Power Switching P Channel MOSFET BORN SI2305 with Low On Resistance and Compact SOT 23 Package Design

Key Attributes
Model Number: SI2305
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
4.1A
Operating Temperature -:
-55℃~+150℃
RDS(on):
52mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
1V@250uA
Reverse Transfer Capacitance (Crss@Vds):
87pF@6V
Number:
1 P-Channel
Input Capacitance(Ciss):
415pF@6V
Pd - Power Dissipation:
1.25W
Gate Charge(Qg):
10nC
Mfr. Part #:
SI2305
Package:
SOT-23
Product Description

Product Overview

The SI2305 is a P-Channel MOSFET designed with advanced trench process technology and high-density cell design for ultra-low on-resistance. It offers excellent performance characteristics, making it suitable for various applications requiring efficient power switching. Key features include a low on-state resistance, fast switching speeds, and robust thermal management capabilities, all packaged in a compact SOT-23 form factor.

Product Attributes

  • Brand: Not explicitly stated, but associated with www.born-tw.com
  • Product Type: P-Channel MOSFET
  • Package: SOT-23
  • Certifications: ROHS
  • Technology: Advanced trench process

Technical Specifications

Parameter Test Condition Symbol Min. Typ. Max. Unit
Maximum Ratings & Thermal Characteristics (Ratings at 25 ambient temperature unless otherwise specified.)
Drain-Source Voltage VDS -20 V
Gate-Source Voltage VGS 12 V
Continuous Drain Current ID -4.1 A
Pulsed Drain Current 1) IDM -15 A
Maximum Power Dissipation TA = 25 PD 1.25 W
Maximum Power Dissipation TA = 75 PD 0.8 W
Operating Junction and Storage Temperature Range TJ, Tstg -55 150
Junction-to-Ambient Thermal Resistance (PCB mounted) 3) Surface Mounted on FR4 Board, t 5 sec. RthJA 100 /W
Junction-to-Ambient Thermal Resistance (PCB mounted) 2) Surface Mounted on FR4 Board. RthJA 166 /W
Electrical Characteristics (Ratings at 25 ambient temperature unless otherwise specified.)
Static Drain-Source Breakdown Voltage VGS = 0V, ID = -250uA BVDSS -20 V
Drain-Source On-State Resistance VGS = -4.5V, ID = -4.1A RDS(on) 46 52 m
Drain-Source On-State Resistance VGS = -2.5V, ID = -3.0A RDS(on) 60 75 m
Gate Threshold Voltage VDS =VGS, ID = -250uA VGS(th) -0.8 -1.6 V
Zero Gate Voltage Drain Current VDS = -20V, V GS = 0V IDSS -1 -10 uA
Zero Gate Voltage Drain Current VDS = -20V, V GS = 0V, TJ=55 oC IDSS -10 uA
Gate Body Leakage VGS = 12V, V DS = 0V IGSS 100 nA
Forward Transconductance VDS = -5V, ID = -3.5A gfs 6.5 S
Dynamic (Pulse test: pulse width 300us, duty cycle 2%)
Total Gate Charge VDS = -6V, ID -3.5A, VGS = -4.5V Qg 5.8 10 nC
Gate-Source Charge Qgs 0.85 nC
Gate-Drain Charge Qgd 1.7 nC
Turn-On Delay Time VDD = -6V, RL=6, ID -1.A, VGEN = -4.5V, RG = 6 td(on) 13 25 ns
Turn-On Rise Time tr 36 60 ns
Turn-Off Delay Time td(off) 42 70 ns
Turn-Off Fall Time tf 34 60 ns
Input Capacitance VDS = -6V, VGS = 0V, f = 1.0 MHz Ciss 415 pF
Output Capacitance Coss 223 pF
Reverse Transfer Capacitance Crss 87 pF
Source-Drain Diode
Max. Diode Forward Current IS -1.6 A
Diode Forward Voltage IS = -1.6A, VGS = 0V VSD -0.8 -1.2 V

2409292333_BORN-SI2305_C344006.pdf

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