Small signal switching diode LIZ CD4148WP silicon epitaxial planar type with SMD chip pattern and RoHS compliance
Key Attributes
Model Number:
CD4148WP
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
1A
Reverse Leakage Current (Ir):
5uA@75V
Reverse Recovery Time (trr):
4ns
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
75V
Diode Configuration:
-
Pd - Power Dissipation:
400mW
Voltage - Forward(Vf@If):
1.25V@100mA
Current - Rectified:
150mA
Mfr. Part #:
CD4148WP
Package:
1206
Product Description
Product Overview
The CD4148WP is a silicon epitaxial planar switching diode designed for small signal switching applications. It features an SMD chip pattern, is lead-free and RoHS compliant, and is available in various dimensions including 0805 and 0603. While suitable for general applications, it is not recommended for AC switching input as rectified circuits or high reverse voltage locations. The CD4148WN variant is recommended for such applications.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Silicon epitaxial planar
- Color: Not specified
- Certifications: RoHS compliance
Technical Specifications
| Parameter | Symbol | Value | Unit | Notes | ||
| MECHANICAL CHARACTERISTICS | ||||||
| Size | 1206 | |||||
| Weight | approx. 10mg | |||||
| Marking | Cathode terminal | |||||
| Dimensions (1206) | L | 3.20.2 | mm | |||
| W | 1.50.2 | mm | ||||
| T | 0.850.1 | mm | ||||
| C | 0.550.2 | mm | ||||
| THERMAL CHARACTERISTICS | ||||||
| Forward Power Dissipation at Tamb=25C | Ptot | 400 | mW | Valid provided that electrodes are kept at ambient temperature. | ||
| Power derating above 25C | 3.2 | mW/C | ||||
| Junction Temperature | Tj | 150 | C | |||
| Thermal Resistance Junction to Ambient air | RJA | 375 | C/W | |||
| Operating & Storage Temperature range | Tstg | -55 to 150 | C | Valid provided that electrodes are kept at ambient temperature. | ||
| MAXIMUM RATING | ||||||
| Repetitive Peak Reverse Voltage at Tamb=25C | VRRM | 75 | V | Valid provided that electrodes are kept at ambient temperature. | ||
| Average rectified current (sin half wave rectification with resistive load) | IF(AV) | 150 | mA | Valid provided that electrodes are kept at ambient temperature. | ||
| Repetitive Peak Forward Current at Tamb=25C | IFRM | 300 | mA | Valid provided that electrodes are kept at ambient temperature. | ||
| Non-Repetitive Surge Forward Current at t<1s and Tj=25C | IFSM | 500 | mA | Valid provided that electrodes are kept at ambient temperature. | ||
| Non-Repetitive Surge Forward Current at t8.3ms and Tj=25C | IFSM | 1000 | mA | Valid provided that electrodes are kept at ambient temperature. | ||
| ELECTRICAL CHARACTERISTICS | ||||||
| Forward Voltage at IF=10mA | VF | 1.0 | MAX V | Valid provided that electrodes are kept at ambient temperature. | ||
| Forward Voltage at IF=100mA | VF | 1.25 | MAX V | Valid provided that electrodes are kept at ambient temperature. | ||
| Leakage Current at VR=20V | IR | 0.025 | MAX uA | Valid provided that electrodes are kept at ambient temperature. | ||
| Leakage Current at VR=75V | IR | 5 | MAX uA | Valid provided that electrodes are kept at ambient temperature. | ||
| Capacitance at VR=0V, f=1MHz | Ctot | 4 | MAX pF | Valid provided that electrodes are kept at ambient temperature. | ||
| Reverse Recovery Time at IF =IR=10mA,RL=100 | trr | 4 | MAX ns | Valid provided that electrodes are kept at ambient temperature. | ||
| TEST CHARACTERISTICS | ||||||
| Test Item | Test Condition | Requirement | ||||
| Solderability | Sn bath at 2455C for 20.5s | >95% area tin covered | ||||
| Resistance to Soldering Heat | Sn bath at 2605C for 102s | VF,VR & IR within spec; no mechanical damage | ||||
| Humidity | Steady State At 85C 85%RH for 168hrs | VF,VR & IR within spec | ||||
| Continue Forward Operating Life | At 25C IF =1.1IF for 1000hrs | VF,VR & IR within spec | ||||
| Thermal Shock | -55 5C/5min to 1505C/5min for 10cycles | VF,VR & IR within spec | ||||
| Bending Strength | Bending up to 2mm for 1cycle | VF,VR & IR within spec; no mechanical damage | ||||
| APPLICATIONS | ||||||
| Function | Suit for small signal switching application | |||||
| Typical Product field | General application except high reverse voltage location | |||||
| SOLDERING CONDITION | ||||||
| Recommended Soldering Condition | Sn-Pb Soldering | Leadfree Soldering | Wave Soldering | |||
| Ramp-up rate (from pre-heat stage) | <3C/s | <3C/s | T<150C | |||
| Pre-heat Temperature & Time | 100-150 C 60-120s | 150-200 C 60-120s | 100-150 C 60-120s | |||
| Soldering Temperature & Time | 183 C 60-150s | 217 C 60-150s | 2605C 52s | |||
| Peak Temperature | 2305C | <260C | 2455C | <260C | ||
| Time within 5C of peak temperature | 10-20s | 20-30s | - | |||
| Ramp-down rate | <6C/s | <6C/s | <6C/s | |||
| Manual Soldering | Approx. 350C for 3s, avoid solder iron tip direct touch the components body | |||||
| Recommended Soldering Footprint | ||||||
| Dimension/ mm | Product Size | A | B | C | D | |
| 1206 | 3.8-4.6 | 2.2 | 0.8-1.2 | 1.5-1.7 | ||
| Storage Condition | ||||||
| Ambient Temperature | <40C | |||||
| Ambient Humidity | <75%RH | Free from chemical | ||||
| ENVIRONMENTAL CHARACTERISTICS | ||||||
| Hazardous Substance or Element/ppm | Pb | Cd | Hg | Cr6+ | PBB | PBDE |
| Product | <1000 | <100 | <1000 | <1000 | <1000 | <1000 |
| Halogen Substance/ ppm | F | Cl | Br | I | Total | |
| Product | <900 | <900 | <900 | <900 | <1500 | |
| PACKING METHOD | ||||||
| Quality/Reel | Reel Size | Tape | Product | |||
| 7 | Paper | 5,000pcs | ||||
2410121257_LIZ-CD4148WP_C109000.pdf
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