Power MOSFET Siliup SP011N03AGHTO N Channel 110V 240A Low RDS on for PWM and High Frequency Circuits

Key Attributes
Model Number: SP011N03AGHTO
Product Custom Attributes
Drain To Source Voltage:
110V
Configuration:
-
Current - Continuous Drain(Id):
240A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.5mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Reverse Transfer Capacitance (Crss@Vds):
35pF@50V
Number:
1 N-channel
Pd - Power Dissipation:
260W
Input Capacitance(Ciss):
7.162nF@50V
Gate Charge(Qg):
105nC@10V
Mfr. Part #:
SP011N03AGHTO
Package:
TOLL
Product Description

Product Overview

The SP011N03AGHTO is an 110V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. Featuring advanced split gate trench technology, it offers fast switching, low gate charge, and low RDS(on). This MOSFET is designed for applications such as PWM, hard switched, and high-frequency circuits, as well as power management. It is 100% tested for single pulse avalanche energy.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP011N03AGHTO
  • Channel Type: N-Channel
  • Technology: Advanced Split Gate Trench Technology
  • Package: TOLL
  • Origin: China (implied by company website and typical datasheet origin)

Technical Specifications

Parameter Symbol Test Condition Rating Unit
Product Summary
Drain-Source Voltage V(BR)DSS 110 V
RDS(on) Typ RDS(on)TYP @10V 2.7 m
Continuous Drain Current ID 240 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25, unless otherwise noted) 110 V
Gate-Source Voltage VGS (Ta=25, unless otherwise noted) 20 V
Continuous Drain Current (Tc=25) ID (Ta=25, unless otherwise noted) 240 A
Continuous Drain Current (Tc=100) ID (Ta=25, unless otherwise noted) 160 A
Pulsed Drain Current IDM (Ta=25, unless otherwise noted) 960 A
Single Pulse Avalanche Energy EAS (Ta=25, unless otherwise noted) 744 mJ
Power Dissipation (Tc=25) PD (Ta=25, unless otherwise noted) 260 W
Thermal Resistance Junction-to-Case RJC (Ta=25, unless otherwise noted) 0.48 /W
Storage Temperature Range TSTG (Ta=25, unless otherwise noted) -55 to 150
Operating Junction Temperature Range TJ (Ta=25, unless otherwise noted) -55 to 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250A, VGS = 0V 110 - 120 V
Drain Cut-Off Current IDSS VDS = 80V, VGS = 0V - - 1 A
Gate Leakage Current IGSS VGS = 20V, VDS = 0V - - 0.1 A
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2.0 3.0 4.0 V
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 30A - 2.7 3.5 m
Dynamic Characteristics
Input Capacitance Ciss VDS =50V, VGS = 0V, f = 1.0MHz - 7162 - pF
Output Capacitance Coss - 1067 - pF
Reverse Transfer Capacitance Crss - 35 - pF
Switching Characteristics
Total Gate Charge Qg VDS=50V , VGS=10V , ID=100A - 105 - nC
Gate-Source Charge Qgs - 47 -
Gate-Drain Charge Qgd - 23 -
Turn-On Delay Time td(on) VGS = 10V, VDS =50V, ID=100A RG = 6 - 26 - nS
Rise Time tr - 75 -
Turn-Off Delay Time td(off) - 87 -
Fall Time tf - 30 -
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 240 A
Body Diode Reverse Recovery Time Trr IS=100A, di/dt=100A/us, TJ=25 - 72 - nS
Body Diode Reverse Recovery Charge Qrr - 180 - nC
Package Information (TOLL)
Dimension Symbol Min. Nom. Max.
A 2.20 2.30 2.40
b 0.65 0.75 0.85
C 0.508 REF
D 10.25 10.40 10.55
D1 2.85 3.00 3.15
E 9.75 9.90 10.05
E1 9.65 9.80 9.95
E2 8.95 9.10 9.25
E3 7.25 7.40 7.55
e 1.20 BSC
F 1.05 1.20 1.35
H 11.55 11.70 11.85
H1 6.03 6.18 6.33
H2 6.85 7.00 7.15
H3 3.00 BSC
L 1.55 1.70 1.85
L1 0.55 0.7 0.85
L2 0.45 0.6 0.75
M 0.08 REF.
8 10 12
K 4.25 4.40 4.55

Order Information:

Device Package Unit/Tape
SP011N03AGHTO TOLL 2000

2412041501_Siliup-SP011N03AGHTO_C42404755.pdf

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