cycle D - 0.50 - - -
Thermal characteristics (TO247) Symbol Min. Typ. Max. Unit Note / Test Condition
Thermal resistance, junction - case RthJC - 0.65 0.8 C/W -
Thermal resistance, junction - ambient RthJA - - 40 C/W device on PCB, minimal footprint
Thermal characteristics (TO263-7L) Symbol Min. Typ. Max. Unit Note / Test Condition
Thermal resistance, junction - case RthJC - - 1.0 C/W -
Thermal resistance, junction - ambient RthJA - - 62 C/W device on PCB, minimal footprint
Static characteristics Symbol Min. Typ. Max. Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 1200 - - V VGS=0V, ID=1mA
Gate threshold voltage V(GS)th 2.0 2.8 4.0 V VDS=VGS, ID=10mA
Zero gate voltage drain current IDSS - - 1 uA VDS=1200V, VGS=0V
Gate-source leakage current IGSS+ - - 100 nA VGS=20V, VDS=0V
Gate-source leakage current IGSS- - - -100 nA VGS=-5V, VDS=0V
Drain-source on-state resistance RDS(on) - 80 100 m VGS=20V, ID=20A, Tj=25C
Drain-source on-state resistance RDS(on) - 93.1 - m VGS=20V, ID=20A, Tj=150C
Gate resistance (Intrinsic) RG - 4.5 - f=1MHz, open drain
Dynamic characteristics Symbol Min. Typ. Max. Unit Note / Test Condition
Input capacitance Ciss - 1377 - pF VGS=0V, VDS=1000V, f=200KHz
Output capacitance Coss - 62 - pF VGS=0V, VDS=1000V, f=200KHz
Reverse transfer capacitance Crss - 4 - pF VGS=0V, VDS=1000V, f=200KHz
Turn-on delay time td(on) - 10 - ns VDD=800V, VGS=20V, ID=20A,RG=0; TJ =25
Rise time tr - 6 - ns -
Turn-off delay time td(off) - 16 - ns -
Fall time tf - 10 - ns -
Turn-on Switching Energy Eon - 748.8 - uJ -
Turn-off Switching Energy Eoff - 31.2 - uJ -
Gate charge characteristics Symbol Min. Typ. Max. Unit Note / Test Condition
Gate to source charge Qgs - 18 - nC VDD=800V, ID=20A, VGS=20V
Gate to drain charge Qgd - 17 - nC VDD=800V, ID=20A, VGS=20V
Gate charge total Qg - 58 - nC VDD=800V, ID=20A, VGS=20V
Reverse diode characteristics Symbol Min. Typ. Max. Unit Note / Test Condition
Continuous Source Current ISD - - 35 A -
Diode forward voltage VSD - 3.8 - V IS = 10A, VGS = 0V, Tj=25C
Reverse recovery time trr - 57 - ns VDD =800VID =20A, +VGS =+15V,-VGS =-4V LLoad=500uHRg=0TJ =25
Reverse recovery charge Qrr - 195 - nC -
Peak reverse recovery current Irrm - 6.84 - A -

2410121516_ANHI-ADG120N080G2_C5440045.pdf

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