650V 72m Ohm Gallium Nitride GaN FET PQFN Package RENESAS TP65H070G4LSGB-TR Normally Off Device

Key Attributes
Model Number: TP65H070G4LSGB-TR
Product Custom Attributes
Mfr. Part #:
TP65H070G4LSGB-TR
Package:
PQFN-8(8x8)
Product Description

Product Overview

The TP65H070G4LSGB is a 650V, 72m Gallium Nitride (GaN) FET, designed as a normally-off device. It integrates advanced high voltage GaN HEMT and low voltage silicon MOSFET technologies to deliver superior reliability and performance. Leveraging the Gen IV SuperGaN platform, it utilizes advanced epi and patented design technologies to simplify manufacturing and enhance efficiency over silicon by reducing gate charge, output capacitance, crossover loss, and reverse recovery charge. This FET is suitable for applications requiring increased efficiency in both hard- and soft-switched circuits, leading to higher power density, reduced system size and weight, and lower overall system cost. It is easy to drive with commonly-used gate drivers, and its GSD pin layout aids in high-speed design.

Product Attributes

  • Brand: Renesas Electronics
  • Technology: Gen IV SuperGaN GaN FET
  • Qualification: JEDEC-qualified
  • Packaging: PQFN (source tab), RoHS compliant and Halogen-free
  • Certifications: RoHS compliant, Halogen-free

Technical Specifications

Part NumberVDSS (V)VDSS(TR) (V)RDS(on)eff (m) max*Qoss (nC) typQG (nC) typPackagePackage Configuration
TP65H070G4LSGB65080085788.4PQFNSource tab
TP65H070G4LSGB-TR65080085788.48x8 PQFNTape and reel
SymbolParameterLimit ValueUnitTest Conditions
VDSSDrain to source voltage650V(TJ = -55C to 150C)
VDSS(TR)Transient drain to source voltage800V(spike duration <30 s, non-repetitive)
VGSSGate to source voltage20V
PDMaximum power dissipation96W@TC=25C
IDContinuous drain current29A@TC=25C (b)
IDContinuous drain current18.4A@TC=100C (b)
IDMPulsed drain current120A(pulse width: 10s)
TCOperating temperature (Case)-55 to +150C
TJOperating temperature (Junction)-55 to +150C
TSStorage temperature-55 to +150C
TSOLDReflow soldering temperature260C(c)
SymbolParameterTypicalUnitTest Conditions
RJCJunction-to-case thermal resistance1C/W
RJAJunction-to-ambient thermal resistance62C/W
SymbolParameterMinTypMaxUnitTest Conditions
V(BL)DSSDrain-source voltage650VVGS=0V
VGS(th)Gate threshold voltage3.244.6VVDS=VGS, ID=0.7mA
RDS(on)effDrain-source on-resistance7285mVGS=10V, ID=16A,TJ=25C
RDS(on)effDrain-source on-resistance148mVGS=10V, ID=16A, TJ=150C
IDSSDrain-to-source leakage current330AVDS=650V, VGS=0V, TJ=25C
IDSSDrain-to-source leakage current12AVDS=650V, VGS=0V, TJ=150C
IGSSGate-to-source forward leakage current100nAVGS=20V
IGSSGate-to-source reverse leakage current-100nAVGS=-20V
CISSInput capacitance600pFVGS=0V, VDS=400V, f=1MHz
COSSOutput capacitance74pFVGS=0V, VDS=400V, f=1MHz
CRSSReverse transfer capacitance2pFVGS=0V, VDS=400V, f=1MHz
CO(er)Output capacitance, energy related109pFVGS=0V, VDS=0V to 400V
CO(tr)Output capacitance, time related200pFVGS=0V, VDS=0V to 400V
QGTotal gate charge8.4nCVDS=400V, VGS=0V to 10V, ID=16A
QGSGate-source charge3.3nCVDS=400V, VGS=0V to 10V, ID=16A
QGDGate-drain charge2.3nCVDS=400V, VGS=0V to 10V, ID=16A
QOSSOutput charge78nCVGS=0V, VDS=0V to 400V
tD(on)Turn-on delay27nsVDS=400V, VGS=0V to 12V, ID=16A, RG=50
tRRise time9nsVDS=400V, VGS=0V to 12V, ID=16A, RG=50
tD(off)Turn-off delay71nsVDS=400V, VGS=0V to 12V, ID=16A, RG=50
tFFall time6.5nsVDS=400V, VGS=0V to 12V, ID=16A, RG=50
ISReverse current16AVGS=0V, TC=100C, 25% duty cycle
VSDReverse voltage2.22.6VVGS=0V, IS=16A
VSDReverse voltage1.61.9VVGS=0V, IS=8A
tRRReverse recovery time34nsIS=16A, VDD=400V, di/dt=1000A/ms
QRRReverse recovery charge0nCIS=16A, VDD=400V, di/dt=1000A/ms
(di/dt)RDMCReverse diode di/dt1900A/s

2510261727_RENESAS-TP65H070G4LSGB-TR_C48782923.pdf

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