60V P channel MOSFET HUASHUO HSK6113 trench technology fast switching excellent RDS ON performance

Key Attributes
Model Number: HSK6113
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
4A
Operating Temperature -:
-55℃~+150℃
RDS(on):
-
Gate Threshold Voltage (Vgs(th)):
2.5V
Reverse Transfer Capacitance (Crss@Vds):
50pF@15V
Number:
1 P-Channel
Input Capacitance(Ciss):
1.08nF@15V
Pd - Power Dissipation:
1.8W
Gate Charge(Qg):
11.8nC@4.5V
Mfr. Part #:
HSK6113
Package:
SOT-89
Product Description

Product Overview

The HSK6113 is a P-channel, 60V fast-switching MOSFET designed with high cell density trench technology. It offers excellent RDS(ON) and gate charge, making it suitable for most synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Key features include super low gate charge and excellent Cdv/dt effect decline.

Product Attributes

  • Brand: HSK
  • Type: P-Channel MOSFET
  • Voltage Rating: 60V
  • Technology: Trench
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS Guaranteed

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VDS Drain-Source Voltage -60 V
VGS Gate-Source Voltage ±20 V
ID@TA=25 Continuous Drain Current, VGS @ -10V1 -4 A
ID@TA=70 Continuous Drain Current, VGS @ -10V1 -3 A
IDM Pulsed Drain Current2 -8.2 A
EAS Single Pulse Avalanche Energy3 29.7 mJ
IAS Avalanche Current 24.4 A
PD@TA=25 Total Power Dissipation4 1.8 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
Thermal Data
RJA Thermal Resistance Junction-Ambient1 85 /W
RJC Thermal Resistance Junction-Case1 24 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=-250uA -60 V
ΔBVDSS/ΔTJ BVDSS Temperature Coefficient Reference to 25 , ID=-1mA -0.03 V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V , ID=-3A 90 m
VGS=-4.5V , ID=-2A 115 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -1.2 -2.5 V
ΔVGS(th) VGS(th) Temperature Coefficient 4.56 mV/
IDSS Drain-Source Leakage Current VDS=-48V , VGS=0V , TJ=25 1 uA
VDS=-48V , VGS=0V , TJ=55 5 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V ±100 nA
gfs Forward Transconductance VDS=-5V , ID=-3A 8.7 S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 15
Qg Total Gate Charge (-4.5V) VDS=-48V , VGS=-4.5V , ID=-3A 11.8 nC
Qgs Gate-Source Charge 1.9 nC
Qgd Gate-Drain Charge 6.5 nC
td(on) Turn-On Delay Time VDD=-15V , VGS=-10V , RG=3.3, ID=-1A 8.8 ns
tr Rise Time 19.6 ns
td(off) Turn-Off Delay Time 47.2 ns
tf Fall Time 9.6 ns
Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz 1080 pF
Coss Output Capacitance 73 pF
Crss Reverse Transfer Capacitance 50 pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current -4 A
ISM Pulsed Source Current2,5 -8.2 A
VSD Diode Forward Voltage2 VGS=0V , IS=-1A , TJ=25 -1.2 V

Notes:

  • 1. Data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
  • 2. Data tested by pulsed, pulse width ≤ 300us, duty cycle ≤ 2%.
  • 3. EAS data shows Max. rating. Test condition: VDD=-25V, VGS=-10V, L=0.1mH, IAS=-24.4A.
  • 4. Power dissipation is limited by 150 junction temperature.
  • 5. Data is theoretically the same as ID and IDM. In real applications, should be limited by total power dissipation.
Part Number Package Code Packaging
HSK6113 SOT-89 1000/Tape&Reel

2410121456_HUASHUO-HSK6113_C5341684.pdf
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