Low gate leakage P Channel Power MOSFET JSCJ CJQ4435 suitable for notebook CPU core power conversion
Product Description
The CJQ4435 is a P-Channel Power MOSFET from JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. It utilizes advanced trench technology to deliver excellent RDS(on), shoot-through immunity, superior body diode characteristics, and ultra-low gate resistance. This device is ideal for low-side switching applications in Notebook CPU core power conversion. Key applications include Battery Switches and Load Switches.
Product Attributes
- Brand: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Product Code: CJQ4435
- Package Type: SOP8
- Material: Plastic-Encapsulate
- Color: Green molding compound device (if indicated by solid dot)
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Off Characteristics | ||||||
| Drain-source breakdown voltage | V(BR)DSS | VGS = 0V, ID =-250A | -30 | V | ||
| Zero gate voltage drain current | IDSS | VDS =-30V, VGS =0V | -1 | A | ||
| Gate-body leakage current | IGSS | VDS =0V, VGS =20V | 100 | nA | ||
| On Characteristics (note1) | ||||||
| Gate-threshold voltage | VGS(th) | VDS =VGS, ID =-250A | -1.0 | -1.5 | -3.0 | V |
| Static drain-source on-state resistance | RDS(on) | VGS =-10V, ID =-9.1A | 14 | 24 | m | |
| VGS =-4.5V, ID =-6.9A | 23 | 35 | m | |||
| Forward transconductance | gFS | VDS =-10V, ID =-9.1A | 20 | S | ||
| Dynamic Characteristics (note 2) | ||||||
| Capacitance | Ciss | VDS =-15V,VGS =0V, f =1MHz | 1350 | pF | ||
| Coss | 215 | |||||
| Crss | 185 | |||||
| Switching Characteristics (note 2) | ||||||
| Gate Charge | Qg | VDS=-15V, VGS=-10V, ID=-9.1A | 50 | nC | ||
| Qgs | 25 | |||||
| Qgd | 4 | |||||
| VDS=-15V, VGS=-4.5V, ID=-9.1A | 7.5 | |||||
| Switching Times | td(on) | VDD=-15V,ID=-1A, VGS=-10V,RG=1, RL=15 | 15 | ns | ||
| tr | 15 | |||||
| td(off) | 70 | |||||
| tf | 25 | |||||
| Gate Resistance | Rg | f =1MHz, VDS=0V, VGS=0V | 5.8 | |||
| Drain-Source Diode Characteristics | ||||||
| Drain-source diode forward voltage | VSD | VGS =0V, IS=-2A | -1.2 | V | ||
| Continuous drain-source diode forward current | IS | -9.1 | A | |||
| Pulsed drain-source diode forward current | ISM | -36 | A | |||
| Maximum Ratings | ||||||
| Drain-Source Voltage | VDS | -30 | V | |||
| Gate-Source Voltage | VGS | 20 | V | |||
| Continuous Drain Current | ID | Ta=25 | -9.1 | A | ||
| Pulsed Drain Current | IDM | -36 | A | |||
| Single Pulsed Avalanche Energy | EAS (1) | 20 | mJ | |||
| Power Dissipation | PD | Ta=25 | 1.4 | W | ||
| Thermal Resistance Junction to Ambient | RJA | 89 | /W | |||
| Junction Temperature | TJ | 150 | ||||
| Storage Temperature Range | Tstg | -55 | +150 | |||
| Lead Temperature for Soldering | TL | (1/8 from case for 10s) | 260 | |||
2410121243_JSCJ-CJQ4435_C114076.pdf
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