High cell density trenched MOSFET HUASHUO HSL6101 designed for synchronous buck converter power management

Key Attributes
Model Number: HSL6101
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
4.3A
Operating Temperature -:
-55℃~+150℃
RDS(on):
110mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
34pF@15V
Number:
1 P-Channel
Output Capacitance(Coss):
51pF
Input Capacitance(Ciss):
715pF@15V
Pd - Power Dissipation:
2W
Gate Charge(Qg):
5.9nC@4.5V
Mfr. Part #:
HSL6101
Package:
SOT-223
Product Description

Product Overview

The HSL6101 is a high cell density trenched P-channel MOSFET designed for fast switching applications, particularly in synchronous buck converter designs. It offers excellent RDS(ON) and gate charge characteristics. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full functional reliability approval. Key advantages include super low gate charge and excellent Cdv/dt effect decline, leveraging advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Certifications: RoHS, Green Product
  • Guarantees: 100% EAS Guaranteed

Technical Specifications

Model Package Packaging VDS (V) RDS(ON) (m) ID (A) Qg (nC) RJA (C/W) RJC (C/W)
HSL6101 SOT-223 3000/Tape&Reel -60 130 (max) -4.3 5.9 (typ) 62.5 (max) 10 (typ)
Parameter Conditions Min. Typ. Max. Unit
VDS Drain-Source Voltage -60 V
VGS Gate-Source Voltage 20 V
ID@TA=25 Continuous Drain Current, VGS @ -10V -4.3 A
ID@TA=70 Continuous Drain Current, VGS @ -10V -3.5 A
IDM Pulsed Drain Current -14 A
PD@TA=25 Total Power Dissipation 2 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
BVDSS Drain-Source Breakdown Voltage (VGS=0V, ID=-250uA) -60 V
BVDSS/TJ BVDSS Temperature Coefficient (Ref. to 25, ID=-1mA) -0.021 V/
RDS(ON) Static Drain-Source On-Resistance (VGS=-10V, ID=-2A) 110 130 m
RDS(ON) Static Drain-Source On-Resistance (VGS=-4.5V, ID=-1.5A) 140 190 m
VGS(th) Gate Threshold Voltage (VGS=VDS, ID =-250uA) -1.0 -2.5 V
VGS(th) VGS(th) Temperature Coefficient 4.08 mV/
IDSS Drain-Source Leakage Current (VDS=-48V, VGS=0V, TJ=25) 1 uA
IDSS Drain-Source Leakage Current (VDS=-48V, VGS=0V, TJ=55) 5 uA
IGSS Gate-Source Leakage Current (VGS=20V, VDS=0V) 100 nA
gfs Forward Transconductance (VDS=-10V, ID=-2A) 5.8 S
Qg Total Gate Charge (-4.5V) (VDS=-20V, VGS=-4.5V, ID=-2A) 5.9 nC
Qgs Gate-Source Charge 2.9 nC
Qgd Gate-Drain Charge 1.8 nC
td(on) Turn-On Delay Time (VDS=-15V, VGS=-10V, RG=3.3, ID=-1A) 10 ns
tr Rise Time 17 ns
td(off) Turn-Off Delay Time 22 ns
tf Fall Time 21 ns
Ciss Input Capacitance (VDS=-15V, VGS=0V, f=1MHz) 715 pF
Coss Output Capacitance 51 pF
Crss Reverse Transfer Capacitance 34 pF
IS Continuous Source Current (VG=VD=0V, Force Current) -4 A
VSD Diode Forward Voltage (VGS=0V, IS=-1A, TJ=25) -1.2 V

2410121641_HUASHUO-HSL6101_C5128192.pdf
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