Power MOSFET HUAYI HYG009N04LS1C2 designed for switching and power management in electronic circuits

Key Attributes
Model Number: HYG009N04LS1C2
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
200A
Operating Temperature -:
-55℃~+175℃
RDS(on):
1.4mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
58pF
Number:
1 N-channel
Output Capacitance(Coss):
1.278nF
Input Capacitance(Ciss):
5.876nF
Pd - Power Dissipation:
75W
Gate Charge(Qg):
89nC@10V
Mfr. Part #:
HYG009N04LS1C2
Package:
PDFN5x6-8L
Product Description

Product Overview

The HYG009N04LS1C2 is a single N-Channel Enhancement Mode MOSFET from Hymexa, designed for switching applications and power management in DC/DC converters. It features low on-state resistance (RDS(ON) = 0.75m typ. @VGS = 10V), 100% avalanche tested, and a reliable, rugged design. Halogen-free options are available.

Product Attributes

  • Brand: Hymexa
  • Origin: China (Huayi Microelectronics Co., Ltd.)
  • Certifications: RoHS compliant, Halogen-free

Technical Specifications

ParameterSymbolTest ConditionsMinTyp.MaxUnit
Absolute Maximum Ratings
Drain-Source VoltageVDSSTc=25C Unless Otherwise Noted--40V
Gate-Source VoltageVGSSTc=25C Unless Otherwise Noted--±20V
Junction Temperature RangeTJTc=25C Unless Otherwise Noted-55-175°C
Storage Temperature RangeTSTGTc=25C Unless Otherwise Noted-55-175°C
Source Current-Continuous (Body Diode)ISTc=25°C, Mounted on Large Heat Sink--200A
Pulsed Drain CurrentIDMTc=25°C--800A
Continuous Drain CurrentIDTc=25°C--200A
Continuous Drain CurrentIDTc=100°C--141A
Maximum Power DissipationPDTc=25°C--75W
Maximum Power DissipationPDTc=100°C--37.5W
Thermal Resistance, Junction-to-CaseRθJC--2-°C/W
Thermal Resistance, Junction-to-AmbientRθJASurface mounted on FR-4 board.-45-°C/W
Single Pulsed-Avalanche EnergyEASL=0.3mH, Limited by TJmax, starting TJ=25°C-780-mJ
Electrical Characteristics
Drain-Source Breakdown VoltageBVDSSVGS=0V,IDS=250μA40--V
Drain-to-Source Leakage CurrentIDSSVDS=40V,VGS=0V--1μA
Drain-to-Source Leakage CurrentIDSSTJ=125°C--50μA
Gate Threshold VoltageVGS(th)VDS=VGS, IDS=250μA1.01.83.0V
Gate-Source Leakage CurrentIGSSVGS=±20V,VDS=0V--±100nA
Drain-Source On-State ResistanceRDS(ON)VGS=10V,IDS=40A-0.750.96
Drain-Source On-State ResistanceRDS(ON)VGS=4.5V,IDS=40A-1.051.40
Diode Characteristics
Diode Forward VoltageVSDISD=20A,VGS=0V-0.751.2V
Reverse Recovery TimetrrISD=40A,dISD/dt=100A/μs-45-ns
Reverse Recovery ChargeQrr--51-nC
Dynamic Characteristics
Gate ResistanceRGVGS=0V,VDS=0V, Frequency=1.0MHz-1.9-Ω
Input CapacitanceCissVGS=0V, VDS=25V, Frequency=1.0MHz-5876-pF
Output CapacitanceCossVGS=0V, VDS=25V, Frequency=1.0MHz-1278-pF
Reverse Transfer CapacitanceCrssVGS=0V, VDS=25V, Frequency=1.0MHz-58-pF
Turn-on Delay Timetd(ON)VDD=20V,RG=2.5Ω, IDS=40A,VGS=10V-15-ns
Turn-on Rise TimeTrVDD=20V,RG=2.5Ω, IDS=40A,VGS=10V-98-ns
Turn-off Delay Timetd(OFF)VDD=20V,RG=2.5Ω, IDS=40A,VGS=10V-215-ns
Turn-off Fall TimeTfVDD=20V,RG=2.5Ω, IDS=40A,VGS=10V-99-ns
Gate Charge Characteristics
Total Gate ChargeQgVGS=10V, VDS =32V, ID=40A-89-nC
Total Gate ChargeQgVGS=4.5V, VDS =32V, ID=40A-41-nC
Gate-Source ChargeQgsVGS=10V, VDS =32V, ID=40A-20-nC
Gate-Drain ChargeQgdVGS=10V, VDS =32V, ID=40A-14-nC

2410121306_HUAYI-HYG009N04LS1C2_C2890387.pdf

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