Metal Silicon Junction Surface Mount Rectifier FUXINSEMI SS2200 High Forward Surge Current Capability

Name: Metal Silicon Junction Surface Mount Rectifier FUXINSEMI SS2200 High Forward Surge Current Capability
Brand: Hefei Purple Horn E-Commerce Co., Ltd.
SKU: SS2200
Availability: InStock

Key Attributes

Model Number: SS2200

Product Custom Attributes

Reverse Leakage Current (Ir):

100uA@200V

Diode Configuration:

Independent

Voltage - DC Reverse (Vr) (Max):

200V

Voltage - Forward(Vf@If):

950mV@2A

Current - Rectified:

Mfr. Part #:

SS2200

Package:

SMA(DO-214AC)

Product Description

Product Overview

The Fuxinsemi SS22-SS2200 series are surface mount Schottky barrier rectifiers designed for applications requiring high efficiency and low power loss. These rectifiers feature a metal silicon junction for majority carrier conduction, offering high forward surge current capability and high temperature soldering reliability. Ideal for automated placement due to their built-in strain relief, they are suitable for various surface-mounted applications.

Product Attributes

Brand: Fuxinsemi
Package Type: SMA/DO-214AC
Material: Metal silicon junction
Certifications: RoHS 2.0 compliant, Underwriters Laboratory Flammability Classification 94V-0
Mounting: Surface mount, Any mounting position
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

Technical Specifications

Parameter	Symbol	SS22-SS24	SS25-SS26	SS28-SS2100	SS2150-SS2200	Units
Maximum repetitive peak reverse voltage	VRRM	20-40	50-60	80-100	150-200	V
Maximum RMS voltage	VRMS	20	30	40	50	V
Maximum DC blocking voltage	VDC	20	30	40	50	V
Maximum average forward rectified current at TL(see fig.1)	I(AV)	2.0	2.0	2.0	2.0	A
Peak forward surge current 8.3ms single half sine-wave superimposed on rated load	IFSM	150	150	150	150	A
Maximum instantaneous forward voltage at 2.0A	VF	0.55 - 0.95	0.55 - 0.95	0.55 - 0.95	0.55 - 0.95	V
Maximum DC reverse current TA=25 C at rated DC blocking voltage	IR	0.1	0.1	0.1	0.1	mA
Maximum DC reverse current TA=100 C at rated DC blocking voltage	IR	2.0	2.0	2.0	2.0	mA
Typical junction capacitance (NOTE 1)	CJ	20 - 105	20 - 105	20 - 105	20 - 105	pF
Typical thermal resistance (NOTE 2)	RJA	80	80	80	80	C/W
Operating junction temperature range	TJ	-55 to +150	-55 to +150	-55 to +150	-55 to +150	C
Storage temperature range	TSTG	-55 to +150	-55 to +150	-55 to +150	-55 to +150	C

Dimensions (SMA/DO-214AC)

Dimension	Inches	(Millimeters)
Length Overall	0.177 - 0.157	(4.50 - 3.99)
Width Overall	0.108 - 0.096	(2.75 - 2.45)
Height (Max)	0.060	(1.52)
Lead Width	0.012 - 0.006	(0.305 - 0.152)
Terminal to Terminal (Max)	0.008	(0.203)
Body Width	0.096 - 0.078	(2.42 - 1.98)
Body Height	0.067 - 0.051	(1.70 - 1.30)
Overall Length	0.208 - 0.188	(5.28 - 4.80)

Marking Code Example: SS24

Type Number: SS24

Marking Code: [Specific code not provided in text]

Soldering Condition (Reflow Soldering)

Parameter	Value	Unit
Average ramp-up rate (Tsmin to Tsmax)	<3	/sec
Preheat - Temperature Min (Tsmin)	150	C
Preheat - Temperature Max (Tsmax)	200	C
Preheat - Time (ts) (min to max)	60~120	sec
Ramp-up Rate (Tsmax to Tpeak)	<3	/sec
Time maintained above: Temperature (TL)	217	C
Time maintained above: Time (tL)	60~260	sec
Peak Temperature (Tpeak)	255 +0/-5	C
Time within 5 C of actual Peak Temperature (tp)	10~30	sec
Ramp-down Rate	<6	/sec
Time 25 C to Peak Temperature	<6	minutes

2307211403_FUXINSEMI-SS2200_C7467020.pdf

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