N Channel Enhancement Mode MOSFET HUAYI HYG043N10NS2B with 100V 164A rating and low on state resistance

Key Attributes
Model Number: HYG043N10NS2B
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
164A
Operating Temperature -:
-
RDS(on):
4.8mΩ@10V,50A
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
196pF
Number:
1 N-channel
Output Capacitance(Coss):
2.234nF
Pd - Power Dissipation:
258.6W
Input Capacitance(Ciss):
6.236nF
Gate Charge(Qg):
100nC@10V
Mfr. Part #:
HYG043N10NS2B
Package:
TO-263-2L
Product Description

HYG043N10NS2P/B N-Channel Enhancement Mode MOSFET

The HYG043N10NS2P/B is a high-performance N-Channel Enhancement Mode MOSFET designed for demanding applications. It features a low on-state resistance of 3.5 m (typ.) at VGS = 10V, 100V/164A rating, and 100% avalanche tested for reliability. This rugged device is suitable for Battery Management Systems and controllers, offering a robust and efficient solution.

Product Attributes

  • Brand: HYG (Huayi Microelectronics)
  • Origin: China
  • Certifications: Halogen Free and Green Devices Available (RoHS Compliant)

Technical Specifications

ParameterSymbolTest ConditionsMinTyp.MaxUnit
Absolute Maximum Ratings
Drain-Source VoltageVDSSTc=25C Unless Otherwise Noted-100-V
Gate-Source VoltageVGSS--20-V
Junction Temperature RangeTJ--55-175C
Storage Temperature RangeTSTG--55-175C
Source Current-Continuous (Body Diode)ISTc=25C, Mounted on Large Heat Sink-164-A
Pulsed Drain CurrentIDMTc=25C, Pulse width limited by max.junction temperature-590-A
Continuous Drain CurrentIDTc=25C-164-A
Continuous Drain CurrentIDTc=100C-116-A
Maximum Power DissipationPDTc=25C-258.6-W
Maximum Power DissipationPDTc=100C-129.3-W
Thermal Resistance, Junction-to-CaseRJC--0.58-C/W
Thermal Resistance, Junction-to-AmbientRJASurface mounted on 1in FR-4 board-62.5-C/W
Single Pulsed-Avalanche EnergyEASL=0.3mH, Limited by TJmax, starting TJ=25C, RG=25, VGS=10V-640-mJ
Electrical Characteristics
Drain-Source Breakdown VoltageBVDSSVGS=0V, IDS=250A100--V
Drain-to-Source Leakage CurrentIDSSVDS=100V,VGS=0V--1A
Drain-to-Source Leakage CurrentIDSSTJ=125C, VDS=100V,VGS=0V--50A
Gate Threshold VoltageVGS(th)VDS=VGS, IDS=250A23.24V
Gate-Source Leakage CurrentIGSSVGS=20V,VDS=0V--100nA
Drain-Source On-State ResistanceRDS(ON)VGS=10V,IDS=50A-3.54.8m
Diode Forward VoltageVSDISD=50A,VGS=0V-0.91.3V
Reverse Recovery TimetrrISD=50A,dISD/dt=100A/s-57-ns
Reverse Recovery ChargeQrrISD=50A,dISD/dt=100A/s-94-nC
Dynamic Characteristics
Gate ResistanceRGVGS=0V,VDS=0V,F=1MHz-1-
Input CapacitanceCissVGS=0V, VDS=25V, Frequency=1MHz-6236-pF
Output CapacitanceCossVGS=0V, VDS=25V, Frequency=1MHz-2234-pF
Reverse Transfer CapacitanceCrssVGS=0V, VDS=25V, Frequency=1MHz-196-pF
Turn-on Delay Timetd(ON)VDD=50V,RG=2.5, IDS=50A,VGS=10V-24-ns
Turn-on Rise TimeTrVDD=50V,RG=2.5, IDS=50A,VGS=10V-84-ns
Turn-off Delay Timetd(OFF)VDD=50V,RG=2.5, IDS=50A,VGS=10V-47-ns
Turn-off Fall TimeTfVDD=50V,RG=2.5, IDS=50A,VGS=10V-71-ns
Gate Charge Characteristics
Total Gate ChargeQgVDS=80V, IDs=50A, VGS=10V-100-nC
Gate-Source ChargeQgsVDS=80V, IDs=50A, VGS=10V-35-nC
Gate-Drain ChargeQgdVDS=80V, IDs=50A, VGS=10V-24-nC
Gate plateau voltageVplateauVDS=80V, IDs=50A, VGS=10V-5.3-V

2410121317_HUAYI-HYG043N10NS2B_C19268964.pdf

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