HXY MOSFET TP65H035WS-HXY N Channel Silicon Carbide Transistor with High Power Density and Low Loss

Key Attributes
Model Number: TP65H035WS-HXY
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
49A
Operating Temperature -:
-55℃~+175℃
RDS(on):
49mΩ
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
19pF
Pd - Power Dissipation:
242W
Input Capacitance(Ciss):
1.823nF
Output Capacitance(Coss):
190pF
Gate Charge(Qg):
96nC
Mfr. Part #:
TP65H035WS-HXY
Package:
TO-247
Product Description

Product Overview

The HUAXUANYANG HXY TP65H035WS is a 3rd generation SiC Power MOSFET, N-Channel Enhancement Mode, utilizing advanced SiC technology. It offers high blocking voltage with low on-resistance, high-speed switching with low capacitances, and a fast intrinsic diode with low reverse recovery. The optimized package features a separate driver source pin, contributing to reduced switching losses, minimized gate ringing, higher system efficiency, reduced cooling requirements, increased power density, and higher system switching frequency. This MOSFET is halogen-free and RoHS compliant.

Product Attributes

  • Brand: HUAXUANYANG
  • Model: TP65H035WS
  • Material: SiC (Silicon Carbide)
  • Origin: Shenzhen, China
  • Certifications: Halogen free, RoHS compliant
  • Package: TO-247

Technical Specifications

ParameterSymbolUnitTest ConditionValueType
Maximum Ratings
Drain-source voltageVDSVTC = 25 C unless otherwise specified650
Continuous drain currentIDATC = 25C123
Continuous drain currentIDATC = 100C35
Pulsed drain currentID pulseATC = 25C, tp limited by Tjmax242
Gate-Source voltageVGSV-5/+20
Power dissipationPtotWTC = 25C1000
Operating junction and storage temperatureTj , TstgC-55...+175
Avalanche energy, single pulseEASmJL=10mH49
Thermal Resistance
Thermal resistance, junction caseRthJCC/W0.62Max
Thermal resistance, junction ambientRthJAC/W30Max
Static Characteristic
Drain-source on-state resistanceRDS(on)VGS=20V, ID=17.6A, Tj=25C19typ.
Drain-source on-state resistanceRDS(on)VGS=20V, ID=17.6A, Tj=175C26typ.
Zero gate voltage drain currentIDSSAVDS=650V,VGS=0V250max.
Zero gate voltage drain currentIDSSmAVDS=650V,VGS=0V, Tj=175C1max.
Gate threshold voltageVGS(th)VVDS=VGS,ID=7mA4typ.
Drain-source breakdown voltageBVDSSVVGS=0V, ID =250uA650
Gate-source leakage currentIGSSnAVGS=20V, VDS=0V100max.
TransconductancegfsSVDS=20V,ID =17.6A19typ.
Dynamic Characteristic
Input CapacitanceCisspFVGS=0V, VDS =20V, f =1MHz1823typ.
Output CapacitanceCosspFVGS=0V, VDS =20V, f =1MHz188typ.
Reverse Transfer CapacitanceCrsspFVGS=0V, VDS =20V, f =1MHz45typ.
Gate Total ChargeQGnCVDS=400V, VGS = -5/+20V, ID = 17.6A49typ.
Gate-Source chargeQgsnCVDS=400V, VGS = -5/+20V, ID = 17.6A33typ.
Gate-Drain chargeQgdnCVDS=400V, VGS = -5/+20V, ID = 17.6A15typ.
Turn-on delay timetd(on)nsVDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH19typ.
Rise timetrnsVDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH25typ.
Turn-off delay timetd(off)nsVDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH26typ.
Fall timetfnsVDD = 400V, VGS = -5/+20V, ID = 17.6A, RG = 10, L = 100uH48typ.
Turn-On Switching EnergyEONJVGS=20V, VDD = 400V, ID = 17.6A, RG = 10, L = 100uH190typ.
Turn-Off Switching EnergyEOFFJVGS=-5/20V, VDD = 400V, ID = 17.6A, RG = 10, L = 100uH156typ.
Body Diode Characteristic
Body Diode Forward VoltageVSDVVGS=0V,ISD=8.8A, TJ=25C1.7typ.
Body Diode Forward VoltageVSDVVGS=0V,ISD=8.8A, TJ=175C3.2typ.
Body Diode Reverse Recovery ChargeQrrnCVR = 400V, ID = 17.6A, di/dt = 1000A/S40typ.
Body Diode Reverse Recovery TimetrrnsVGS=0V,ISD=8.8A, TJ=25C156typ.

2509181733_HXY-MOSFET-TP65H035WS-HXY_C48972071.pdf

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