Power MOSFET 30V N Channel Siliup SP30N01GNP with Fast Switching and Low Gate Charge Characteristics

Key Attributes
Model Number: SP30N01GNP
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
265A
RDS(on):
1.6mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Number:
1 N-channel
Pd - Power Dissipation:
156W
Gate Charge(Qg):
62nC@10V
Mfr. Part #:
SP30N01GNP
Package:
PDFN5X6-8L
Product Description

Siliup Semiconductor SP30N01GNP: 30V N-Channel Power MOSFET

The SP30N01GNP is a 30V N-Channel Power MOSFET from Siliup Semiconductor, designed for efficient power management applications. It features fast switching speeds, low gate charge, and low on-resistance (RDS(on)), making it suitable for PWM applications, hard-switched, and high-frequency circuits. The MOSFET utilizes advanced split gate trench technology and a Cu-Clip process for enhanced performance and reliability. It is 100% tested for single pulse avalanche energy.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP30N01GNP
  • Technology: Advanced Split Gate Trench Technology
  • Process: Cu-Clip Process
  • Package: PDFN5X6-8L

Technical Specifications

Parameter Symbol Conditions Min. Typ. Max. Unit
Product Summary
Drain-Source Voltage V(BR)DSS 30 V
RDS(on) Typ. @10V 0.65 m
RDS(on) Typ. @4.5V 1.10 m
Continuous Drain Current ID 265 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25) 30 V
Gate-Source Voltage VGS (Ta=25) 20 V
Continuous Drain Current ID (Tc=25) 265 A
Continuous Drain Current ID (Tc=100) 177 A
Pulsed Drain Current IDM 1060 A
Single Pulse Avalanche Energy EAS 645 mJ
Power Dissipation PD (Tc=25) 156 W
Thermal Resistance Junction-to-Case RJC 0.8 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0V , ID=250uA 30 - - V
Drain-Source Leakage Current IDSS VDS=24V , VGS=0V , TJ=25 - - 1 uA
Gate-Source Leakage Current IGSS VGS=20V , VDS=0V - - 100 nA
Gate Threshold Voltage VGS(th) VGS=VDS , ID =250uA 1 1.5 2.5 V
Static Drain-Source On-Resistance RDS(ON) VGS=10V , ID=20A - 0.65 0.78 m
Static Drain-Source On-Resistance RDS(ON) VGS=4.5V , ID=20A - 1.10 1.60 m
Dynamic Characteristics
Input Capacitance Ciss VDS=15V , VGS=0V , f=1MHz - 4529 - pF
Output Capacitance Coss VDS=15V , VGS=0V , f=1MHz - 2993 - pF
Reverse Transfer Capacitance Crss VDS=15V , VGS=0V , f=1MHz - 31 - pF
Total Gate Charge Qg VDS=15V , VGS=10V , ID=40A - 62 - nC
Gate-Source Charge Qgs VDS=15V , VGS=10V , ID=40A - 14 - nC
Gate-Drain Charge Qgd VDS=15V , VGS=10V , ID=40A - 5 - nC
Switching Characteristics
Turn-On Delay Time Td(on) VDD=15V , VGS=10V , RG=1.6 ID=40A - 10.5 - nS
Rise Time Tr VDD=15V , VGS=10V , RG=1.6 ID=40A - 41 - nS
Turn-Off Delay Time Td(off) VDD=15V , VGS=10V , RG=1.6 ID=40A - 72 - nS
Fall Time Tf VDD=15V , VGS=10V , RG=1.6 ID=40A - 17 - nS
Diode Characteristics
Diode Forward Voltage VSD VGS=0V , IS=1A , TJ=25 - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 265 A
Reverse Recovery Time Trr IS=100A, di/dt=200A/us, TJ=25 - 30 - nS
Reverse Recovery Charge Qrr IS=100A, di/dt=200A/us, TJ=25 - 65 - nC

Package Information (PDFN5X6-8L)

Symbol Dimensions In Millimeters Dimensions In Inches
Min. Max. Min. Max.
A 0.900 1.000 0.035 0.039
A3 0.254REF. 0.010REF.
D 4.944 5.096 0.195 0.201
E 5.974 6.126 0.235 0.241
D1 3.910 4.110 0.154 0.162
E1 3.375 3.575 0.133 0.141
D2 4.824 4.976 0.190 0.196
E2 5.674 5.826 0.223 0.229
k 1.190 1.390 0.047 0.055
b 0.350 0.450 0.014 0.018
e 1.270TYP. 0.050TYP.
L 0.559 0.711 0.022 0.028
L1 0.424 0.576 0.017 0.023
H 0.574 0.726 0.023 0.029
10 12 10 12

Order Information

Device Package Unit/Tape
SP30N01GNP PDFN5X6-8L 5000

2505291610_Siliup-SP30N01GNP_C48888446.pdf

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