High power Infineon FZ600R12KE4 IGBT module with 1200 volt voltage and 600 amp continuous current rating

Key Attributes
Model Number: FZ600R12KE4
Product Custom Attributes
Pd - Power Dissipation:
3kW
Td(off):
610ns
Td(on):
240ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
1.7nF
Input Capacitance(Cies):
42nF
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
5.2V@23mA
Operating Temperature:
-40℃~+150℃
Gate Charge(Qg):
5.6uC
Pulsed Current- Forward(Ifm):
1200A
Switching Energy(Eoff):
50mJ
Turn-On Energy (Eon):
35mJ
Mfr. Part #:
FZ600R12KE4
Package:
Screw Terminals
Product Description

Product Overview

The FZ600R12KE4 is a 62mm C-Series IGBT module featuring Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode technology. It offers extended operation temperature, low switching losses, high robustness, and a positive temperature coefficient for VCEsat. This module is designed for high-power applications such as high-power converters, motor drives, UPS systems, and wind turbines.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Not specified
  • Color: Not specified
  • Certifications: UL approved (E83335)

Technical Specifications

ParameterUnitFZ600R12KE4
IGBT, Inverter
Collector-emitter voltage (VCES)V1200
Continuous DC collector current (IC nom) @ TC = 100C, Tvj max = 175CA600
Repetitive peak collector current (ICRM) tP = 1 msA1200
Total power dissipation (Ptot) @ TC = 25C, Tvj max = 175CW3000
Gate-emitter peak voltage (VGES)V+/-20
Collector-emitter saturation voltage (VCE sat) @ IC = 600 A, VGE = 15 VV1.75 - 2.10
Gate threshold voltage (VGEth) @ IC = 23.0 mA, VCE = VGE, Tvj = 25CV5.2 - 6.4
Gate charge (QG) @ VGE = -15 V ... +15 VµC5.60
Internal gate resistor (RGint) @ Tvj = 25CΩ1.3
Input capacitance (Cies) @ f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 VnF42.0
Reverse transfer capacitance (Cres) @ f = 1 MHz, Tvj = 25C, VCE = 25 V, VGE = 0 VnF1.70
Collector-emitter cut-off current (ICES) @ VCE = 1200 V, VGE = 0 V, Tvj = 25CmA5.0
Gate-emitter leakage current (IGES) @ VCE = 0 V, VGE = 20 V, Tvj = 25CnA400
Turn-on delay time (td on) @ IC = 600 A, VCE = 600 V, VGE = ±15 V, RGon = 1.2 Ωµs0.24 - 0.26
Rise time (tr) @ IC = 600 A, VCE = 600 V, VGE = ±15 V, RGon = 1.2 Ωµs0.09 - 0.11
Turn-off delay time (td off) @ IC = 600 A, VCE = 600 V, VGE = ±15 V, RGoff = 1.2 Ωµs0.61 - 0.66
Fall time (tf) @ IC = 600 A, VCE = 600 V, VGE = ±15 V, RGoff = 1.2 Ωµs0.10 - 0.15
Turn-on energy loss per pulse (Eon) @ IC = 600 A, VCE = 600 V, LS = 60 nH, VGE = ±15 V, di/dt = 5500 A/µs, RGon = 1.2 ΩmJ35.0 - 55.0
Turn-off energy loss per pulse (Eoff) @ IC = 600 A, VCE = 600 V, LS = 60 nH, VGE = ±15 V, du/dt = 3500 V/µs, RGoff = 1.2 ΩmJ50.0 - 80.0
Short circuit data (ISC) @ VGE ≤ 15 V, VCC = 800 V, Tvj = 150°C, tP ≤ 10 µsA2400
Thermal resistance, junction to case per IGBT (RthJC)K/W0.05
Thermal resistance, case to heatsink per IGBT (RthCH) @ λPaste = 1 W/(m·K)K/W0.017
Temperature under switching conditions (Tvj op)°C-40 - 150
Diode, Inverter
Repetitive peak reverse voltage (VRRM) @ Tvj = 25°CV1200
Continuous DC forward current (IF)A600
Repetitive peak forward current (IFRM) tP = 1 msA1200
I²t value @ VR = 0 V, tP = 10 msA²s49000 - 51000
Forward voltage (VF) @ IF = 600 AV1.70 - 2.35
Peak reverse recovery current (IRM) @ IF = 600 A, - diF/dt = 5500 A/µs, VR = 600 V, VGE = -15 VA440 - 590
Recovered charge (Qr) @ IF = 600 A, - diF/dt = 5500 A/µs, VR = 600 V, VGE = -15 VµC55.0 - 115
Reverse recovery energy (Erec) @ IF = 600 A, - diF/dt = 5500 A/µs, VR = 600 V, VGE = -15 VmJ27.0 - 60.0
Thermal resistance, junction to case per diode (RthJC)K/W0.07
Thermal resistance, case to heatsink per diode (RthCH) @ λPaste = 1 W/(m·K)K/W0.024
Temperature under switching conditions (Tvj op)°C-40 - 150
Module
Isolation test voltage RMS (VISOL) @ f = 50 Hz, t = 1 min.kV4.0
Material of module baseplateCu
Internal isolationAl2O3
Creepage distance terminal to heatsinkmm25.0
Creepage distance terminal to terminalmm19.0
Clearance terminal to heatsinkmm25.0
Clearance terminal to terminalmm10.0
Comparative tracking index (CTI)> 400
Thermal resistance, case to heatsink per module (RthCH) @ λPaste = 1 W/(m·K)K/W0.01
Module stray inductance (LsCE)nH16
Module lead resistance, terminals - chip (RCC'+EE') @ TC = 25°C, per switch0.50
Storage temperature (Tstg)°C-40 - 125
Mounting torque for module mounting Screw M6Nm3.00 - 6.00
Terminal connection torque Screw M4Nm1.1
Terminal connection torque Screw M6Nm2.0 - 5.0
Weight (G)g340

2411220125_Infineon-FZ600R12KE4_C535643.pdf

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