1 Amp Surface Mount Rectifier FUXINSEMI US1GA JEDEC SMA Package High Reliability Device
Key Attributes
Model Number:
US1GA
Product Custom Attributes
Reverse Leakage Current (Ir):
5uA
Non-Repetitive Peak Forward Surge Current:
30A
Reverse Recovery Time (trr):
500ns
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
400V
Current - Rectified:
1A
Mfr. Part #:
US1GA
Package:
SMA(DO-214AC)
Product Description
Product Overview
The US1AA thru US1MA series are 1.0A Surface Mount High Efficiency Rectifiers designed for a wide range of applications requiring fast switching and high reliability. These rectifiers feature a glass passivated chip junction, built-in strain relief for automated placement, and high forward surge current capability. Their ultra-fast switching characteristics contribute to high efficiency, while low reverse leakage and high temperature soldering guarantee performance in demanding environments. Ideal for surface mounted applications, these rectifiers are available in voltage ratings from 50V to 1000V.
Product Attributes
- Brand: Fuxinsemi
- Package Type: JEDEC SMA/DO-214AC
- Chip Technology: Glass passivated chip junction
- Terminal Finish: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
Technical Specifications
| Symbol | Description | US1AA | US1BA | US1DA | US1GA | US1JA | US1KA | US1MA | Units |
|---|---|---|---|---|---|---|---|---|---|
| VRRM | Maximum repetitive peak reverse voltage | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| VRMS | Maximum RMS voltage | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| VDC | Maximum DC blocking voltage | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| I(AV) | Maximum average forward rectified current at TL=100C | 1.0 | A | ||||||
| IFSM | Peak forward surge current 8.3ms single half sine-wave | 30.0 | A | ||||||
| VF | Maximum instantaneous forward voltage at 1.0A | 1.0 | V | ||||||
| IR | Maximum DC reverse current at TA=25C at rated DC blocking voltage | 5.0 | A | ||||||
| Maximum DC reverse current at TA=100C at rated DC blocking voltage | 50.0 | A | |||||||
| RJA | Typical thermal resistance (NOTE 3) | 75.0 | C/W | ||||||
| CJ | Typical junction capacitance (NOTE 2) | 15.0 | pF | ||||||
| trr | Maximum reverse recovery time (NOTE 1) | 50 | ns | ||||||
| TJ,TSTG | Operating junction and storage temperature range | -55 to +150 | C | ||||||
| Package Dimensions (inches / mm) | A 0.177(4.50) / 0.157(3.99) | B 0.108(2.75) / 0.096(2.45) | C 0.060(1.52) / 0.030(0.76) | D 0.012(0.305) / 0.006(0.152) | E 0.008(0.203)MAX. | F 0.096(2.42) / 0.078(1.98) | G 0.067 (1.70) / 0.051 (1.30) | ||
| Overall Dimensions (inches / mm) | H 0.208(5.28) / 0.188(4.80) | ||||||||
| Suggested Solder Pad Layout (inches / mm) | A 0.110 (2.80) | B 0.063 (1.60) | C 0.087 (2.20) | ||||||
Note 1: Reverse recovery condition IF=0.5A, IR=1.0A, Irr=0.25A
Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Note 3: P.C.B. mounted with 0.2x0.2 (5.0x5.0mm) copper pad areas
2010262108_FUXINSEMI-US1GA_C908220.pdf
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