N Channel MOSFET Bruckewell MSD60N50 60 Volt Device with Low Miller Charge and Full Function Approval

Key Attributes
Model Number: MSD60N50
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
50A
Operating Temperature -:
-55℃~+150℃
RDS(on):
12mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
146pF
Number:
1 N-channel
Output Capacitance(Coss):
210pF
Pd - Power Dissipation:
52W
Input Capacitance(Ciss):
3.24nF
Gate Charge(Qg):
28.7nC@4.5V
Mfr. Part #:
MSD60N50
Package:
TO-252
Product Description

Product Overview

The MSD60N50 is an N-Channel 60-V (D-S) MOSFET from Bruckewell Technology Corporation. It utilizes advanced Trench technology and design to achieve excellent RDS(ON) with low gate charge, making it suitable for PWM, load switching, and general-purpose applications. This device is RoHS and Green Product compliant, with 100% EAS guaranteed and full functional reliability approval. Key features include low Miller charge, low input capacitance, and a guaranteed 100% EAS rating. Typical applications encompass motor drives, power tools, and LED lighting.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Line: MSD
  • Technology: Advanced Trench
  • Compliance: RoHS and Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved
  • Package Type: TO-252
  • Packing: 3,000/Reel, 2,500/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current1 (TC =25°C) 50 A
(TC =100°C) 32 A
IDM Pulsed Drain Current1,2 100 A
IAS Single Pulse Avalanche Current, L =0.1mH3 38 A
EAS Single Pulse Avalanche Energy, L =0.1mH3 72 mJ
PD Power Dissipation4 (TC =25°C) 52 W
TJ/TSTG Operating Junction and Storage Temperature -55 +150 °C
Thermal Resistance Ratings
RθJA Maximum Junction-to-Ambient1 62 °C/W
RθJC Maximum Junction-to-Case1 2.4 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =250µA 1.0 1.7 2.5 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =250µA 60 - - V
gfs Forward Transconductance VDS =5V, ID =30A - 42 - S
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V - - ±100 nA
IDSS Drain-Source Leakage Current VDS =48V, VGS =0V, TJ =25°C - - 1 µA
VDS =48V, VGS =0V, TJ =125°C - - 10 µA
RDS (on) Static Drain-Source On-Resistance2 VGS =10V, ID =30A - 10.5 12
VGS =4.5V, ID =15A - 12 15
EAS Single Pulse Avalanche Energy5 VDD =25V, L =0.1mH, IAS =26A 33.8 - - mJ
VSD Diode Forward Voltage2 IS =30A, VGS =0V, TJ =25°C - - 1.2 V
IS Continuous Source Current1,6 VG =VD =0V, Force Current - - 50 A
ISM Pulsed Source Current2,6 - - 100 A
Dynamic Characteristics
Qg Total Gate Charge2 VDS =48V ID =15A VGS =4.5V -- 28.7 -- nC
Qgs Gate-Source Charge -- 10.5 -- nC
Qgd Gate-Drain Charge -- 9.9 -- nC
td(on) Turn-On Delay Time2 VDS =30V ID =15A VGS =10V RG =3.3Ω -- 10.4 -- ns
tr Rise Time -- 9.2 -- ns
td(off) Turn-Off Delay Time -- 63 -- ns
tf Fall Time -- 4.8 -- ns
CISS Input Capacitance VDS =15V VGS =0V f =1.0MHz -- 3240 -- pF
COSS Output Capacitance -- 210 -- pF
CRSS Reverse Transfer Capacitance -- 146 -- pF
Rg Gate Resistance VGS =VDS =0V, f =1.0MHz -- 1.6 3.2 Ω

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows maximum rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=38A.
4. The power dissipation is limited by 150 junction temperature.
5. The Min. value is 100% EAS tested guarantee.
6. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2412061551_Bruckewell-MSD60N50_C42407727.pdf

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