N Channel 650V MOSFET Slkor SL8N65CD featuring low on resistance and high avalanche energy tolerance

Key Attributes
Model Number: SL8N65CD
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
8A
Operating Temperature -:
-55℃~+150℃
RDS(on):
600mΩ@10V,2.5A
Gate Threshold Voltage (Vgs(th)):
4.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
-
Number:
1 N-channel
Input Capacitance(Ciss):
383pF
Output Capacitance(Coss):
20pF
Pd - Power Dissipation:
100W
Gate Charge(Qg):
10.1nC@10V
Mfr. Part #:
SL8N65CD
Package:
TO-252
Product Description

Product Overview

This 650V N-Channel Super-JMOSFET is manufactured using Slkor's advanced Superjunction MOSFET technology. This technology is optimized for reduced on-state resistance, superior switching performance, and enhanced ruggedness against high energy pulses in avalanche and commutation modes. It is well-suited for high-efficiency switched-mode power supplies.

Product Attributes

  • Brand: Slkor
  • Technology: Super-JMOSFET

Technical Specifications

ParameterSymbolTest ConditionsMinTypMaxUnits
Absolute Maximum Ratings
Drain-Source VoltageVDSS650V
Drain Current - Continuous (TC = 25)ID8*A
Drain Current - Continuous (TC = 100)ID4.8*A
Drain Current - Pulsed (Note 1)IDM24*A
Gate-Source VoltageVGSS30V
Single Pulsed Avalanche Energy (Note 2)EAS156mJ
Avalanche Current (Note 1)IAR1.9A
Repetitive Avalanche Energy (Note 1)EAR0.61mJ
Peak Diode Recovery dv/dt (Note 3)dv/dt20V/ns
MOSFET dv/dt100
Power Dissipation (TC = 25)PD2469W
Derate above 250.190.56W/
Operating and Storage Temperature RangeTJ, TSTG-55+150
Maximum lead temperature for soldering purposes, 1/8" from case for 5 secondsTL260
Thermal Characteristics
Thermal Resistance, Junction-to-CaseRJC5.21.8/W
Thermal Resistance, Case-to-SinkRJSTyp.--/W
Thermal Resistance, Junction-to-AmbientRJA62.562.5/W
Off Characteristics
Drain-Source Breakdown VoltageBVDSSVGS = 0 V, ID = 250uA650V
Drain-Source Breakdown VoltageBVDSSVGS = 0 V, ID = 250uA, TJ = 150650V
Zero Gate Voltage Drain CurrentIDSSVDS = 600 V, VGS = 0 V1uA
Zero Gate Voltage Drain CurrentIDSSVDS =480 V, TC = 1252.1uA
Gate-Body Leakage Current, ForwardIGSSFVGS = 30 V, VDS = 0 V100nA
Gate-Body Leakage Current, ReverseIGSSRVGS = -30 V, VDS = 0 V-100nA
On Characteristics
Gate Threshold VoltageVGS(th)VDS = VGS, ID = 250uA2.54.5V
Static Drain-Source On-ResistanceRDS(on)VGS = 10 V, ID = 2.5 A550600m
Dynamic Characteristics
Input CapacitanceCissVDS = 400 V, VGS = 0 V, f = 1MHz383pF
Output CapacitanceCoss20pF
Reverse Transfer CapacitanceCrsspF
Switching Characteristics
Turn-On Delay Timetd(on)VDS = 400 V, ID =2.5 A, RG = 10 ,VGS = 10 V (Note 4, 5)6ns
Turn-On Rise Timetr7ns
Turn-Off Delay Timetd(off)26ns
Turn-Off Fall Timetf13ns
Total Gate ChargeQgVDS = 400 V, ID =2.5A, VGS = 10 V (Note 4, 5)10.1nC
Gate-Source ChargeQgs2.1nC
Gate-Drain ChargeQgd4.9nC
Gate ResistanceRGf = 1MHz0.7
Drain-Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain-Source Diode Forward CurrentIS8A
Maximum Pulsed Drain-Source Diode Forward CurrentISM24A
Drain-Source Diode Forward VoltageVSDVGS = 0 V, IS = 2.5A1.2V
Reverse Recovery TimetrrVDD = 400 V, IS = 2.5A, dIF / dt = 100 A/us (Note 4)173ns
Reverse Recovery ChargeQrr1.1uC

2309281727_Slkor-SL8N65CD_C18208653.pdf

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