insulated gate bipolar transistor HXY MOSFET IXGH40N120B2D1-HXY for solar inverters and energy storage systems

Key Attributes
Model Number: IXGH40N120B2D1-HXY
Product Custom Attributes
Td(off):
195ns
Pd - Power Dissipation:
417W
Td(on):
48ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
35pF
Input Capacitance(Cies):
5.047nF
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
5.1V@250uA
Gate Charge(Qg):
170nC@15V
Pulsed Current- Forward(Ifm):
160A
Output Capacitance(Coes):
161pF
Reverse Recovery Time(trr):
375ns
Switching Energy(Eoff):
1.6mJ
Turn-On Energy (Eon):
2.65mJ
Mfr. Part #:
IXGH40N120B2D1-HXY
Package:
TO-247
Product Description

Product Overview

The IXGH40N120B2D1 is a high-performance Insulated Gate Bipolar Transistor (IGBT) designed for demanding applications. It features easy paralleling capability due to a positive temperature coefficient in VCESAT, low EMI, low gate charge, and low saturation voltage. This device is suitable for UPS, EV-Chargers, Solar String Inverters, and Energy Storage Inverters.

Product Attributes

  • Brand: HUAXUANYANG HXY ELECTRONICS CO.,LTD
  • Origin: Shenzhen HuaXuanYang Electronics CO.,LTD
  • Model: IXGH40N120B2D1
  • Package: TO-247
  • Packing: 30PCS

Technical Specifications

ParameterSymbolConditionsMin.Typ.Max.Unit
Absolute Maximum Ratings
Collector emitter voltageVCE1200V
DC collector currentICTC = 25C80A
DC collector currentICTC = 100C40A
Pulsed collector currentICMTC = 25C160A
Maximum Diode forward currentIFTC = 25C80A
Maximum Diode forward currentIFTC = 100C40A
Diode pulsed currentIFMTC = 25C160A
Gate-Emitter voltageVGETVJ = 25C±20V
Transient Gate-Emitter Voltage(tp ≤ 10μs, D < 0.010) TVJ = 25C±30V
Power DissipationPtotTC = 25C417W
Power DissipationPtotTC = 100C208W
Operating Junction Temperature RangeTVJ-40+175�b0;C
Storage Temperature RangeTSTG-55+150�b0;C
Thermal Resistance
Thermal resistance: junction - ambientRθJA40�b0;C/W
IGBT Thermal resistance: junction - caseRθJC IGBT0.36�b0;C/W
Diode Thermal resistance: junction - caseRθJC Diode0.45�b0;C/W
Electrical Characteristics
Collector - Emitter Breakdown VoltageV(BR)CESVGE = 0V , IC = 0.5mA1200V
Collector - Emitter Saturation VoltageVCESATVGE = 15V , IC = 40A ,TVJ = 25�b0;C1.92.3V
Collector - Emitter Saturation VoltageVCESATVGE = 15V , IC = 40A ,TVJ = 175�b0;C2.9V
Diode forward voltageVFVGE = 0V , IC = 40A ,TVJ = 25�b0;C2.5V
Diode forward voltageVFVGE = 0V , IC = 40A ,TVJ = 175�b0;C1.8V
Gate-Emitter threshold voltageVGE(th)VGE = VCE, IC = 250mA5.15.86.5V
Zero Gate voltage Collector currentICESVCE = 650V , VGE = 0V250.0mA
Gate-Emitter leakage currentIGESVGE = ±20V , VCE = 0V±100nA
TransconductancegfsVGE = 20V, IC = 40A28S
Dynamic Characteristics
Input CapacitanceCiesVGE = 0V, VCE = 25V, f = 1MHz5047pF
Output CapacitanceCoes161pF
Reverse Transfer CapacitanceCres35pF
Gate ChargeQgVGE = 0 to 15V VCE = 960V, IC = 40A170nC
Gate to Emitter chargeQge37.5nC
Gate to Collector chargeQgc68nC
Switching Characteristics
Turn-On DelayTimetd(on)VGE = 15V, VCC = 600V IC=40A, RG(off) = 12Ω,RG(off) = 12Ω48ns
Turn-On Rise Timetr50ns
Turn-Off DelayTimetd(off)195ns
Turn-Off Fall Timetf100ns
Turn-on energyEon2.65mJ
Turn-off energyEoff1.6mJ
Total switching energyEts4.25mJ
Diode Recovery Characteristics
Reverse recovery timeTrrVR = 600 V, IF = 40 A, di/dt = 600 A/μS375ns
Reverse recovery chargeQrr2.29mC
Peak reverse recovery currentIrrm15A

2509181737_HXY-MOSFET-IXGH40N120B2D1-HXY_C49003394.pdf

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