Power Conversion MOSFET HUASHUO HSBB3060 Featuring N Channel Fast Switching and 45A Continuous Current

Key Attributes
Model Number: HSBB3060
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
45A
Operating Temperature -:
-55℃~+150℃
RDS(on):
9.8mΩ@10V,12A
Gate Threshold Voltage (Vgs(th)):
1.3V
Reverse Transfer Capacitance (Crss@Vds):
28pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
562pF@15V
Pd - Power Dissipation:
21W
Gate Charge(Qg):
4.5nC@4.5V
Mfr. Part #:
HSBB3060
Package:
PRPAK3x3-8L
Product Description

Product Overview

The HSBB3060 is a high-performance N-Channel Fast Switching MOSFET designed for efficient power management. Featuring a 30V Drain-Source Voltage and a continuous drain current of up to 45A, this MOSFET is ideal for applications such as power management in desktop computers, DC/DC converters in telecom and industrial sectors, and isolated DC/DC converters. It boasts advanced high cell density Trench technology, offering super low gate charge and excellent CdV/dt effect decline. The device is 100% EAS guaranteed and available as a Green Device.

Product Attributes

  • Brand: HS-Semi
  • Product Line: HSBB
  • Technology: Trench
  • Channel Type: N-Channel
  • Switching Speed: Fast
  • Availability: Green Device Available

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V 45 A
ID@TC=100 Continuous Drain Current, VGS @ 10V 28 A
IDM Pulsed Drain Current 50 A
EAS Single Pulse Avalanche Energy 33 mJ
IAS Avalanche Current 26 A
PD@TC=25 Total Power Dissipation 21 W
PD@TA=25 Total Power Dissipation 1.8 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient --- 65 /W
RJC Thermal Resistance Junction-Case --- 6 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA --- 0.021 --- V/
RDS(ON) Static Drain-Source On-Resistance VGS=10V , ID=12A --- 8 9.8 m
VGS=4.5V , ID=12A --- 12 15.8 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.3 1.7 2.3 V
VGS(th) VGS(th) Temperature Coefficient --- -5.73 --- mV/
IDSS Drain-Source Leakage Current VDS=24V , VGS=0V , TJ=25 --- --- 1 uA
VDS=24V , VGS=0V , TJ=55 --- --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- --- 100 nA
gfs Forward Transconductance VDS=5V , ID=12A --- 45 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 1 3 5
Qg Total Gate Charge (4.5V) VDS=15V , VGS=10V , ID=12A --- 4.5 --- nC
Qgs Gate-Source Charge --- 2.4 --- nC
Qgd Gate-Drain Charge --- 1.6 --- nC
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=3 ID=12A --- 5 --- ns
Tr Rise Time --- 3.7 --- ns
Td(off) Turn-Off Delay Time --- 18.5 --- ns
Tf Fall Time --- 3.2 --- ns
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 562 --- pF
Coss Output Capacitance --- 274 --- pF
Crss Reverse Transfer Capacitance --- 28 --- pF
Diode Characteristics
IS Continuous Source Current VG=VD=0V , Force Current --- --- 45 A
VSD Diode Forward Voltage VGS=0V , IS=1A , TJ=25 --- --- 1 V
Ordering Information
Part Number Package code Packaging
HSBB3060 PRPAK3*3 3000/Tape&Reel

Note: Data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper unless otherwise specified. Pulsed data uses pulse width 300s, duty cycle 2%. EAS data shows Max. rating with test conditions VDD=25V, VGS=10V, L=0.1mH, IAS=26A. Power dissipation is limited by 150 junction temperature. Continuous Source Current is theoretically the same as ID and IDM, but should be limited by total power dissipation in real applications.


2410121503_HUASHUO-HSBB3060_C701036.pdf

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