Dual P Channel MOSFET Bruckewell MSQ30P07D featuring SOP 8 package and RoHS compliance for electronics

Key Attributes
Model Number: MSQ30P07D
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
6.5A
RDS(on):
28mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
-
Pd - Power Dissipation:
1.5W
Input Capacitance(Ciss):
1.345nF@15V
Gate Charge(Qg):
12.6nC@15V
Mfr. Part #:
MSQ30P07D
Package:
SOP-8
Product Description

Product Overview

The MSQ30P07D is a high-performance dual P-channel MOSFET featuring extreme high cell density, offering excellent RDS(ON) and gate charge characteristics. It is ideally suited for synchronous buck converter applications. This device meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. Typical applications include MB, VGA, Vcore, POL, Load Switch, and LED applications.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Line: Dual P-Channel MOSFET
  • Model: MSQ30P07D
  • Certifications: RoHS Compliant, Green Device Available
  • Package Type: SOP-8
  • Packing: 3,000/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current (TA =25°C) -6.5 A
ID Continuous Drain Current (TA =70°C) -5.2 A
IDM Pulsed Drain Current -26 A
IAS Single Pulse Avalanche Current, L =0.1mH -38 A
EAS Single Pulse Avalanche Energy, L =0.1mH 72 mJ
PD Power Dissipation (TA =25°C) 1.5 W
TJ/TSTG Operating Junction and Storage Temperature -55 +150 °C
Thermal Resistance Ratings
RθJA Maximum Junction-to-Ambient (Note 1) 85 °C/W
RθJC Maximum Junction-to-Case (Note 1) 25 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =-250μA -1.0 -2.5 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =-250μA -30 V
gfs Forward Transconductance VDS =-5V, ID =-6A 17 S
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V ±100 nA
IDSS Drain-Source Leakage Current VDS =-24V, VGS =0V, TJ =25°C -1 μA
IDSS Drain-Source Leakage Current VDS =-24V, VGS =0V, TJ =55°C -5 μA
RDS (on) Static Drain-Source On-Resistance VGS =-10V, ID =-6A 28
RDS (on) Static Drain-Source On-Resistance VGS =-4.5V, ID =-4A 35
EAS Single Pulse Avalanche Energy (Note 5) 8.4 mJ
VSD Diode Forward Voltage IS =-6.5A, VGS =0V, TJ =25°C -1.2 V
IS Continuous Source Current (Note 6) -6.5 A
ISM Pulsed Source Current (Note 2, 6) -26 A
Dynamic Characteristics
Qg Total Gate Charge VDS =-15V ID =-6A VGS =-4.5V 12.6 nC
Qgs Gate-Source Charge 4.8 nC
Qgd Gate-Drain Charge 4.8 nC
td(on) Turn-On Delay Time VDS =-15V ID =-6A VGS =-10V RG =3.3Ω 4.6 ns
tr Rise Time 14.8 ns
td(off) Turn-Off Delay Time 41 ns
tf Fall Time 19.6 ns
CISS Input Capacitance VDS =-15V VGS =0V f =1.0MHz 1345 pF
COSS Output Capacitance 194 pF
CRSS Reverse Transfer Capacitance 158 pF
Rg Gate Resistance VGS =VDS =0V, f =1.0MHz 13 Ω
Notes:
1. The data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%.
3. The EAS data shows maximum rating. The test condition is VDD=-25V, VGS=-10V, L=0.1mH, IAS=-38A.
4. The power dissipation is limited by 150°C junction temperature.
5. The Min. value is 100% EAS tested guarantee.
6. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410121628_Bruckewell-MSQ30P07D_C22465594.pdf
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