Compact MICROCHIP UPS840E3/TR13 Schottky rectifier offering 8 amp current rating and RoHS compliance

Key Attributes
Model Number: UPS840E3/TR13
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
150A
Reverse Leakage Current (Ir):
5mA@40V
Operating Junction Temperature Range:
-55℃~+125℃
Voltage - DC Reverse (Vr) (Max):
40V
Voltage - Forward(Vf@If):
450mV@8A
Current - Rectified:
8A
Mfr. Part #:
UPS840E3/TR13
Package:
SMD,6.6x4.3mm
Product Description

Product Overview

The UPS840e3 is a RoHS compliant, 40 V, 8 Amp Schottky rectifier in an exceptionally small surface mount Powermite 3 package. It offers a low profile (<1.1 mm) and small footprint (32 mm2), making it ideal for space-constrained applications. Its design features a full metallic bottom for efficient heat dissipation, resulting in lower junction temperatures, reduced leakage current, and power loss. The guard ring construction provides transient protection, and its silicon Schottky (hot carrier) rectifier minimizes reverse recovery time (trr) and oscillations, reducing the need for EMI filtering.

Product Attributes

  • Brand: Microsemi Corporation
  • Model: UPS840e3
  • Package Type: Powermite 3 Surface Mount
  • Certifications: RoHS compliant, Underwriters Laboratory Flammability classification 94V-0
  • Material: Molded epoxy package, Copper terminals with annealed matte-tin plating
  • Marking: Body marked with "S840" (dot indicates RoHS compliance)
  • Polarity: Two leads on side are internally connected together for anode and bottom side is the cathode.

Technical Specifications

ParameterSymbolValueUnitConditions
Working Peak Reverse VoltageVRWM40Volts
Maximum RMS VoltageVRMS28Volts
Maximum Peak Repetitive VoltageVRRM40Volts
Maximum Forward VoltageVF @ 3 A0.39Volts(Note 1)
Maximum Forward VoltageVF @ 8 A0.45Volts(Note 1)
Maximum Forward VoltageVF @ 10 A0.49Volts(Note 1)
Maximum Reverse CurrentIR @ VRWM0.5mAVRWM=40V
Voltage Rate of ChangedV/dt1000V/s
Storage TemperatureTSTG-55 to +150C
Junction TemperatureTJ-55 to +125C
Thermal Resistance Junction-to-AmbientRJA65C/WOn PCB with FR4 using 2 oz copper and recommended mounting pad size (Note 1)
Thermal Resistance Junction-to-CaseRJC2.5C/W
Forward Surge CurrentIFSM150AAt 8.3 ms single half-sine waveform superimposed on rated load (JEDEC method) (Note 2)
Total CapacitanceCT700pF@ 1 MHz and VR of 4.0 V
Average Rectified Output CurrentIO8.0A@ TC = 75 C
Solder Temperature260C@ 10 s

Notes:
(1) Pulse test, 1% duty cycle.
(2) At 8.3 ms single half-sine waveform superimposed on rated load (JEDEC method).


2411272108_MICROCHIP-UPS840E3-TR13_C3758317.pdf

Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.