Fast Switching N Channel MOSFET HUASHUO HSBA30N20 with 200V Drain Source Voltage and Low Gate Charge

Key Attributes
Model Number: HSBA30N20
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
200V
Current - Continuous Drain(Id):
30A
RDS(on):
48mΩ@10V
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
86pF
Number:
1 N-channel
Output Capacitance(Coss):
13pF
Input Capacitance(Ciss):
3.49nF
Pd - Power Dissipation:
150W
Gate Charge(Qg):
49nC@10V
Mfr. Part #:
HSBA30N20
Package:
PRPAK5x6-8L
Product Description

HSBA30N20 N-Ch 200V Fast Switching MOSFETs

Product Overview

The HSBA30N20 is a high-performance N-channel MOSFET designed for fast switching applications. Featuring proprietary new trench technology, it offers a low on-resistance of 43m typ. at VGS=10V and a low gate charge to minimize switching losses. Its fast recovery body diode makes it suitable for synchronous rectification in SMPS, motor control, and hard switching high-speed circuits. With a drain-source voltage rating of 200V and a continuous drain current of 30A, this MOSFET provides reliable performance for demanding industrial applications.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Channel Fast Switching MOSFET
  • Technology: Proprietary New Trench Technology
  • Package Code: PRPAK5*6
  • Packaging: 3000/Tape&Reel

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 200 V
VGS Gate-Source Voltage ±20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 30 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 21 A
IDM Pulsed Drain Current2 120 A
EAS Single Pulse Avalanche Energy3 200 mJ
dv/dt Peak Diode Recovery dv/dt 5 V/nS
PD@TC=25 Total Power Dissipation3 150 W
TSTG Storage Temperature Range -55 175
TJ Operating Junction Temperature Range -55 175
Thermal Data
RJA Thermal Resistance Junction-ambient --- 50 /W
RJC Thermal Resistance Junction-Case1 --- 1.0 /W
Product Summary
VDS 200 V
RDS(ON),max 48 m
ID 30 A
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 200 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=20A 43 48 m
VGS=4.5V , ID=20A 50 60 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.0 --- 3.0 V
IDSS Drain-Source Leakage Current VDS=200V , VGS=0V , TJ=25 --- --- 1 uA
VDS=160V , VGS=0V , TJ=125 --- --- 100 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA
Qg Total Gate Charge VDS=100V , VGS=10V , ID=15A --- 49 --- nC
Qgs Gate-Source Charge --- 11 ---
Qgd Gate-Drain Charge --- 8 ---
Td(on) Turn-On Delay Time VDD=100V , VGS=10V , RG=10 ID=15A --- 22 --- ns
Tr Rise Time --- 5.2 ---
Td(off) Turn-Off Delay Time --- 75 --- ns
Tf Fall Time --- 11 ---
Ciss Input Capacitance VDS=100V , VGS=0V , f=1MHz --- 3490 --- pF
Coss Output Capacitance --- 13 ---
Crss Reverse Transfer Capacitance --- 86 ---
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 30 A
ISM Pulsed Source Current2,5 --- --- 120 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- --- 1.2 V
trr Reverse Recovery Time IF=15A , dI/dt=100A/s , TJ=25 --- 117 --- nS
Qrr Reverse Recovery Charge --- 333 --- nC

Notes:
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤300µs, duty cycle ≤2%.
3. The power dissipation is limited by 150 junction temperature.
4. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.
5. The source current is equivalent to the drain current.


2411061706_HUASHUO-HSBA30N20_C42376806.pdf
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