150V N Channel Power MOSFET with Low Gate Charge and High Current Capability Siliup SP015N08GHTF

Key Attributes
Model Number: SP015N08GHTF
Product Custom Attributes
Drain To Source Voltage:
150V
Configuration:
-
Current - Continuous Drain(Id):
130A
Operating Temperature -:
-55℃~+150℃
RDS(on):
7.5mΩ@10V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Reverse Transfer Capacitance (Crss@Vds):
18pF
Number:
1 N-channel
Output Capacitance(Coss):
290pF
Pd - Power Dissipation:
202W
Input Capacitance(Ciss):
3.75nF
Gate Charge(Qg):
42nC@10V
Mfr. Part #:
SP015N08GHTF
Package:
TO-247-3L
Product Description

Product Overview

The SP015N08GHTF is a 150V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. It features fast switching, low gate charge, and low RDS(on) due to its advanced split gate trench technology. This MOSFET is 100% tested for single pulse avalanche energy and is suitable for power switching applications, DC-DC converters, and power management systems.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP015N08GHTF
  • Package: TO-247
  • Channel Type: N-Channel
  • Technology: Advanced Split Gate Trench Technology

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
Drain-Source Voltage V(BR)DSS 150 V
RDS(on) RDS(on)TYP @10V 7.5 m
Continuous Drain Current ID 130 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25, unless otherwise noted) 150 V
Gate-Source Voltage VGS 20 V
Continuous Drain Current ID (Tc=25) 130 A
Continuous Drain Current ID (Tc=100) 90 A
Pulsed Drain Current IDM 520 A
Single Pulse Avalanche Energy EAS 625 mJ
Power Dissipation PD (Tc=25) 202 W
Thermal Resistance Junction-to-Case RJC 0.62 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250A, VGS = 0V 150 - - V
Drain Cut-Off Current IDSS VDS = 120V, VGS = 0V - - 1 A
Gate Leakage Current IGSS VGS = 20V, VDS = 0V - - 0.1 A
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2.0 3.0 4.0 V
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 20A - 7.5 9.5 m
Dynamic Characteristics
Input Capacitance Ciss VDS = 75V, VGS = 0V, f = 1.0MHz - 3750 - pF
Output Capacitance Coss - 290 - pF
Reverse Transfer Capacitance Crss - 18 - pF
Total Gate Charge Qg VDS=75V , VGS=10V , ID=50A - 42 - nC
Gate-Source Charge Qgs - 13.8 -
Gate-Drain Charge Qg - 11.2 -
Switching Characteristics
Turn-On Delay Time td(on) VGS = 10V, VDS = 50V, ID = 50A, RG = 6 - 15.6 - nS
Rise Time tr - 32 -
Turn-Off Delay Time td(off) - 43 -
Fall Time tf - 35 -
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 130 A
Body Diode Reverse Recovery Time Trr IS=50A, di/dt=100A/us, TJ=25 - 89 - nS
Body Diode Reverse Recovery Charge Qrr - 196 - nC

Note: 1. The test condition for EAS is VDD=50V, VGS=10V, L=0.5mH, RG=25.

Package Information (TO-247)

Symbol Dimensions In Millimeters Dimensions In Inches
Min. Max. Min. Max.
A 4.850 5.150 0.191 0.200
A1 2.200 2.600 0.087 0.102
b 1.000 1.400 0.039 0.055
b1 2.800 3.200 0.110 0.126
b2 1.800 2.200 0.071 0.087
c 0.500 0.700 0.020 0.028
c1 1.900 2.100 0.075 0.083
D 15.450 15.750 0.608 0.620
E1 3.500 REF. 0.138 REF.
E2 3.600 REF. 0.142 REF.
L 40.900 41.300 1.610 1.626
L1 24.800 25.100 0.976 0.988
L2 20.300 20.600 0.799 0.811
7.100 7.300 0.280 0.287
e 5.450 TYP. 0.215 TYP.
H 5.980 REF. 0.235 REF.
h 0.000 0.300 0.000 0.012

2504101957_Siliup-SP015N08GHTF_C42372347.pdf

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