RoHS Compliant P Channel MOSFET GL GL12P03-8 Featuring Low Gate Charge and Ultra Low RDS ON in SOP 8 Package

Key Attributes
Model Number: GL12P03-8
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
12A
Operating Temperature -:
-55℃~+150℃
RDS(on):
14mΩ@10V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
180pF
Number:
1 P-Channel
Output Capacitance(Coss):
220pF
Input Capacitance(Ciss):
1.8nF
Pd - Power Dissipation:
3W
Gate Charge(Qg):
25nC@10V
Mfr. Part #:
GL12P03-8
Package:
SOP-8
Product Description

Product Overview

The GL12P03-8 is a P-Channel Power MOSFET from Wuxi Guang Lei electronic technology co., LTD, utilizing advanced trench technology for excellent RDS(ON) and low gate charge. Designed for a wide variety of applications, it features a high-density cell design for ultra-low Rdson and is housed in a RoHS-compliant SOP-8 package. This MOSFET is suitable for power switching applications, hard switched and high-frequency circuits, and uninterruptible power supplies. It offers fully characterized avalanche voltage and current, with an excellent package for good heat dissipation.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei electronic technology co., LTD
  • Material: Silicon
  • Package Type: SOP-8
  • Certification: RoHS standard compliant

Technical Specifications

Symbol Parameter Test Conditions Rating Units
General Description
RDS(ON) VGS=10V <14 (Typ 11) m
Absolute Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage -30 V
ID Continuous Drain Current -12 A
ID Continuous Drain Current TC = 70 C -10 A
IDM Pulsed Drain Current -48 A
VGS Gate-to-Source Voltage 20 V
EAS L=0.5mH 140 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 3.0 W
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=250A -30 V
IDSS Drain to Source Leakage Current VDS=-30V, VGS= 0V,Ta=25 -- 1.0 A
IGSS(F) Gate to Source Forward Leakage VGS=+20V -- 0.1 A
IGSS(R) Gate to Source Reverse Leakage VGS=-20V -- -0.1 A
ON Characteristics
RDS(ON) Drain-to-Source On-Resistance VGS=-10V,ID=-10A -- 11 (Typ) / 14 (Max) m
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A -1 -3.0 V
Dynamic Characteristics
gfs Forward Transconductance VDS=-5V,ID=-10A 20 -- S
Ciss Input Capacitance VGS=0V,VDS=-15V, f=1.0MHz -- 1800 pF
Coss Output Capacitance -- 220 pF
Crss Reverse Transfer Capacitance -- 180 pF
Resistive Switching Characteristics
td(ON) Turn-on Delay Time VDD=-15V,ID=-10A, VGS=-10V,RG=3 -- 10 ns
tr Rise Time -- 9 ns
td(OFF) Turn-Off Delay Time -- 26 ns
tf Fall Time -- 11 ns
Qg Total Gate Charge VDD=-15V, ID=-10A, VGS=-10V -- 25 nC
Qgs Gate to Source Charge -- 4.0 nC
Qgd Gate to Drain (Miller)Charge -- 6 nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode) -- -12 A
VSD Diode Forward Voltage IS=-12A,VGS=0V -- -1.5 V
trr Reverse Recovery Time IS=-12A,Tj = 25C, dIF/dt=100A/us, VGS=0V -- 38 ns
Qrr Reverse Recovery Charge -- 30 nC
RJC Junction-to-Case 41.7 /W

2410121342_GL-GL12P03-8_C2886405.pdf

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