Fast Switching N Channel MOSFET HUASHUO HSBA30N20 with 200V Drain Source Voltage and Low Gate Charge
HSBA30N20 N-Ch 200V Fast Switching MOSFETs
Product Overview
The HSBA30N20 is a high-performance N-channel MOSFET designed for fast switching applications. Featuring proprietary new trench technology, it offers a low on-resistance of 43m typ. at VGS=10V and a low gate charge to minimize switching losses. Its fast recovery body diode makes it suitable for synchronous rectification in SMPS, motor control, and hard switching high-speed circuits. With a drain-source voltage rating of 200V and a continuous drain current of 30A, this MOSFET provides reliable performance for demanding industrial applications.Product Attributes
- Brand: HS-Semi
- Product Type: N-Channel Fast Switching MOSFET
- Technology: Proprietary New Trench Technology
- Package Code: PRPAK5*6
- Packaging: 3000/Tape&Reel
Technical Specifications
| Symbol | Parameter | Conditions | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | 200 | V | |||
| VGS | Gate-Source Voltage | ±20 | V | |||
| ID@TC=25 | Continuous Drain Current, VGS @ 10V1 | 30 | A | |||
| ID@TC=100 | Continuous Drain Current, VGS @ 10V1 | 21 | A | |||
| IDM | Pulsed Drain Current2 | 120 | A | |||
| EAS | Single Pulse Avalanche Energy3 | 200 | mJ | |||
| dv/dt | Peak Diode Recovery dv/dt | 5 | V/nS | |||
| PD@TC=25 | Total Power Dissipation3 | 150 | W | |||
| TSTG | Storage Temperature Range | -55 | 175 | |||
| TJ | Operating Junction Temperature Range | -55 | 175 | |||
| Thermal Data | ||||||
| RJA | Thermal Resistance Junction-ambient | --- | 50 | /W | ||
| RJC | Thermal Resistance Junction-Case1 | --- | 1.0 | /W | ||
| Product Summary | ||||||
| VDS | 200 | V | ||||
| RDS(ON),max | 48 | m | ||||
| ID | 30 | A | ||||
| Electrical Characteristics (TJ=25 , unless otherwise noted) | ||||||
| BVDSS | Drain-Source Breakdown Voltage | VGS=0V , ID=250uA | 200 | --- | --- | V |
| RDS(ON) | Static Drain-Source On-Resistance2 | VGS=10V , ID=20A | 43 | 48 | m | |
| VGS=4.5V , ID=20A | 50 | 60 | m | |||
| VGS(th) | Gate Threshold Voltage | VGS=VDS , ID =250uA | 1.0 | --- | 3.0 | V |
| IDSS | Drain-Source Leakage Current | VDS=200V , VGS=0V , TJ=25 | --- | --- | 1 | uA |
| VDS=160V , VGS=0V , TJ=125 | --- | --- | 100 | uA | ||
| IGSS | Gate-Source Leakage Current | VGS=±20V , VDS=0V | --- | --- | ±100 | nA |
| Qg | Total Gate Charge | VDS=100V , VGS=10V , ID=15A | --- | 49 | --- | nC |
| Qgs | Gate-Source Charge | --- | 11 | --- | ||
| Qgd | Gate-Drain Charge | --- | 8 | --- | ||
| Td(on) | Turn-On Delay Time | VDD=100V , VGS=10V , RG=10 ID=15A | --- | 22 | --- | ns |
| Tr | Rise Time | --- | 5.2 | --- | ||
| Td(off) | Turn-Off Delay Time | --- | 75 | --- | ns | |
| Tf | Fall Time | --- | 11 | --- | ||
| Ciss | Input Capacitance | VDS=100V , VGS=0V , f=1MHz | --- | 3490 | --- | pF |
| Coss | Output Capacitance | --- | 13 | --- | ||
| Crss | Reverse Transfer Capacitance | --- | 86 | --- | ||
| Diode Characteristics | ||||||
| IS | Continuous Source Current1,5 | VG=VD=0V , Force Current | --- | --- | 30 | A |
| ISM | Pulsed Source Current2,5 | --- | --- | 120 | A | |
| VSD | Diode Forward Voltage2 | VGS=0V , IS=1A , TJ=25 | --- | --- | 1.2 | V |
| trr | Reverse Recovery Time | IF=15A , dI/dt=100A/s , TJ=25 | --- | 117 | --- | nS |
| Qrr | Reverse Recovery Charge | --- | 333 | --- | nC | |
Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤300µs, duty cycle ≤2%.
3. The power dissipation is limited by 150 junction temperature.
4. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
5. The source current is equivalent to the drain current.
2411061706_HUASHUO-HSBA30N20_C42376806.pdf
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