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quality Compact SMA Thin Package BLUE ROCKET US2D Ultrafast Recovery Rectifier for Surface Mount Electronics factory
quality Compact SMA Thin Package BLUE ROCKET US2D Ultrafast Recovery Rectifier for Surface Mount Electronics factory

Compact SMA Thin Package BLUE ROCKET US2D Ultrafast Recovery Rectifier for Surface Mount Electronics

Key Attributes
Model Number: US2D
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
50A
Reverse Leakage Current (Ir):
5uA@200V
Reverse Recovery Time (trr):
50ns
Voltage - DC Reverse (Vr) (Max):
200V
Diode Configuration:
Independent
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Voltage - Forward(Vf@If):
1V@2A
Current - Rectified:
2A
Mfr. Part #:
US2D
Package:
SMA
Product Description

Product Overview

The US2A~US2M series are surface-mount ultrafast recovery rectifiers designed for general-purpose applications. Featuring a glass-passivated chip junction for high efficiency, these diodes offer reverse voltages ranging from 50V to 1000V and a forward current of 2.0A. They are compliant with EU RoHS 2011/65/EU directives, lead-free, and halogen-free, making them suitable for modern electronic assemblies requiring surface mounting. The compact SMA thin package is ideal for space-constrained designs.

Product Attributes

  • Type: Ultrafast Recovery Rectifier
  • Package: SMA thin package
  • Chip Technology: Glass Passivated Chip Junction
  • Compliance: Lead-free, Halogen-free, EU RoHS 2011/65/EU directives
  • Application: Surface mounted applications, General purpose
  • Brand/Manufacturer: FS (implied by datasheet URL http://www.fsbrec.com)

Technical Specifications

Parameter Symbol Test Condition US2A US2B US2D US2G US2J US2K US2M Unit
Electrical Characteristics (Ta=25)
Maximum Instantaneous Forward Voltage VF IF=2.0A 1.0 1.3 1.65 V
Maximum DC Reverse Current at Maximum DC Blocking Voltage IR Ta=25 5.0 uA
Ta=125 100 uA
Maximum Reverse Recovery Time trr IF=0.5A, IR=1.0A, Irr=0.25A 50 75 ns
Absolute Maximum Ratings (Ta=25)
Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current at TC = 125 IFAV 2.0 A
Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 50 A
Typical Thermal Resistance RJA 65 /W
RJC 20 /W
Operating and Storage Temperature Range Tj,Tstg -55~+150
Package Type Units/Reel Reels/Inner Box Units/Inner Box Inner Boxes/Outer Box Units/Outer Box Dimension (Reel) Dimension (Inner Box) Dimension (Outer Box)
SMA 5000 2 10000 7 70000 1312 336X336X40 380X335X366
Test Condition Temperature Time
Resistance to Soldering Heat Test Conditions 2605 101 sec
Parameter Profile Temperature Profile Duration
Temperature Profile for IR Reflow Soldering (Pb-Free) - Preheating 150~180 60~90 sec
Temperature Profile for IR Reflow Soldering (Pb-Free) - Peak Temperature 2455 50.5 sec
Temperature Profile for IR Reflow Soldering (Pb-Free) - Cooling Speed 2~10/sec

2410121231_BLUE-ROCKET-US2D_C2900674.pdf

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