Low Gate Charge Power MOSFET NH NSS130N06S N Channel Trench Type for DC DC Converters and Motor Drives

Key Attributes
Model Number: NSS130N06S
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
45A
RDS(on):
13mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
-
Number:
1 N-channel
Input Capacitance(Ciss):
1.88nF@30V
Pd - Power Dissipation:
33W
Gate Charge(Qg):
44nC@30V
Mfr. Part #:
NSS130N06S
Package:
TO-252
Product Description

Product Overview

The NSS130N06S is an N-Channel Enhancement Mode Trench Power MOSFET from Guangdong Niuhang Specification Electronic Technology Co., Ltd. Designed for high efficiency and reliability, this MOSFET features low RDS(ON) for reduced power loss and low gate charge for high-speed switching. Its high EAS rating ensures robust performance in demanding applications. Typical applications include DC/DC converters, synchronous rectification, high-frequency circuits, battery management systems (BMS), motor drives, and printed circuit board control. It is also suitable for automotive electronics and Uninterruptible Power Supplies (UPS).

Product Attributes

  • Brand: Niuhang (NH)
  • Product Line Code: FF
  • Model ID: NSS130N06S
  • Package: TO-252
  • Certifications: RoHS COMPLIANT
  • Weight: App. 0.321 Grams (0.01132 Ounce)

Technical Specifications

Parameter Test Conditions Symbol Min. Typ. Max. Unit
PRODUCT SUMMARY
VDS @ Tj Min VDS 60 V
ID @ Ta Min ID 45 A
RDS(ON) Type @ 10V RDS(ON) 10.00 m
Absolute Maximum Ratings (Ta=25 Unless Otherwise Specified)
Drain-Source Voltage VDS 60 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current (Note 1) Ta= 25 ID 45 A
Continuous Drain Current (Note 1) Ta= 100 ID 29 A
Drain Current-Pulsed (Note 1) TJ< 150 IDM 180 A
Maximum Power Dissipation Ta= 25 PD 83 W
Maximum Power Dissipation Ta= 100 PD 33 W
Power Dissipation Derating Factor Above 25 DF 0.67 W/
Junction Temperature TJ -55 150
Storage Temperature Range TSTD -55 150
Avalanche Current, Single Pulse (Note 1) L= 0.5 mH IAS 22 A
Single Pulse Avalanche Energy (Note 1) L= 0.5 mH, VDD= 30 V EAS 121 mJ
Thermal Characteristics (Ta=25 Unless Otherwise Specified)
Thermal Resistance Junction To Ambient Still Air Environment With Ta =25C RJA 62.5 /W
Thermal Resistance Junction-Case Device Mounted On 1 in 2 FR-4 Board With 2oz RJC 1.5 /W
Electrical Characteristics (Ta=25 Unless Otherwise Specified)
Drain-Source Breakdown Voltage VGS=0V, ID=250uA BV DSS 60 -- -- V
Bvdss Temperature Coefficient ID=250uA, Reference 25 BV DSS/T J -- 0.069 -- V/
Drain-Source Leakage Current VDS= 60 V, VGS=0V IDSS -- -- 1 uA
Gate-Body Leakage Current VGS= ±20 V, VDS=0V IGSS -- -- ±100 nA
Forward Transconductance ID= 20 A, VDS= 5 V gfs -- 25.0 -- S
Gate Threshold Voltage VGS= VDS ID=250uA VGS(TH) 1.0 1.5 2.0 V
Drain-Source On Resistance ID= 20 A, VGS= 10 V RDS(ON) -- 10.00 13.00 m
Drain-Source On Resistance ID= 20 A, VGS= 4.5 V RDS(ON) -- 11.50 17.42 m
Gate Resistance VGS=0V, VDS=0V, Freq.=1MHz Rg -- 3.20 --
Input Capacitance VDS= 30 V Ciss -- 1880.0 -- pF
Output Capacitance VGS= 0 V Coss -- 135.0 -- pF
Reverse Transfer Capacitance F= 1 MHZ Crss -- 100.0 -- pF
Turn-On Delay Time VDS= 30 V, VGS= 10 V td(on) -- 13.0 -- ns
Turn-On Rise Time VDS= 30 V, VGS= 10 V tr -- 25.0 -- ns
Turn-Off Delay Time RL= 1.2 td(off) -- 60.0 -- ns
Turn-Off Rise Time RG= 10 tf -- 9.5 -- ns
Total Gate Charge VDS= 30 V Qg -- 44.0 -- nC
Gate-Source Charge VGS= 10 V Qgs -- 5.5 -- nC
Gate-Drain Charge ID= 20 A Qgd -- 12.0 -- nC
Drain-Source Diode Characteristics And Maximum Ratings
Max. Diode Forward Current IS -- -- 45 A
Max. Pulsed Forward Current ISM -- -- 158 A
Diode Forward Voltage ID= 20 A, VGS=0V VSD -- 0.86 1.2 V
Reverse Recovery Time ID= 20 A, di/dt= 100 A/us trr -- 29 -- ns
Reverse Recovery Charge VGS= 10 V, VDS= 30 V Qrr -- 21.0 -- uC

Outline Drawings TO-252

OUTLINE DIMENSIONS

Dim. Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 6.100 - 7.100 0.240 - 0.280
B 4.800 - 5.800 0.189 - 0.228
C 1.950 - 2.550 0.077 - 0.100
D 0.350 - 0.750 0.014 - 0.030
E 9.250 - 10.750 0.364 - 0.423
F 5.600 - 6.600 0.220 - 0.260
G 2.500 - 3.100 0.098 - 0.122
H 0.650 - 1.050 0.026 - 0.041
J 2.100 - 2.500 0.083 - 0.098
L 1.000 - 1.400 0.039 - 0.055
M 0.350 - 0.750 0.014 - 0.030

PACKING INFORMATION

Package Code Package Method Inner Box Size LWH(mm) Quantity (Pcs/Inner Box) Outer Carton Size LWH(mm) Quantity (Pcs/Carton)
TO-252 Tape Reel 34034050 5000 360x360x260 25000

Recommended wave soldering condition

Product Peak Temperature Soldering Time
Pb-free devices 260 +0/-5 C 5 +1/-1 seconds

Recommended temperature profile for IR reflow

Profile feature Sn-Pb eutectic Assembly Pb-free Assembly
Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max.
Preheat
-Temperature Min(TS min)
-Temperature Max(TS max)
-Time(ts min to ts max)
100C
150C
60-120 seconds
150C
200C
60-180 seconds
Time maintained above:
-Temperature (TL)
-Time (tL)
183C
60-150 seconds
217C
60-150 seconds
Peak Temperature(TP) 240 +0/-5 C 260 +0/-5 C
Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds
Ramp down rate 6C/second max. 6C/second max.
Time 25 C to peak temperature 6 minutes max. 8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.


2411011351_NH-NSS130N06S_C41784113.pdf

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