40V N Channel MOSFET HUASHUO HSBA4050A Fast Switching Device for High Current SMPS and DC DC Converter

Key Attributes
Model Number: HSBA4050A
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
110A
Operating Temperature -:
-55℃~+150℃
RDS(on):
2.2mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
102pF
Number:
1 N-channel
Output Capacitance(Coss):
1.719nF
Pd - Power Dissipation:
100W
Input Capacitance(Ciss):
-
Gate Charge(Qg):
52nC@10V
Mfr. Part #:
HSBA4050A
Package:
PRPAK5x6-8L
Product Description

Product Overview

The HSBA4050A is a N-Channel, 40V fast switching MOSFET designed for high-current applications. Featuring advanced trench technology, it offers low gate charge, high current capability, and 100% UIS tested performance. This MOSFET is suitable for Synchronous Rectification in SMPS, DC/DC Converters, and Or-ing applications. It is RoHS and Halogen-Free compliant.

Product Attributes

  • Brand: HS-Semi
  • Type: N-Channel MOSFET
  • Voltage Rating: 40V
  • Switching Speed: Fast
  • Compliance: RoHS and Halogen-Free

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 40 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1,6 110 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1,6 80 A
IDM Pulsed Drain Current2 440 A
EAS Single Pulse Avalanche Energy3 380 mJ
IAS Avalanche Current 50 A
PD@TC=25 Total Power Dissipation4 100 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 --- 55 /W
RJC Thermal Resistance Junction-Case1 --- 1.3 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 40 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A --- 2.2 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 2 --- 4 V
IDSS Drain-Source Leakage Current VDS=40V , VGS=0V , TJ=25 --- 1 uA
IDSS Drain-Source Leakage Current VDS=40V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=20A 61 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.9
Qg Total Gate Charge VDS=15V , VGS=10V , ID=20A --- 52 nC
Qgs Gate-Source Charge --- 11 nC
Qgd Gate-Drain Charge --- 7.5 nC
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3.3, ID=20A --- 16 ns
Tr Rise Time --- 7.5 ns
Td(off) Turn-Off Delay Time --- 48 ns
Tf Fall Time --- 13.6 ns
Ciss Input Capacitance VDS=20V , VGS=0V , f=1MHz --- 3572 pF
Coss Output Capacitance --- 1719 pF
Crss Reverse Transfer Capacitance --- 102 pF
Diode Characteristics
IS Continuous Source Current1,6 VG=VD=0V , Force Current --- 110 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1.2 V
trr Reverse Recovery Time IF=20A , dI/dt=100A/s , TJ=25 --- 44 ns
Qrr Reverse Recovery Charge --- 33 nC

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width 300us, duty cycle 2%.
3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.5mH, IAS=50A.
4. The power dissipation is limited by 150 junction temperature.
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
6. Package limitation current is 100A.


2411061707_HUASHUO-HSBA4050A_C42376804.pdf

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