power conversion N channel MOSFET HUASHUO HSH044N25 with low gate charge and high cell density trench technology

Key Attributes
Model Number: HSH044N25
Product Custom Attributes
Drain To Source Voltage:
250V
Current - Continuous Drain(Id):
50A
Operating Temperature -:
-55℃~+175℃
RDS(on):
44mΩ@10V
Gate Threshold Voltage (Vgs(th)):
5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
85pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
8.547nF@50V
Pd - Power Dissipation:
83W
Gate Charge(Qg):
155nC@10V
Mfr. Part #:
HSH044N25
Package:
TO-263
Product Description

Product Overview

The HSH044N25 is a high-performance N-channel MOSFET featuring an extreme high cell density trench technology. It offers excellent RDS(ON) and gate charge characteristics, making it ideal for synchronous buck converter applications. This device meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approved. Key advantages include super low gate charge, excellent Cdv/dt effect decline, and advanced high cell density trench technology.

Product Attributes

  • Brand: HS-Semi
  • Product Type: N-Ch Fast Switching MOSFETs
  • Certifications: RoHS, Green Product
  • Reliability: 100% EAS guaranteed, full function reliability approved

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 250 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 50 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 34 A
IDM Pulsed Drain Current2 195 A
EAS Single Pulse Avalanche Energy3 165 mJ
PD@TC=25 Total Power Dissipation3 83 W
TSTG Storage Temperature Range -55 175
TJ Operating Junction Temperature Range -55 175
Thermal Data
RJA Thermal Resistance Junction-ambient1 --- 60 /W
RJC Thermal Resistance Junction-Case1 --- 0.48 /W
Electrical Characteristics (TJ=25 , unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 250 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=5A --- 34 44 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 3 --- 5 V
IDSS Drain-Source Leakage Current VDS=150V , VGS=0V , TJ=25 --- --- 1 uA
IDSS Drain-Source Leakage Current VDS=150V , VGS=0V , TJ=125 --- --- 100 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- --- 100 nA
gfs Forward Transconductance VDS=10V , ID=20A --- 75 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.5 ---
Qg Total Gate Charge (10V) VDS=50V , VGS=10V , ID=40A --- 155 --- nC
Qgs Gate-Source Charge --- 23 --- nC
Qgd Gate-Drain Charge --- 45 --- nC
td(on) Turn-On Delay Time VDD=50V , VGS=10V , RG=3.3, ID=40A --- 33 --- ns
tr Rise Time --- 8.2 --- ns
td(off) Turn-Off Delay Time --- 65 --- ns
tf Fall Time --- 6 --- ns
Ciss Input Capacitance VDS=50V , VGS=0V , f=1MHz --- 8547 --- pF
Coss Output Capacitance --- 429 --- pF
Crss Reverse Transfer Capacitance --- 85 --- pF
Diode Characteristics
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- --- 50 A
VSD Diode Forward Voltage2 VGS=0V , IS=20A , TJ=25 --- --- 1.2 V
trr Reverse Recovery Time IF=40A , dI/dt=100A/s , TJ=25 --- 157 --- ns
Qrr Reverse Recovery Charge --- 1073 --- nC

2410122017_HUASHUO-HSH044N25_C28314525.pdf
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