High Cell Density P Channel MOSFET HUASHUO HSP4119 Designed for Switching in Buck Converter Circuits

Key Attributes
Model Number: HSP4119
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
150A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.9mΩ@10V;4.9mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
660pF
Number:
1 P-Channel
Output Capacitance(Coss):
780pF
Input Capacitance(Ciss):
10.7nF
Pd - Power Dissipation:
200W
Gate Charge(Qg):
190nC@10V
Mfr. Part #:
HSP4119
Package:
TO-220
Product Description

HSP4119 P-Channel 40V Fast Switching MOSFET

The HSP4119 is a high cell density trenched P-channel MOSFET designed for excellent RDS(ON) and gate charge, making it ideal for most synchronous buck converter applications. It meets RoHS and Green Product requirements, is 100% EAS guaranteed, and offers full function reliability approval. Key features include super low gate charge, excellent CdV/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: P-Channel MOSFET
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed, Full Function Reliability Approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -40 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1,6 -150 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1,6 -103 A
IDM Pulsed Drain Current2 -580 A
EAS Single Pulse Avalanche Energy3 1250 mJ
IAS Avalanche Current -70 A
PD@TC=25 Total Power Dissipation4 200 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-ambient 1(Steady State) --- 62 /W
RJC Thermal Resistance Junction-case 1 --- 0.95 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -40 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-30A 3.9 4.5 m
RDS(ON) Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-20A 4.9 5.6 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.0 --- -2.5 V
IDSS Drain-Source Leakage Current VDS=-40V , VGS=0V , TJ=25 --- -1 uA
IDSS Drain-Source Leakage Current VDS=-40V , VGS=0V , TJ=125 --- -100 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- ±100 nA
Rg Gate resistance VDS=0V , VGS=0V , f=1MHz 1.7
Qg Total Gate Charge (-10V) VDS=-20V , VGS=-10V , ID=-20A 190 --- nC
Qgs Gate-Source Charge 24 ---
Qgd Gate-Drain Charge 38 ---
td(on) Turn-On Delay Time VDD=-20V , VGS=-10V , RG=3, ID=-10A 18 --- ns
tr Rise Time 3.6 ---
td(off) Turn-Off Delay Time 21 ---
tf Fall Time 39 ---
Ciss Input Capacitance VDS=-20V , VGS=0V , f=1MHz 10700 --- pF
Coss Output Capacitance 780 ---
Crss Reverse Transfer Capacitance 660 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- -150 A
VSD Diode Forward Voltage2 VGS=0V , IS=-20A , TJ=25 --- -1.2 V
trr Reverse Recovery Time IF=-20A , di/dt=100A/s , TJ=25 52 --- nS
Qrr Reverse Recovery Charge 128 --- nC

2504101957_HUASHUO-HSP4119_C22359313.pdf
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