P Channel Enhancement Mode MOSFET Diodes ZXMP10A13FTA with Low On Resistance and Fast Switching Speed

Key Attributes
Model Number: ZXMP10A13FTA
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
700mA
Operating Temperature -:
-55℃~+150℃
RDS(on):
1Ω@10V
Gate Threshold Voltage (Vgs(th)):
2V
Reverse Transfer Capacitance (Crss@Vds):
10.8pF@50V
Number:
1 P-Channel
Input Capacitance(Ciss):
141pF@50V
Pd - Power Dissipation:
625mW
Gate Charge(Qg):
1.8nC
Mfr. Part #:
ZXMP10A13FTA
Package:
SOT-23
Product Description

Product Overview

The Diodes Incorporated ZXMP10A13F is a 100V P-CHANNEL ENHANCEMENT MODE MOSFET designed for high-efficiency power management applications. Its unique structure offers a combination of low on-resistance and fast switching speed, making it ideal for DC-DC converters, power management functions, disconnect switches, and motor control. Key features include low input capacitance, low gate charge, and a low threshold voltage. This device is totally lead-free, fully RoHS compliant, and halogen and antimony-free, designated as a "Green" device. It is qualified to AEC-Q101 Standards for High Reliability, with an automotive-compliant part available under a separate datasheet (ZXMP10A13FQ).

Product Attributes

  • Brand: Diodes Incorporated
  • Product Type: P-CHANNEL ENHANCEMENT MODE MOSFET
  • Compliance: Totally Lead-Free & Fully RoHS Compliant, Halogen and Antimony Free (Green Device)
  • Reliability: Qualified to AEC-Q101 Standards
  • Package Material: Molded Plastic, UL Flammability Classification Rating 94V-0
  • Terminal Finish: Matte Tin Finish Annealed over Copper Leadframe

Technical Specifications

Characteristic Symbol Value Units Test Condition
Drain-Source Voltage BVDSS -100 V ID = -250A, VGS = 0V
Gate-Source Voltage VGS ±20 V
Max Continuous Drain Current (TA = +25°C) ID -0.7 A VGS = -10V
Max Continuous Drain Current (TA = +70°C) ID -0.5 A VGS = -10V
Max Pulsed Drain Current IDM -3.1 A (Note 7)
Max Continuous Source Current (Body Diode) IS -1.1 A (Note 5)
Max Pulsed Source Current (Body Diode) ISM -3.1 A (Note 7)
Power Dissipation (Note 5) PD 625 mW
Power Dissipation (Note 6) PD 806 mW
Thermal Resistance, Junction to Ambient (Note 5) RθJA 200 °C/W
Thermal Resistance, Junction to Ambient (Note 6) RθJA 155 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Zero Gate Voltage Drain Current IDSS -1.0 µA VDS = -100V, VGS = 0V
Gate-Source Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V
Gate Threshold Voltage VGS(TH) -2.0 to -4.0 V ID = -250µA, VDS = VGS
Static Drain-Source On-Resistance RDS(ON) 1.0 Ω VGS = -10V, ID = -0.6A
Static Drain-Source On-Resistance RDS(ON) 1.45 Ω VGS = -6.0V, ID = -0.5A
Forward Transconductance gFS 1.2 S VDS = -15V, ID = -0.6A (Notes 9 & 11)
Diode Forward Voltage VSD -0.85 to -0.95 V TJ = +25°C, IS = -0.75A, VGS = 0V (Note 9)
Reverse Recovery Time tRR 29 ns TJ = +25°C, IF = -0.9A, di/dt = 100A/µs (Note 11)
Reverse Recovery Charge QRR 31 nC (Note 11)
Input Capacitance CISS 141 pF VDS = -50V, VGS = 0V, f = 1.0MHz (Note 11)
Output Capacitance COSS 13.1 pF (Note 11)
Reverse Transfer Capacitance CRSS 10.8 pF (Note 11)
Turn-On Delay Time tD(ON) 1.6 ns VDD = -50V, ID = -1.0A, RG ≈ 6.0Ω, VGS = -10V (Note 10)
Turn-On Rise Time tR 2.1 ns (Note 10)
Turn-Off Delay Time tD(OFF) 5.9 ns (Note 10)
Turn-Off Fall Time tF 3.3 ns (Note 10)
Total Gate Charge QG 1.8 nC VDS = -50V, VGS = -5.0V, ID = -0.6A (Note 10)
Total Gate Charge QG 3.5 nC VDS = -50V, VGS = -10V, ID = -0.6A (Note 10)
Gate-Source Charge QGS 0.6 nC (Note 10)
Gate-Drain Charge QGD 1.6 nC (Note 10)
Package SOT23
Weight (Approximate) 0.009 grams
Part Number ZXMP10A13FTA SOT23, 3,000/Tape & Reel
Part Number ZXMP10A13FTC SOT23, 10,000/Tape & Reel

Notes:

  • 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
  • 6. For a device surface mounted on FR4 PCB measured at t ≤5 secs.
  • 7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10µs - pulse current limited by maximum junction temperature.
  • 8. Thermal resistance from junction to solder-point (at the end of the drain lead).
  • 9. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤ 2%.
  • 10. Switching characteristics are independent of operating junction temperature.
  • 11. For design aid only, not subject to production testing.

2412251103_DIODES-ZXMP10A13FTA_C50185.pdf

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