Power Supply Component Silicon N Channel MOSFET AUN063N10 Featuring Enhancement Mode Gate Switching

Key Attributes
Model Number: AUN063N10
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
123A
Operating Temperature -:
-55℃~+150℃
RDS(on):
6.3mΩ
Gate Threshold Voltage (Vgs(th)):
2.9V
Reverse Transfer Capacitance (Crss@Vds):
14.6pF@50V
Number:
1 N-channel
Pd - Power Dissipation:
151W
Input Capacitance(Ciss):
3.68nF@50V
Gate Charge(Qg):
60.7nC
Mfr. Part #:
AUN063N10
Package:
DFN5x6-8
Product Description

Product Overview

The AUN063N10 is a Silicon N-Channel MOS Field-Effect Transistor designed for efficient power management applications. It features a low drain-source on-resistance (RDS(ON) = 5.5m typ.) and is easy to control due to its enhancement mode gate switching. This MOSFET is ideal for single-ended flyback or two-transistor forward topologies, finding common use in PC power supplies, PD adaptors, LCD & PDP TVs, and LED lighting solutions.

Product Attributes

  • Brand: AUN
  • Part Number: AUN063N10
  • Package Type: DFN5X6
  • Technology: Silicon N-Channel MOS
  • Mode: Enhancement mode

Technical Specifications

Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 2.4 - 3.4 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - uA VDS=95V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=20V, VDS=0V
Drain-source on-state resistance RDS(on) 5.5 - 6.3 m VGS=10V, ID=20A, Tj=25C
Gate resistance (Intrinsic) RG 1 f=1MHz, open drain
Continuous drain current ID - 123 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - - 396 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - - 240 mJ Tc=25, VDD=50V, I=31A, L=0.5mH, RG=25
Avalanche current, single pulse IAR - - 31 A Tc=25, VDD=50V, L=0.5mH, RG=25
Gate source voltage (static) VGS -20 - 20 V static
Power dissipation Ptot - - 151 W TC=25C
Storage temperature Tstg -55 - 150 C -
Operating junction temperature Tj -55 - 150 C -
Transconductance GFS 51 - S VDS=5V IDS=20A
Thermal resistance, junction - case RthJC - - 1.3 C/W -
Thermal resistance, junction - ambient RthJA - - 50 C/W device on PCB, minimal footprint
Input capacitance Ciss - 3680 - pF VGS=0V, VDS=50V, f=1MHz
Output capacitance Coss - 361 - pF VGS=0V, VDS=50V, f=1MHz
Reverse transfer capacitance Crss - 14.6 - pF VGS=0V, VDS=50V, f=1MHz
Turn-on delay time td(on) - 29 - ns VDD=50V,VGS=10V,ID=20A, RG=10
Rise time tr - 55 - ns VDD=50V,VGS=10V,ID=20A, RG=10
Turn-off delay time td(off) - 69 - ns VDD=50V,VGS=10V,ID=20A, RG=10
Fall time tf - 43 - ns VDD=50V,VGS=10V,ID=20A, RG=10
Gate to source charge Qgs - 15.5 - nC VDD=50V, ID=20A, VGS=0 to 10V
Gate to drain charge Qgd - 17.6 - nC VDD=50V, ID=20A, VGS=0 to 10V
Gate charge total Qg - 60.7 - nC VDD=50V, ID=20A, VGS=0 to 10V
Diode forward voltage VSD - 0.7 - V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 45 - ns VR=30V, IF=20A, diF/dt=300A/s
Reverse recovery charge Qrr - 212 - nC VR=30V, IF=20A, diF/dt=300A/s
Peak reverse recovery current Irrm - 8.4 - A VR=30V, IF=20A, diF/dt=300A/s

2410121525_ANHI-AUN063N10_C5440031.pdf

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