Durable Power MOSFET KIA Semicon Tech KND8606B with High Avalanche Energy and 20V Gate Source Voltage

Key Attributes
Model Number: KND8606B
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
35A
Operating Temperature -:
-55℃~+175℃
RDS(on):
15mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
1.8V
Number:
1 N-channel
Input Capacitance(Ciss):
2.8nF@25V
Pd - Power Dissipation:
60W
Gate Charge(Qg):
33nC@48V
Mfr. Part #:
KND8606B
Package:
TO-252
Product Description

Product Overview

This Power MOSFET is produced using KIA's advanced planar stripe DMOS technology, designed to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses. It is well-suited for low voltage applications such as DC/DC converters and high efficiency switching for power management in portable and battery-operated products.

Product Attributes

  • Brand: KIA
  • Part Number: KND8606B
  • Package: TO-252
  • Origin: KIA SEMICONDUCTORS

Technical Specifications

ParameterSymbolRatingsUnitsTest Conditions
Drain-Source VoltageVDSS60V
Drain Current (TC=25C)ID35A
Drain Current (TC=100C)ID22A
Drain Current PulsedIDM80A(Note 1)
Gate-Source VoltageVGSS20V
Single Pulsed Avalanche EnergyEAS450mJ(Note 2)
Avalanche CurrentIAR35A(Note 1)
Repetitive Avalanche EnergyEAR12mJ(Note 1)
Peak Diode Recovery dv/dtdv/dt4.5V/ns(Note 3)
Power Dissipation (TC=25C)PD60W
Derate above 25C0.8W/C
Operating and Storage Temperature RangeTJ, TSTG-55 to +175C
Maximum lead temperature for soldering purposes, 1/8" from case for 5 secondsTL300C
Thermal Resistance, Junction-to-CaseRJC2.5C/W
Thermal Resistance, Case-to-Sink (Typ.)RJSC/W
Thermal Resistance, Junction-to-AmbientRJA62.5C/W
Drain-Source Breakdown VoltageBVDSS60VVGS=0V,ID=250uA
Breakdown Voltage Temperature CoefficientBVDSS / TJ0.06V/ID=250uA, Referenced to 25C
Zero Gate Voltage Drain CurrentIDSS1uAVDS=60V,VGS=0V
Zero Gate Voltage Drain CurrentIDSS10uAVDS=48V,TC=150
Gate-Body Leakage Current, ForwardIGSSF100nAVGS=20V,VDS=0V
Gate-Body Leakage Current, ReverseIGSSR-100nAVGS=-20V,VDS=0V
Gate Threshold VoltageVGS(th)1.8VVDS=VGS,ID=250uA
Static Drain-Source On-ResistanceRDS(on)15mVGS=10V,ID=20A
Forward TransconductancegFS22SVDS=25V,ID=25A (Note 4)
Input CapacitanceCiss2800pFVDS=25V,VGS=0V, f=1.0MHz
Output CapacitanceCoss200pF
Reverse Transfer CapacitanceCrss100pF
Turn-On Delay Timetd(on)15nsVDD=30V,ID=25A, RG=25 (Note 4,5)
Turn-On Rise Timetr105ns
Turn-Off Delay Timetd(off)60ns
Turn-Off Fall Timetf65ns
Total Gate ChargeQg33nCVDS=48V,ID=25A, VGS=10V (Note 4,5)
Gate-Source ChargeQgs8.5nC
Gate-Drain ChargeQgd14nC
Maximum Continuous Drain-Source Diode Forward CurrentIS35A
Maximum Pulsed Drain-Source Diode Forward CurrentISM80A
Drain-Source Diode Forward VoltageVSD1.4VVGS=0V, IS=35A
Reverse Recovery Timetrr60nsVGS=0V,IS=35A, dIF/dt=100A/us (Note 4)
Reverse Recovery ChargeQrr80nC

2410121326_KIA-Semicon-Tech-KND8606B_C5156062.pdf

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