Low RDS ON N Channel MOSFET JSCJ CJAC2R0SN04C with High Energy Pulse Capability and Heat Dissipation

Key Attributes
Model Number: CJAC2R0SN04C
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
150A
RDS(on):
3.6mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
52pF
Number:
1 N-channel
Output Capacitance(Coss):
900pF
Input Capacitance(Ciss):
3.06nF
Pd - Power Dissipation:
96W
Gate Charge(Qg):
42.8nC@10V
Mfr. Part #:
CJAC2R0SN04C
Package:
PDFNWB5x6-8L
Product Description

Product Overview

The CJAC2R0SN04C is an N-Channel enhancement mode power field-effect transistor utilizing SGT technology. This advanced technology minimizes on-state resistance, offers superior switching performance, and withstands high energy pulses in avalanche and commutation modes. It is well-suited for high efficiency fast switching applications such as battery switches, load switches, SMPS, general purpose applications, hard switched and high frequency circuits, and Uninterruptible Power Supplies. Key features include a high-density cell design for ultra-low RDS(ON), fully characterized avalanche voltage and current, good stability and uniformity with high EAS, and an excellent package for good heat dissipation.

Product Attributes

  • Brand: JIANGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD
  • Part Number: CJAC2R0SN04C
  • Marking: CJAC2R0SN04C
  • Package: PDFNWB56-8L
  • Material: Plastic-Encapsulate MOSFET

Technical Specifications

ParameterSymbolTest ConditionMinTypMaxUnit
MAXIMUM RATINGS
Drain-Source VoltageVDS40V
Gate-Source VoltageVGS20V
Continuous Drain CurrentIDTC=25150A
Pulsed Drain CurrentIDM600A
Single Pulsed Avalanche EnergyEASmJ
Power DissipationPD96W
Thermal Resistance from Junction to AmbientRJA62.5/W
Thermal Resistance from Junction to CaseRJC1.3/W
Operating Junction and Storage Temperature RangeTJ ,TSTG-55+150
ELECTRICAL CHARACTERISTICS
Drain-source breakdown voltageV(BR)DSSVGS = 0V, ID =1mA40V
Zero gate voltage drain currentIDSSVDS =32V, VGS =0V2.0A
TJ =251.0A
TJ =125100A
Gate-body leakage currentIGSSVDS =0V, VGS =20V100nA
Gate-threshold voltageVGS(th)VDS =VGS, ID =250A1.01.82.5V
Static drain-source on-sate resistanceRDS(on)VGS =10V, ID =30A1.6m
VGS =4.5V, ID =30A2.4m
Input capacitanceCissVDS =20V,VGS =0V, f =100kHz3060pF
Output capacitanceCoss900pF
Reverse transfer capacitanceCrss52pF
Total gate chargeQgVGS=10V, VDS=20V, ID=75A42.8nC
Gate-source chargeQgsVGS=10V, VDS=20V, ID=75A9.3nC
Gate-drain chargeQgdVGS=10V, VDS=20V, ID=75A7.4nC
Turn-on delay timetd(on)VDS=20V, VGS=10V, RL=0.27 , Rg=1.610ns
Turn-on rise timetr2.4ns
Turn-off delay timetd(off)45ns
Turn-off fall timetf22.5ns
Drain-source diode forward voltageVSDVGS =0V, IS=30A1.3V
Continuous drain-source diode forward currentIS150A
Pulsed drain-source diode forward currentISM600A
Reverse recovery timetrrdiS/dt = 100A/s, IS = 30A, VDD = 30V65ns
Reverse recovery chargeQrrdiS/dt = 100A/s, IS = 30A, VDD = 30V90nC

2410121929_JSCJ-CJAC2R0SN04C_C19269076.pdf

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