SOP 8 Packaged P Channel Power MOSFET GL GL14P04-8 with High Density Cell Design and RoHS Compliance

Key Attributes
Model Number: GL14P04-8
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
14A
RDS(on):
11mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
480pF
Output Capacitance(Coss):
570pF
Input Capacitance(Ciss):
5.1nF
Pd - Power Dissipation:
3W
Gate Charge(Qg):
102nC@10V
Mfr. Part #:
GL14P04-8
Package:
SOP-8
Product Description

Product Overview

The GL14P04-8 is a P-Channel Power MOSFET from Wuxi Guang Lei Electronic Technology Co., LTD, utilizing advanced trench technology for excellent RDS(ON) and low gate charge. Designed for a wide range of applications, it features a high-density cell design for ultra-low Rdson, fully characterized avalanche voltage and current, and an excellent package for good heat dissipation. This RoHS-compliant SOP-8 packaged MOSFET is suitable for power switching applications, hard switched and high-frequency circuits, and uninterruptible power supplies.

Product Attributes

  • Brand: GL Silicon
  • Manufacturer: Wuxi Guang Lei Electronic Technology Co., LTD
  • Channel Type: P-Channel
  • Package Type: SOP-8
  • Compliance: RoHS

Technical Specifications

Symbol Parameter Test Conditions Rating Units
Absolute Ratings (Tc= 25 unless otherwise specified)
VDSS Drain-to-Source Voltage -40 V
ID Continuous Drain Current -14 A
ID Continuous Drain Current TC = 70 C -12 A
IDMa1 Pulsed Drain Current -56 A
VGS Gate-to-Source Voltage 20 V
Easa5 L=0.5mH 180 mJ
dv/dt a3 Peak Diode Recovery dv/dt 5.0 V/ns
PD Power Dissipation 3.0 W
TJ, Tstg Operating Junction and Storage Temperature Range 55 to 150
TL Maximum Temperature for Soldering 300
Electrical Characteristics (Tc= 25 unless otherwise specified)
OFF Characteristics
VDSS Drain to Source Breakdown Voltage VGS=0V, ID=250A -40 V
IDSS Drain to Source Leakage Current VDS=-40V, VGS= 0V,Ta=25 -- 1.0 A
IGSS(F) Gate to Source Forward Leakage VGS=+20V -- 0.1 A
IGSS(R) Gate to Source Reverse Leakage VGS=-20V -- -0.1 A
ON Characteristicsa3
RDS(ON) Drain-to-Source On-Resistance VGS=-10V,ID=-14A -- 9 (Typ) / 11 (Max) m
VGS(TH) Gate Threshold Voltage VDS=VGS,ID=250A -1 -3.0 V
Dynamic Characteristicsa4
gfs Forward Transconductance VDS=-5V,ID=-14A 25 -- S
Ciss Input Capacitance VGS=0V,VDS=-15V f=1.0MHz -- 5100 pF
Coss Output Capacitance -- 570 pF
Crss Reverse Transfer Capacitance -- 480 pF
Resistive Switching Characteristicsa4
td(ON) Turn-on Delay Time VDD=-15V,ID=-14A VGS=-10V,RG=3 -- 15 ns
tr Rise Time -- 12 ns
td(OFF) Turn-Off Delay Time -- 70 ns
tf Fall Time -- 18 ns
Qg Total Gate Charge VDD=-15V, ID=-14A VGS=-10V -- 102 nC
Qgs Gate to Source Charge -- 22 nC
Qgd Gate to Drain (Miller)Charge -- 27 nC
Source-Drain Diode Characteristics
IS Continuous Source Current (Body Diode)a2 -- -14 A
VSD Diode Forward Voltagea3 IS=-14A,VGS=0V -- -1.5 V
trr Reverse Recovery Time IS=-14A,Tj = 25C dIF/dt=100A/us,VGS=0V -- 38 ns
Qrr Reverse Recovery Charge -- 30 nC
RJC Junction-to-Casea2 41.7 /W

2409290933_GL-GL14P04-8_C2986238.pdf

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