Glass passivated junction bridge rectifier Chongqing Pingwei Tech TMBF310 designed for electronic applications
Product Overview
The TMBF310 is a single-phase, glass-passivated bridge rectifier designed for high-reliability applications. Featuring a molded plastic construction and high surge current capability, it is ideal for printed circuit board mounting. Its compact size and simple installation make it a versatile component for various electronic designs.
Product Attributes
- Brand: TMBF
- Certifications: UL 94V-0 (Epoxy), MIL-STD-202E (Lead)
- Material: Glass Passivated Junction, Molded Plastic Case
Technical Specifications
| Type Number | Symbol | Description | Value | Units |
|---|---|---|---|---|
| TMBF310 | VRRM | Maximum Recurrent Peak Reverse Voltage | 1000 | V |
| VRMS | Maximum RMS Voltage | 700 | V | |
| VDC | Maximum DC Blocking Voltage | 1000 | V | |
| IF(AV) | Maximum Average Forward Rectified Current | 3.0 | A | |
| IFSM | Peak Forward Surge Current (8.3ms single half sine-wave) | 95 | A | |
| VF Max | Forward Voltage at 3.0A DC | 1.1 | V | |
| VF Type | Forward Voltage at 1.5A DC | 0.88 | V | |
| IR | Maximum DC Reverse Current (@TA =25C, @ rated DC blocking voltage) | 5.0 | µA | |
| I2t | I2t Rating for Fusing (t<8.3ms) | 37.45 | A²Sec | |
| CJ | Typical Junction Capacitance Per Leg | 50 | pF | |
| RJA | Typical Thermal Resistance (Junction to Ambient) | 85 | °C /W | |
| RJC | Typical Thermal Resistance (Junction to Case) | 22 | °C /W | |
| TSTG | Storage Temperature | -55 to +150 | °C | |
| TJ | Operating Junction Temperature | -55 to +150 | °C |
2409302230_Chongqing-Pingwei-Tech-TMBF310_C360568.pdf
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